Abstract: To provide more space for additional circuit elements (coils, capacitors) and/or to allow the accommodation of additional circuit elements required for shielding the circuits, the metallization regions are arranged one over the other in at least two metallization layers. The carrier body has a surface on which sintered metallization regions are arranged in a first metallization layer, said metallization regions carrying electronic components and/or being structured such that the metallization regions form resistors or coils. The metallization regions are covered, together with the components and/or the resistors or coils, by a ceramic plate, and optionally additional metallization regions are arranged in additional metallization layers on the ceramic plate and each metallization region is covered by a ceramic plate. Sintered metallization regions are arranged in a metallization layer for the purpose of accommodating circuit elements on the uppermost ceramic plate facing away from the cooling elements.

Abstract: A method for producing metal coatings on ceramic substrates for establishing electrical contact, and ceramic substrates having metal coatings. More particularly, the invention relates to the production of weldable and solderable metal coatings on ceramic substrates.

Abstract: To provide more space for additional circuit elements (coils, capacitors) and/or to allow the accommodation of additional circuit elements required for shielding the circuits, the metallization regions are arranged one over the other in at least two metallization layers. The carrier body has a surface on which sintered metallization regions are arranged in a first metallization layer, said metallization regions carrying electronic components and/or being structured such that the metallization regions form resistors or coils. The metallization regions are covered, together with the components and/or the resistors or coils, by a ceramic plate, and optionally additional metallization regions are arranged in additional metallization layers on the ceramic plate and each metallization region is covered by a ceramic plate. Sintered metallization regions are arranged in a metallization layer for the purpose of accommodating circuit elements on the uppermost ceramic plate facing away from the cooling elements.

Abstract: The invention relates to a ceramic printed circuit board comprising an upper side and a lower side, sintered metallization regions being arranged on the upper side, and the lower side being embodied as a cooling body. In order to improve the heat dissipation of components on the upper side of the printed circuit board, the lower side is also provided with sintered metallization regions to which a metal cooling body is soldered.

Abstract: Process for producing a ceramic circuit board with electrical conductor traces and contacting points on a side and with a through-hole contact by successively a) producing an AlN substrate and drilling holes at the locations for the vias, b) filling the holes with an adhesive paste containing copper, tungsten and/or molybdenum or alloys thereof, and c) single-pass overprinting with a second adhesive paste using a first screen-printing operation on a side of the ceramic substrate with the layout of the conductor traces and contact points, d) optionally, fully or partially repeating overprinting with the second adhesive paste, e) stoving the printed ceramic substrate in an oven with N2 while controlling oxygen at 0-50 ppm O2, f) overprinting using a second screen-printing process with a low-glass cover paste over the second adhesive paste, and g) stoving the printed ceramic substrate with N2 while keeping the oxygen content at 0-50 ppm O2.

Abstract: The invention relates to molded functional bodies made of highly thermally conductive materials, namely aluminum nitride, to a method for the production thereof by way of extrusion, and to the use thereof.

Abstract: A method for producing metal coatings on ceramic substrates for establishing electrical contact, and ceramic substrates having metal coatings. More particularly, the invention relates to the production of weldable and solderable metal coatings on ceramic substrates.

Abstract: In order to supply power and control the power supplied to an LED (43), in particular an LED (43) comprising a ceramic support element (4, 32), an LED driver circuit (17) is designed to regulate the supply current for the LED (43) in accordance with the temperature of the support element (4, 32).

Abstract: A ceramic substrate (1) with an upper side (4) and an under side (5) opposite to said upper side (4), wherein a metallization (2) is applied to the upper side (4), said metallization being connected in an electrically conducting manner to the electrical connecting elements of at least one LED (3). In order to permanently increase the reflection, according to the invention a layer (6) reflecting light towards the LED (3) or the LEDs (3) is arranged on the underside (5).

Abstract: The invention relates to a method for producing a substrate comprising embedded conductive metal structures or metallizations, in particular for use as printed circuit boards. The aim of the invention is to allow the buried metallization of three-dimensional, i.e. curved or angular, substrates in addition to the two-dimensional flat and level, i.e. plate-shaped, substrates. According to the invention, this is achieved in that trenches and/or recesses are dug into the substrate using laser technology, and the metal structures are then produced in the trenches and/or recesses.

