Patents by Inventor Alfons Dehe

Alfons Dehe has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Micro-electro-mechanical system devices
    Patent number: 9565488
    Abstract: In various embodiments, a micro-electro-mechanical system device is provided. The micro-electro-mechanical system device may include a carrier, a particle filter structure coupled to the carrier, the particle filter structure comprising a grid, wherein the grid comprises a plurality of grid elements, each grid element comprising at least one through hole, and a micro-electro-mechanical system structure disposed on a side of the particle filter structure opposite the carrier. A height of the plurality of grid elements is greater than a width of the corresponding grid elements.
    Type: Grant
    Filed: May 20, 2015
    Date of Patent: February 7, 2017
    Assignee: INFINEON TECHNOLOGIES AG
    Inventors: Wolfgang Friza, Alfons Dehe
  • Sound Transducer Structure and Method for Manufacturing a Sound Transducer Structure
    Publication number: 20170034634
    Abstract: A sound transducer structure includes a membrane and a counter electrode. The membrane includes a first main surface in a sound transducing region made of a membrane material, and an edge region. The counter electrode includes a second main surface arranged in parallel to the first main surface of the membrane on a side of a free volume opposite the first main surface of the membrane. A plurality of elevations extend in the sound transducing region from the second main surface of the counter electrode into the free volume. The membrane and the counter electrode are arranged to provide a capacity therebetween. The membrane comprises a corrugation groove extending in the sound transducing region from the first main surface of the membrane into the free volume.
    Type: Application
    Filed: October 11, 2016
    Publication date: February 2, 2017
    Inventors: Alfons Dehe, Stefan Barzen, Marc Fueldner
  • System and method for a MEMS transducer
    Patent number: 9540226
    Abstract: According to an embodiment, a microelectromechanical systems (MEMS) transducer includes a first electrode, a second electrode fixed to an anchor at a perimeter of the second electrode, and a mechanical support separate from the anchor at the perimeter of the second electrode and mechanically connected to the first electrode and the second electrode. The mechanical support is fixed to a portion of the second electrode such that, during operation, a maximum deflection of the second electrode occurs between the mechanical structure and the perimeter of the second electrode.
    Type: Grant
    Filed: May 20, 2015
    Date of Patent: January 10, 2017
    Assignee: Infineon Technologies AG
    Inventors: Wolfgang Klein, Martin Wurzer, Stefan Barzen, Alfons Dehe
  • Sensor module and semiconductor chip
    Patent number: 9533874
    Abstract: A sensor module and semiconductor chip. One embodiment provides a carrier. A semiconductor chip includes a first recess and a second recess and a main surface of the semiconductor chip. The semiconductor chip is mounted to the carrier such that the first recess forms a first cavity with the carrier and the second recess forms a second cavity with the carrier. The first cavity is in fluid connection with the second cavity.
    Type: Grant
    Filed: July 28, 2015
    Date of Patent: January 3, 2017
    Assignee: Infineon Technologies AG
    Inventors: Marc Fueldner, Alfons Dehe
  • System and Method for a MEMS Transducer
    Publication number: 20160377569
    Abstract: According to an embodiment, a microelectromechanical systems (MEMS) transducer includes a substrate with a first cavity that passes through the substrate from a backside of the substrate. The MEMS transducer also includes a perforated first electrode plate overlying the first cavity on a topside of the substrate, a second electrode plate overlying the first cavity on the topside of the substrate and spaced apart from the perforated first electrode plate by a spacing region, and a gas sensitive material in the spacing region between the perforated first electrode plate and the second electrode plate. The gas sensitive material has an electrical property that is dependent on a concentration of a target gas.
    Type: Application
    Filed: June 24, 2015
    Publication date: December 29, 2016
    Inventors: Vijaye Kumar Rajaraman, Yonsuang Arnanthigo, Alfons Dehe, Stefan Kolb
  • Photoacoustic gas sensor device and a method for analyzing gas
    Patent number: 9513261
    Abstract: A photoacoustic gas sensor device for analyzing gas includes an emitter module and a pressure-sensitive module. The emitter module is arranged on a carrier substrate and emits light pulses. The pressure-sensitive module is arranged on the carrier substrate within a reference gas volume. The reference gas volume is separated from a volume intended to be filled with a gas to be analyzed. Further, the pressure-sensitive module generates a sensor signal indicating information on an acoustic wave caused by light pulses emitted by the emitter module interacting with a reference gas within the reference gas volume. Additionally, the emitter module is arranged so that light pulses emitted by the emitter module reach the reference gas volume after crossing the volume intended to be filled with the gas to be analyzed.
