Patents by Inventor Alfons Dehé

Alfons Dehé has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Single diaphragm transducer structure
    Patent number: 9448126
    Abstract: A transducer structure including a carrier with an opening and a suspended structure mounted on the carrier which extends at least partially over the opening in the carrier is disclosed. The transducer structure may further include configuring the suspended structure to provide an electrostatic field between the suspended structure and the carrier by changing a distance between the suspended structure and the carrier. Alternatively, the suspended structure may be configured to change the distance between the suspended structure and the carrier in response to an electrostatic force provided between the suspended structure and the carrier.
    Type: Grant
    Filed: March 6, 2014
    Date of Patent: September 20, 2016
    Assignee: Infineon Technologies AG
    Inventors: Alfons Dehe, Christoph Glacer
  • MEMS sensor structure for sensing pressure waves and a change in ambient pressure
    Patent number: 9438979
    Abstract: A sensor structure, including: a first diaphragm structure, an electrode element, and a second diaphragm structure arranged on an opposite side of the electrode element from the first diaphragm structure is disclosed. The sensor structure may also include a chamber formed by the first and second diaphragm structures, where the pressure in the chamber is lower than the pressure outside of the chamber. A method for forming the sensor structure is likewise disclosed.
    Type: Grant
    Filed: March 6, 2014
    Date of Patent: September 6, 2016
    Assignee: Infineon Technologies AG
    Inventor: Alfons Dehe
  • Sound Transducer with Interdigitated First and Second Sets of Comb Fingers
    Publication number: 20160234619
    Abstract: A sound transducer includes a substrate with a cavity with extending from a first surface of the substrate, a body at least partially covering the cavity and being connected to the substrate by at least one resilient hinge, a first set of comb fingers mounted to the substrate, and a second set of comb fingers mounted to the body. The first set of comb fingers and the second set of comb fingers are interdigitated and configured to create an electrostatic force driving the body in a direction perpendicular to the first surface of the substrate. The body and the at least one resilient hinge are configured for a resonant or a near-resonant excitation by the electrostatic force.
    Type: Application
    Filed: April 15, 2016
    Publication date: August 11, 2016
    Inventors: Shu-Ting Hsu, Alfons Dehe
  • MEMS device and method of making a MEMS device
    Patent number: 9409763
    Abstract: A MEMS device and a method of making a MEMS device are disclosed. In one embodiment a semiconductor device comprises a substrate, a moveable electrode and a counter electrode, wherein the moveable electrode and the counter electrode are mechanically connected to the substrate. The movable electrode is configured to stiffen an inner region of the movable membrane.
    Type: Grant
    Filed: April 4, 2012
    Date of Patent: August 9, 2016
    Assignee: Infineon Technologies AG
    Inventors: Alfons Dehe, Martin Wurzer, Christian Herzum
  • System and Method for an Integrated Transducer and Temperature Sensor
    Publication number: 20160221822
    Abstract: According to embodiment, a transducer includes a microfabricated element integrated on a single die and an interface IC coupled to the microfabricated element. The microfabricated element includes an acoustic transducer and a temperature sensor, and the interface IC is electrically coupled to the acoustic transducer and the temperature sensor.
    Type: Application
    Filed: February 3, 2015
    Publication date: August 4, 2016
    Inventors: Ulrich Krumbein, Alfons Dehe
  • Sound transducer with interdigitated first and second sets of comb fingers
    Patent number: 9402137
    Abstract: A sound transducer includes a substrate with a cavity with extending from a first surface of the substrate, a body at least partially covering the cavity and being connected to the substrate by at least one resilient hinge, a first set of comb fingers mounted to the substrate, and a second set of comb fingers mounted to the body. The first set of comb fingers and the second set of comb fingers are interdigitated and configured to create an electrostatic force driving the body in a direction perpendicular to the first surface of the substrate. The body and the at least one resilient hinge are configured for a resonant or a near-resonant excitation by the electrostatic force.