Abstract: Process for producing a ceramic circuit board with electrical conductor traces and contacting points on a side and with a through-hole contact by successively a) producing an AlN substrate and drilling holes at the locations for the vias, b) filling the holes with an adhesive paste containing copper, tungsten and/or molybdenum or alloys thereof, and c) single-pass overprinting with a second adhesive paste using a first screen-printing operation on a side of the ceramic substrate with the layout of the conductor traces and contact points, d) optionally, fully or partially repeating overprinting with the second adhesive paste, e) stoving the printed ceramic substrate in an oven with N2 while controlling oxygen at 0-50 ppm O2, f) overprinting using a second screen-printing process with a low-glass cover paste over the second adhesive paste, and g) stoving the printed ceramic substrate with N2 while keeping the oxygen content at 0-50 ppm O2.

Abstract: The invention relates to an LED lamp comprising at least one LED as the luminaire, a ceramic base and a ceramic supporting body, arranged on the base and having a supporting surface for accommodating the LEDs, and further comprising a light-permeable lampshade which is fixed on the supporting body and put on the supporting surface, sintered metalized sections, which form a circuit board, being arranged on the supporting surface for the LEDs to be soldered to and optionally for applying a corresponding circuit thereto. In order for the light emitted by the LEDs to be influenced and guided by simple means, the lampshade has a cupola, dome or bonnet design and consists of glass or plastic.

Abstract: The invention relates to a ceramic printed circuit board comprising an upper side and a lower side, sintered metallization regions being arranged on the upper side, and the lower side being embodied as a cooling body. In order to improve the heat dissipation of components on the upper side of the printed circuit board, the lower side is also provided with sintered metallization regions to which a metal cooling body is soldered.

Abstract: In order to extend the life and reduce the fitting complexity involved, what is proposed is: the light-emitting unit comprises a plurality of individual identical cooling apparatus/light-emitting means modules (3), which are connected for form clusters (5), wherein each cooling apparatus/light-emitting means module (3) comprises a ceramic carrier body (1), which has, on one or more of its surfaces, sintered metallization regions (7), said metallization regions (9) forming a printed circuit board, to which one or more LEDs (2) is/are electrically conductively connected.

Abstract: Coil bodies having a ceramic core.

Abstract: Ceramic diode carriers (10) comprising a ceramic carrier body (2) integrally connected to ceramic cooling elements (7) dissipating heat, wherein sintered metallization regions (41) are disposed as conductors on the surface (3) of the carrier body (2). LEDs (13) can be fastened to the diode carrier (10), the electrical connections thereof being electrically connectable to the conductors. In order to produce luminous bodies from ceramic diode carriers (10), at least two identical ceramic diode carriers (10) are connected into an array.

Abstract: The invention relates to a method for joining two partners to be joined at defined joining points, one partner (1) being made of a ceramic material and the other partner being made of a metal or a ceramic material. The aim of the invention is to improve such a method in such a way as to make the same easy to use while creating a permanent joint. Said aim is achieved by arranging the partners (1) to be joined in such a way that the partners (1) are in contact with each other at the joining points, and directing a laser beam to one of the partners (1) at the joining points in such a way as to make the laser beam shoot through said partner and at least partially penetrate into the other partner (1).

Abstract: In order to supply power and control the power supplied to an LED (43), in particular an LED (43) comprising a ceramic support element (4, 32), an LED driver circuit (17) is designed to regulate the supply current for the LED (43) in accordance with the temperature of the support element (4, 32).

Abstract: Disclosed is an LED light comprising at least one LED (43) that is arranged on a ceramic support element (32) and is connected thereto in a thermally conducting manner, and an electronic driver (17) that is electrically connected to the LED (43) to supply power and control the power supplied to the LED (43). The driver (17) is connected in a thermally conducting manner to the support element (32) in order to improve the electric control function and performance of the LED (43) in the light.

Abstract: A lamp for receiving at least one light emitting diode as a light-emitting means, having a bottom part as a supporting element and for feeding the electric connecting wires to a mounting device carrying the at least one light emitting diode, and having a lamp shade. The mounting device is a separate mounting substrate having a breaking strength between 100 and 1,000 MPa and is arranged on the bottom of the device.