    Type: Grant
    Filed: October 14, 2013
    Date of Patent: December 6, 2016
    Assignee: Infineon Technologies AG
    Inventors: Alfons Dehe, Stefan Kolb, Horst Theuss
  • MEMS acoustic transducer, MEMS microphone, MEMS microspeaker, array of speakers and method for manufacturing an acoustic transducer
    Patent number: 9516428
    Abstract: A MEMS acoustic transducer includes a substrate having a cavity therethrough, and a conductive back plate unit including a plurality of conductive perforated back plate portions which extend over the substrate cavity. A dielectric spacer arranged on the back plate unit between adjacent conductive perforated back plate portions, and one or more graphene membranes are supported by the dielectric spacer and extend over the conductive perforated back plate portions.
    Type: Grant
    Filed: March 14, 2013
    Date of Patent: December 6, 2016
    Assignee: Infineon Technologies AG
    Inventors: Alfons Dehe, Guenther Ruhl
  • Double diaphragm MEMS microphone without a backplate element
    Patent number: 9510107
    Abstract: A sensor structure may include a first suspended structure and a second suspended structure disposed from the first suspended structure to form a volume. The first suspended structure and the second suspended structure may be arranged relative to each other such that a received pressure wave entering the volume between the first suspended structure and the second suspended structure generates a displacement of the first suspended structure to a first direction and a displacement of the second suspended structure to a second direction different from the first direction and the displacement may generate a measurable signal.
    Type: Grant
    Filed: March 6, 2014
    Date of Patent: November 29, 2016
    Assignee: INFINEON TECHNOLOGIES AG
    Inventors: Alfons Dehe, Marina Fekry Megally Bastarous
  • SINGLE DIAPHRAGM TRANSDUCER STRUCTURE
    Publication number: 20160341619
    Abstract: A transducer structure including a carrier with an opening and a suspended structure mounted on the carrier which extends at least partially over the opening in the carrier is disclosed. The transducer structure may further include configuring the suspended structure to provide an electrostatic field between the suspended structure and the carrier by changing a distance between the suspended structure and the carrier. Alternatively, the suspended structure may be configured to change the distance between the suspended structure and the carrier in response to an electrostatic force provided between the suspended structure and the carrier.
    Type: Application
    Filed: August 2, 2016
    Publication date: November 24, 2016
    Inventors: ALFONS DEHE, CHRISTOPH GLACER
  • SYSTEM AND METHOD FOR A MEMS TRANSDUCER
    Publication number: 20160340173
    Abstract: According to an embodiment, a microelectromechanical systems (MEMS) transducer includes a first electrode, a second electrode fixed to an anchor at a perimeter of the second electrode, and a mechanical support separate from the anchor at the perimeter of the second electrode and mechanically connected to the first electrode and the second electrode. The mechanical support is fixed to a portion of the second electrode such that, during operation, a maximum deflection of the second electrode occurs between the mechanical structure and the perimeter of the second electrode.
    Type: Application
    Filed: May 20, 2015
    Publication date: November 24, 2016
    Inventors: Wolfgang Klein, Martin Wurzer, Stefan Barzen, Alfons Dehe
  • MICRO-ELECTRO-MECHANICAL SYSTEM DEVICES
    Publication number: 20160345084
    Abstract: In various embodiments, a micro-electro-mechanical system device is provided. The micro-electro-mechanical system device may include a carrier, a particle filter structure coupled to the carrier, the particle filter structure comprising a grid, wherein the grid comprises a plurality of grid elements, each grid element comprising at least one through hole, and a micro-electro-mechanical system structure disposed on a side of the particle filter structure opposite the carrier. A height of the plurality of grid elements is greater than a width of the corresponding grid elements.
    Type: Application
    Filed: May 20, 2015
    Publication date: November 24, 2016
    Inventors: Wolfgang FRIZA, Alfons DEHE
  • Dynamic pressure sensor
    Patent number: 9494477
    Abstract: According to various embodiments, a dynamic pressure sensor includes a substrate, a reference volume formed in the substrate, a deflectable membrane sealing the reference volume, a deflection sensing element coupled to the membrane and configured to measure a deflection of the membrane, and a ventilation hole configured to equalize an absolute pressure inside the reference volume with an absolute ambient pressure outside the reference volume.
    Type: Grant
    Filed: March 31, 2014
    Date of Patent: November 15, 2016
    Assignee: Infineon Technologies AG
    Inventors: Andreas Wiesbauer, Alfons Dehe
  • Comb MEMS device and method of making a comb MEMS device
    Patent number: 9487386
    Abstract: A MEMS device and a method to manufacture a MEMS device are disclosed. An embodiment includes forming trenches in a first main surface of a substrate, forming conductive fingers by forming a conductive material in the trenches and forming an opening from a second main surface of the substrate thereby exposing the conductive fingers, the second main surface opposite the first main surface.
