Abstract: A system and method for performing a test for characterizing high frequency operation of PCB boards. More particularly, a system and methodology is provided to implement a time-domain short pulse propagation (SPP) technique on the production line, on large, multi-layer, product-level PCB boards, for large volume testing, by people who are not familiar with advanced, delicate, measurement techniques, who need robust test facilities, and cannot afford the time or expense of other lab-type approaches.

Abstract: An integrated circuit chip has new Frequency dependent RLC extraction and modeling providing on chip integrity and noise verification and the extraction and modeling employs: A) 2D scan line algorithm for the collection of adjacent signal and power conductor coordinates; B) In core pair-wise frequency Dependent RL extraction; C) In core equivalent circuit synthesis; D) caching and partitioning RL extraction techniques for run time efficiency; and E) Techniques for synthesizing stable circuits to represent frequency dependent RL circuits for non-mono tonic R12.

Abstract: A system and method for performing a test for characterizing high frequency operation of PCB boards. More particularly, a system and methodology is provided to implement a time-domain short pulse propagation (SPP) technique on the production line, on large, multi-layer, product-level PCB boards, for large volume testing, by people who are not familiar with advanced, delicate, measurement techniques, who need robust test facilities, and cannot afford the time or expense of other lab-type approaches.

Abstract: A method and apparatus for thermal modeling of on-chip interconnects using electromagnetic tools to determine a temperature profile across the interconnect structure and the temperature at each node of an equivalent thermal circuit derived from an electrical model.

Abstract: A method, computer program and system for the optimization of semiconductor process parameters given a pre-specified set of targets and constraints on electrical performance metrics are disclosed. Semiconductor process engineers who are not expert in the art of electrical analysis or mathematical optimization can readily use the method of this invention in optimizing semiconductor process parameters. Accommodates the differences in design styles, metal layer routing, and electrical metrics using priority schedules that are easy to input and understand. Enables the exploration of the process parameter space using primitive process tolerances and accurate electrical information provided by field solvers and circuit analysis programs.

Abstract: Techniques are disclosed for determination of parameter variability for one or more given interconnects of a plurality of interconnects in a simulated semiconductor circuit. The simulated semiconductor circuit is defined at least in part by a plurality of input parameters. From a distribution of first values of a given input parameter, a plurality of the first values are determined to use when calculating a corresponding plurality of second values for each of one or more output parameters. By using at least the determined plurality of first values for the given input parameter and selected values for other input parameters in the plurality of input parameters, the corresponding plurality of second values are calculated for each of the one or more output parameters. The one or more output parameters correspond to the one or more given interconnects. Each of the second values corresponds to one of the determined plurality of first values.

Abstract: An integrated circuit chip has new Frequency dependent RLC extraction and modeling providing on chip integrity and noise verification and the extraction and modeling employs: A) 2D scan line algorithm for the collection of adjacent signal and power conductor coordinates; B) In core pair-wise frequency Dependent RL extraction; C) In core equivalent circuit synthesis; D) caching and partitioning RL extraction techniques for run time efficiency; and E) Techniques for synthesizing stable circuits to represent frequency dependent RL circuits for non-mono tonic R12.

Abstract: New Frequency dependent RLC extraction and modeling for on chip integrity and noise verification employs: A) 2D scan line algorithm for the collection of adjacent signal and power conductor coordinates; B) In core pair-wise frequency Dependent RL extraction; C) In core equivalent circuit synthesis; D) caching and partitioning RL extraction techniques for run time efficiency; and E) Techniques for synthesizing stable circuits to represent frequency dependent RL circuits for non-mono tonic R12.

Abstract: A computer aided design (CAD) system. A template generation engine generates templates from interconnect configuration files. A field solver generates high frequency passive element relationships from the templates. A circuit builder generates circuit description files from device technology models and from high frequency passive element relationships. Parameterized circuit description models may be generated for large range of sensitivity analyses. A simulator simulates circuit responses for transmission line models from the circuit description files. Interconnect configuration files may be generated by a geometry and material definition module that receives process description data from a designer.

Abstract: Techniques are disclosed for determination of parameter variability for one or more given interconnects of a plurality of interconnects in a simulated semiconductor circuit. The simulated semiconductor circuit is defined at least in part by a plurality of input parameters. From a distribution of first values of a given input parameter, a plurality of the first values are determined to use when calculating a corresponding plurality of second values for each of one or more output parameters. By using at least the determined plurality of first values for the given input parameter and selected values for other input parameters in the plurality of input parameters, the corresponding plurality of second values are calculated for each of the one or more output parameters. The one or more output parameters correspond to the one or more given interconnects. Each of the second values corresponds to one of the determined plurality of first values.