    Type: Grant
    Filed: November 14, 2011
    Date of Patent: July 26, 2016
    Assignee: Infineon Technologies AG
    Inventors: Shu-Ting Hsu, Alfons Dehe
  • MEMS device and method of manufacturing a MEMS device
    Patent number: 9402138
    Abstract: A method for manufacturing a MEMS device is disclosed. Moreover a MEMS device and a module including a MEMS device are disclosed. An embodiment includes a method for manufacturing MEMS devices includes forming a MEMS stack on a first main surface of a substrate, forming a polymer layer on a second main surface of the substrate and forming a first opening in the polymer layer and the substrate such that the first opening abuts the MEMS stack.
    Type: Grant
    Filed: October 12, 2012
    Date of Patent: July 26, 2016
    Assignee: Infineon Technologies AG
    Inventors: Alfons Dehe, Stephan Pindl, Bernhard Knott, Carsten Ahrens
  • SENSOR STRUCTURE FOR SENSING PRESSURE WAVES AND AMBIENT PRESSURE
    Publication number: 20160200567
    Abstract: In various embodiments, a sensor structure is provided. The sensor structure may include a first conductive layer; an electrode element; and a second conductive layer arranged on an opposite side of the electrode element from the first conductive layer. The first conductive layer and the second conductive layer may form a chamber. The pressure in the chamber may be lower than the pressure outside of the chamber.
    Type: Application
    Filed: March 23, 2016
    Publication date: July 14, 2016
    Inventors: Alfons DEHE, Roland HELM
  • Plate, transducer and methods for making and operating a transducer
    Patent number: 9362853
    Abstract: A plate, a transducer, a method for making a transducer, and a method for operating a transducer are disclosed. An embodiment comprises a plate comprising a first material layer comprising a first stress, a second material layer arranged beneath the first material layer, the second material layer comprising a second stress, an opening arranged in the first material layer and the second material layer, and an extension extending into opening, wherein the extension comprises a portion of the first material layer and a portion of the second material layer, and wherein the extension is curved away from a top surface of the plate based on a difference in the first stress and the second stress.
    Type: Grant
    Filed: May 24, 2013
    Date of Patent: June 7, 2016
    Assignee: Infineon Technologies AG
    Inventor: Alfons Dehe
  • Sensor structure for sensing pressure waves and ambient pressure
    Patent number: 9309105
    Abstract: In various embodiments, a sensor structure is provided. The sensor structure may include a first conductive layer; an electrode element; and a second conductive layer arranged on an opposite side of the electrode element from the first conductive layer. The first conductive layer and the second conductive layer may form a chamber. The pressure in the chamber may be lower than the pressure outside of the chamber.
    Type: Grant
    Filed: March 6, 2014
    Date of Patent: April 12, 2016
    Assignee: INFINEON TECHNOLOGIES AG
    Inventors: Alfons Dehe, Roland Helm
  • MEMS Device and Method of Making a MEMS Device
    Publication number: 20160096726
    Abstract: A MEMS device and a method of making a MEMS device are disclosed. In one embodiment a semiconductor device comprises a substrate, a moveable electrode and a counter electrode, wherein the moveable electrode and the counter electrode are mechanically connected to the substrate. The movable electrode is configured to stiffen an inner region of the movable membrane.
    Type: Application
    Filed: December 16, 2015
    Publication date: April 7, 2016
    Inventors: Alfons Dehe, Martin Wurzer, Christian Herzum
  • Plate, Transducer and Methods for Making and Operating a Transducer
    Publication number: 20160094155
    Abstract: A plate, a transducer, a method for making a transducer, and a method for operating a transducer are disclosed. An embodiment comprises a plate comprising a first material layer comprising a first stress, a second material layer arranged beneath the first material layer, the second material layer comprising a second stress, an opening arranged in the first material layer and the second material layer, and an extension extending into opening, wherein the extension comprises a portion of the first material layer and a portion of the second material layer, and wherein the extension is curved away from a top surface of the plate based on a difference in the first stress and the second stress.
    Type: Application
    Filed: December 8, 2015
    Publication date: March 31, 2016
    Inventor: Alfons Dehe
  • MEMS device and method of making a MEMS device
    Patent number: 9284184
    Abstract: A MEMS device and a method of making a MEMS device are disclosed. In one embodiment a semiconductor device comprises a substrate, a moveable electrode and a counter electrode, wherein the moveable electrode and the counter electrode are mechanically connected to the substrate. The movable electrode is configured to stiffen an inner region of the movable membrane.