    Type: Grant
    Filed: January 16, 2013
    Date of Patent: November 8, 2016
    Assignee: Infineon Technologies AG
    Inventor: Alfons Dehe
  • MEMS DEVICE AND METHOD OF MANUFACTURING A MEMS DEVICE
    Publication number: 20160318759
    Abstract: A method for manufacturing a MEMS device is disclosed. Moreover a MEMS device and a module including a MEMS device are disclosed. An embodiment includes a method for manufacturing MEMS devices includes forming a MEMS stack on a first main surface of a substrate, forming a polymer layer on a second main surface of the substrate and forming a first opening in the polymer layer and the substrate such that the first opening abuts the MEMS stack.
    Type: Application
    Filed: July 11, 2016
    Publication date: November 3, 2016
    Inventors: Alfons Dehe, Stephan Pindl, Bernhard Knott, Carsten Ahrens
  • Chip Package and a Method of Producing the Same
    Publication number: 20160311679
    Abstract: A method of producing a chip package is described. A plurality of chips is provided on a first wafer. Each chip has a cavity which opens to a first main face of the chip. The cavities are filled or covered temporarily. The chips are then singulated. The singulated chips are embedded in an encapsulation material, and then the cavities are re-exposed.
    Type: Application
    Filed: April 26, 2016
    Publication date: October 27, 2016
    Inventors: Dominic Maier, Alfons Dehe, Thomas Kilger, Markus Menath, Franz Xaver Muehlbauer, Daniel Porwol, Juergen Wagner
  • Photo-Acoustic Gas Sensor Module Having Light Emitter and Detector Units
    Publication number: 20160313288
    Abstract: A photo-acoustic gas sensor includes a light emitter unit having a light emitter configured to emit a beam of light pulses with a predetermined repetition frequency and a wavelength corresponding to an absorption band of a gas to be sensed, and a detector unit having a microphone. The light emitter unit is arranged so that the beam of light pulses traverses an area configured to accommodate the gas. The detector unit is arranged so that the microphone can receive a signal oscillating with the repetition frequency.
    Type: Application
    Filed: April 22, 2016
    Publication date: October 27, 2016
    Inventors: Horst Theuss, Gottfried Beer, Sebastian Beer, Alfons Dehe, Franz Jost, Stefan Kolb, Guenther Ruhl, Rainer Markus Schaller
  • Semiconductor devices and methods of forming thereof
    Patent number: 9458009
    Abstract: In accordance with an embodiment of the present invention, a method of forming a semiconductor device includes forming a sacrificial layer over a first surface of a workpiece having the first surface and an opposite second surface. A membrane is formed over the sacrificial layer. A through hole is etched through the workpiece from the second surface to expose a surface of the sacrificial layer. At least a portion of the sacrificial layer is removed from the second surface to form a cavity under the membrane. The cavity is aligned with the membrane.
    Type: Grant
    Filed: July 13, 2015
    Date of Patent: October 4, 2016
    Assignee: Infineon Technologies AG
    Inventors: Alfons Dehe, Carsten Ahrens, Stefan Barzen, Wolfgang Friza
  • GAS SENSOR
    Publication number: 20160282259
    Abstract: Shown is a gas sensor including a sensor element, a measurement chamber and an emitter element. The sensor element has a MEMS membrane which is arranged in a first substrate region. Furthermore, the measurement chamber is embodied to receive a measurement gas.
    Type: Application
    Filed: March 24, 2016
    Publication date: September 29, 2016
    Inventors: Stefan Kolb, Alfons Dehe, Jochen Huber, Franz Jost, Horst Theuss, Wilhelm Wiedmeier, Juergen Woellenstein
  • Single diaphragm transducer structure
    Patent number: 9448126
    Abstract: A transducer structure including a carrier with an opening and a suspended structure mounted on the carrier which extends at least partially over the opening in the carrier is disclosed. The transducer structure may further include configuring the suspended structure to provide an electrostatic field between the suspended structure and the carrier by changing a distance between the suspended structure and the carrier. Alternatively, the suspended structure may be configured to change the distance between the suspended structure and the carrier in response to an electrostatic force provided between the suspended structure and the carrier.
    Type: Grant
    Filed: March 6, 2014
    Date of Patent: September 20, 2016
    Assignee: Infineon Technologies AG
    Inventors: Alfons Dehe, Christoph Glacer
  • MEMS sensor structure for sensing pressure waves and a change in ambient pressure
    Patent number: 9438979
    Abstract: A sensor structure, including: a first diaphragm structure, an electrode element, and a second diaphragm structure arranged on an opposite side of the electrode element from the first diaphragm structure is disclosed. The sensor structure may also include a chamber formed by the first and second diaphragm structures, where the pressure in the chamber is lower than the pressure outside of the chamber. A method for forming the sensor structure is likewise disclosed.
    Type: Grant
    Filed: March 6, 2014
    Date of Patent: September 6, 2016
    Assignee: Infineon Technologies AG
    Inventor: Alfons Dehe