Patents by Inventor Ali Salem

Ali Salem has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20100241549
    Abstract: Embodiments of a system, a method, and a computer-program product (e.g., software) for aggregating an energy service from a number of participants for use by a power-system operator is described. This aggregation may be performed by an aggregator, which is between the participants and the power-system operator. In particular, the aggregator may use an embedded economic mechanism to calculate a price that matches supply (or cutback) of power and/or load from the participants with a desired supply of the power-system operator. Because the aggregator typically does not know the participants' exact propensity to respond as a function of price (supply function), the aggregator calculates the purchase price using one or more iterations in which an initial probe price is provided to the participants, and the participants respond with supply-function approximations that are valid in proximity to the current probe price.
    Type: Application
    Filed: March 17, 2009
    Publication date: September 23, 2010
    Applicant: PALO ALTO RESEARCH CENTER INCORPORATED
    Inventors: Anthony Papavasiliou, Haitham Ali Salem Hindi, Daniel H. Greene
  • Patent number: 7663235
    Abstract: According to one exemplary embodiment, a semiconductor die includes at least one pad ring situated on an active surface of the semiconductor die, where the at least one pad ring includes a number of pads. The semiconductor die further includes a number of bumps including at least one shared bump. The at least one shared bump is shared by at least two pads, thereby causing the number of bumps to be fewer than the number of pads. The at least two pads can be at least two ground pads, at least two power pads, or at least two reference voltage pads.
    Type: Grant
    Filed: January 18, 2007
    Date of Patent: February 16, 2010
    Assignee: Broadcom Corporation
    Inventors: Fang Lu, Ali Salem
  • Publication number: 20080122080
    Abstract: According to one exemplary embodiment, a semiconductor die includes at least one pad ring situated on an active surface of the semiconductor die, where the at least one pad ring includes a number of pads. The semiconductor die further includes a number of bumps including at least one shared bump. The at least one shared bump is shared by at least two pads, thereby causing the number of bumps to be fewer than the number of pads. The at least two pads can be at least two ground pads, at least two power pads, or at least two reference voltage pads.
    Type: Application
    Filed: January 18, 2007
    Publication date: May 29, 2008
    Inventors: Fang Lu, Ali Salem
  • Publication number: 20030118597
    Abstract: The traditional treatment for Rheumatoid Arthritis relies on a course of synthetic drugs, which range from the use of gold salts to anti-inflammatory drugs including both steroids and non-steroids. These drugs specially the steroids can affect adrenal and pituitary glands & cause impotence, edema, poor wound healing, reduce neurological response and cardiac irregularities.
    Type: Application
    Filed: October 11, 2002
    Publication date: June 26, 2003
    Inventor: Ali Salem El Abbadi
  • Patent number: 6213987
    Abstract: A guide of the device is engageable with a hypodermic syringe barrel for secure placement thereon. A slide carried by the guide includes a shroud extensible from a stowed position adjacent the barrel forward over the end of a used syringe needle. The guide and an elongate slide therein embody locking means retaning the slide in an extended position after syringe use. A rib on the slide is provided at one end with a finger contactible surface for convenient slide positioning. The guide includes inwardly turned flanges to further support the slide against lateral displacement.
    Type: Grant
    Filed: August 2, 1999
    Date of Patent: April 10, 2001
    Inventors: Michael N. Hirsch, Jack P. Rosoff, Ali Salem
  • Patent number: 6098905
    Abstract: The present invention relates to a method for producing an atta flour, which is typically used to produce Asian breads such as chapati and roti. The atta flour method includes passing an amount of wheat through a device designed to crack the wheat so as to produce an amount of cracked wheat, followed by passing the cracked wheat through at least two smooth rolls designed to grind the cracked wheat into flour, with the smooth roll importantly grinding the wheat to a smaller particle size and shearing the wheat to cause starch damage in the finished atta flour. The atta flour will have an amount of starch damage equal to between about 13% and about 18% and an amount of ash equal to at least 1%.
    Type: Grant
    Filed: August 11, 1998
    Date of Patent: August 8, 2000
    Assignee: ConAgra, Inc.
    Inventors: Ali Salem, Sarath K. Katta, Sambasiva R. Chigurupati