    Type: Grant
    Filed: April 4, 2012
    Date of Patent: March 15, 2016
    Assignee: Infineon Technologies AG
    Inventors: Alfons Dehe, Martin Wurzer, Christian Herzum
  • MEMS Microphone with Low Pressure Region between Diaphragm and Counter Electrode
    Publication number: 20160066099
    Abstract: A MEMS microphone includes a first diaphragm element, a counter electrode element, and a low pressure region between the first diaphragm element and the counter electrode element. The low pressure region has a pressure less than an ambient pressure.
    Type: Application
    Filed: November 6, 2015
    Publication date: March 3, 2016
    Inventors: Alfons Dehe, Andreas Froemel
  • LOW PROFILE TRANSDUCER MODULE
    Publication number: 20160043664
    Abstract: A transducer structure is disclosed. The transducer structure may include a substrate with a MEMS structure located on a first side of the substrate and a lid coupled to the first side of the substrate and covering the MEMS structure. The substrate may include an electric contact which is laterally displaced from the lid on the first side of the substrate and electrically coupled to the MEMS structure.
    Type: Application
    Filed: August 6, 2014
    Publication date: February 11, 2016
    Inventors: Horst Theuss, Alfons Dehe
  • SENSOR MODULE AND SEMICONDUCTOR CHIP
    Publication number: 20160016787
    Abstract: A sensor module and semiconductor chip. One embodiment provides a carrier. A semiconductor chip includes a first recess and a second recess and a main surface of the semiconductor chip. The semiconductor chip is mounted to the carrier such that the first recess forms a first cavity with the carrier and the second recess forms a second cavity with the carrier. The first cavity is in fluid connection with the second cavity.
    Type: Application
    Filed: July 28, 2015
    Publication date: January 21, 2016
    Applicant: INFINEON TECHNOLOGIES AG
    Inventors: Marc Fueldner, Alfons Dehe
  • Micromechanical Digital Loudspeaker
    Publication number: 20160014538
    Abstract: A digital loudspeaker includes a substrate, a first stator fixed with respect to the substrate, a second stator fixed with respect to the substrate and spaced at a distance from the first stator, and a membrane between the first stator and the second stator. The membrane is displaceable between a first position in which the membrane mechanically contacts the first stator and a second position in which the membrane mechanically contacts the second stator. The first stator and the second stator are arranged to electrostatically move the membrane from a rest position spaced apart from the first position and the second position to the first position and the second position, respectively.
    Type: Application
    Filed: September 24, 2015
    Publication date: January 14, 2016
    Inventor: Alfons Dehe
  • Methods of manufacturing a MEMS device having a backplate with elongated protrusions
    Patent number: 9227843
    Abstract: MEMS devices with a rigid backplate and a method of making a MEMS device with a rigid backplate are disclosed. In one embodiment, a device includes a substrate and a backplate supported by the substrate. The backplate includes elongated protrusions.
    Type: Grant
    Filed: October 10, 2014
    Date of Patent: January 5, 2016
    Assignee: Infineon Technologies AG
    Inventor: Alfons Dehe
  • Semiconductor Devices and Methods of Forming Thereof
    Publication number: 20150321901
    Abstract: In accordance with an embodiment of the present invention, a method of forming a semiconductor device includes forming a sacrificial layer over a first surface of a workpiece having the first surface and an opposite second surface. A membrane is formed over the sacrificial layer. A through hole is etched through the workpiece from the second surface to expose a surface of the sacrificial layer. At least a portion of the sacrificial layer is removed from the second surface to form a cavity under the membrane. The cavity is aligned with the membrane.
    Type: Application
    Filed: July 13, 2015
    Publication date: November 12, 2015
    Inventors: Alfons Dehe, Carsten Ahrens, Stefan Barzen, Wolfgang Friza
  • MEMS microphone with low pressure region between diaphragm and counter electrode
    Patent number: 9181080
    Abstract: A MEMS microphone includes a first diaphragm element, a counter electrode element, and a low pressure region between the first diaphragm element and the counter electrode element. The low pressure region has a pressure less than an ambient pressure.
    Type: Grant
    Filed: June 28, 2013
    Date of Patent: November 10, 2015
    Assignee: Infineon Technologies AG
    Inventors: Alfons Dehe, Andreas Froemel