Abstract: A system and method for analyzing a circuit with transmission lines includes determining which sources influence each of a plurality of transmission lines, based on coupling factors. Transmission line parameters are computed based on the sources, which influence each transmission line. A transient response or frequency response is analyzed for each transmission line by segmenting each line to perform an analysis on that line. The step of analyzing is repeated using waveforms determined in a previous iteration until convergence to a resultant waveform has occurred.

Abstract: The present invention relates to a method for analyzing the noise prediction within one or more electrical circuits, wherein the electrical circuits have a power mesh grid distribution system that feeds power levels to the electrical circuits that are connected by signal wires. After identifying a driver and receiver electrical circuit to be analyzed, a power block is generated that is associated with the driver and receiver electrical circuit by partitioning an area of a power mesh grid distribution system into a power block that can be modeled with lossy transmission line techniques. Next, signal wires situated between the driver and receiver electrical circuits are partitioned into signal blocks that can be modeled with lossy transmission line techniques. Lastly, the power blocks and signal blocks associated with the electrical circuits are analyzed in order to predict the noise performance within the electrical circuits.

Abstract: The present invention relates to a method for analyzing the noise prediction within one or more electrical circuits, wherein the electrical circuits have a power mesh grid distribution system that feeds power levels to the electrical circuits that are connected by signal wires. After identifying a driver and receiver electrical circuit to be analyzed, a power block is generated that is associated with the driver and receiver electrical circuit by partitioning an area of a power mesh grid distribution system into a power block that can be modeled with lossy transmission line techniques. Next, signal wires situated between the driver and receiver electrical circuits are partitioned into signal blocks that can be modeled with lossy transmission line techniques. Lastly, the power blocks and signal blocks associated with the electrical circuits are analyzed in order to predict the noise performance within the electrical circuits.

Abstract: A system and method for analyzing a circuit with transmission lines includes determining which sources influence each of a plurality of transmission lines, based on coupling factors. Transmission line parameters are computed based on the sources, which influence each transmission line. A transient response or frequency response is analyzed for each transmission line by segmenting each line to perform an analysis on that line. The step of analyzing is repeated using waveforms determined in a previous iteration until convergence to a resultant waveform has occurred.

Abstract: A computer aided design (CAD) system. A template generation engine generates templates from interconnect configuration files. A field solver generates high frequency passive element relationships from the templates. A circuit builder generates circuit description files from device technology models and from high frequency passive element relationships. Parameterized circuit description models may be generated for large range of sensitivity analyses. A simulator simulates circuit responses for transmission line models from the circuit description files. Interconnect configuration files may be generated by a geometry and material definition module that receives process description data from a designer.

Abstract: New Frequency dependent RLC extraction and modeling for on chip integrity and noise verification employs:

Abstract: Deterministic evaluation of coupling noise voltage is a function of many physical and electrical parameters such as wiring level, widths, spacing, net topologies, drv impedance and slew rates. This evaluation requires electrical modeling and subsequent circuit simulation to assess the sensitivities of these parameters. These sensitivities can be categorized as coupling guidelines that can be directly linked through extracted physical design data. This invention discloses the development and implementation of a technique for using a coupling guideline table early in the design of an integrated circuit when all the parameters generally required for coupling noise voltage calculations are not available.

Abstract: A method for reducing the computation time and improving the productivity in designing high-performance microprocessor chips that have no failures—due to crosstalk noise. The technique allows a very fast calculation of tables of frequency-dependent circuit parameters needed for accurate crosstalk prediction on lossy on-chip interconnections. These tables of parameters are the basis for CAD tools that perform crosstalk checking on >10K critical nets on typical microprocessor chips. A fast table generation allows for rapid incorporation of design or processing changes and transition to more advanced technologies.

Abstract: A method and system for reducing the computation complexity and improving accuracy of delay and crosstalk calculation in transmission-lines with frequency-dependent losses. An analysis tool based on restricted coupled-line topologies, simple two-dimensional to three-dimensional RLC matrix conversion, and use of prestored synthesized circuits that accurately capture frequency-dependent loss effects. The CAD tool can handle frequency-dependent resistive and inductive effects for coupled-interconnections on large microprocessor chips with >10K of critical nets. This is done in an interactive manner during the design cycle and allows first path fast product design.

Abstract: An exemplary embodiment of the invention is a method of characterizing capacitances of a plurality of integrated circuit interconnects. The method includes coupling a first oscillator to a first integrated circuit interconnect and coupling a second oscillator to a second integrated circuit interconnect. The first oscillator is activated to characterize the sum of (i) coupling capacitance between the first integrated-circuit interconnect and the second integrated-circuit interconnect and (ii) ground capacitance between the first integrated-circuit interconnect and a ground. In addition, both of the first oscillator and the second oscillator are activated to characterize the ground capacitance between the first integrated-circuit interconnect and the ground.