Abstract: A color image sensor has a plurality of pixels. On the pixels zero-order diffractive color filters (DCFs) (1) are arranged. Different zero-order DCFs (1), e.g., DCFs (1) transmitting red, green and blue light, respectively, are allocated to the pixels of the color image sensor. The use of DCFs (1) for color imaging devices brings better defined band-pass or notch filters than the presently used lacquers. The DCFs (1) are more stable with respect to time, temperature and any environmental aggression. The manufacture of the DCF pattern is simpler and cheaper than that of a conventional dye-filter pattern, since the different types of DCFs can be manufactured simultaneously.

Abstract: A semiconductor module having a base element, at least one insulation element arranged on the base element, and at least one semiconductor element arranged on the insulation element. The insulation element has a metal layer on one side and another metal layer on the opposite side. At least one of the metal layers is curved or has curved portions. As a result, it is possible to minimize excessive field increases in the edge zones and increase the dielectric strength of the semiconductor module.

Abstract: In a liquid cooling device (1) for a high-power semiconductor module (14), which contains a plurality of heat-generating submodules (8a-h) arranged next to one another on a cooling surface (3) and is fusion-bonded to the cooling surface (3), an improved load cycle resistance is achieved by the liquid cooling device (1) having a housing (2) which encloses a liquid space (4), through which a cooling liquid flows, and the upper side of which forms the cooling surface (3), and by the housing (2) of the liquid cooling device (1), at least in the region of the cooling surface (3), consisting of a metal-ceramic composite material, the coefficient of thermal expansion of which is adapted to the coefficient of thermal expansion of the ceramic substrates or of the power semiconductor devices of the submodules (8a-h) and, by additional means (11a-h; 12) for improving the heat transfer between the cooling surface (3) and the cooling liquid being provided in the liquid space (4) of the liquid cooling device (1).

Abstract: A power semiconductor module is specified in which a layer of foam is arranged under the housing cover in the housing. The foam not only enables mechanical support of the potting compound, so that the latter is prevented from becoming detached, but can also absorb a large pressure increase in the event of a short circuit by virtue of compression. In this way, a compensating volume is created without the housing being destroyed. The housing remains closed and no material is hurled into the surroundings.