Abstract: A semiconductor device (100) comprising a leadframe (120) having an assembly pad (121) in a first horizontal plane (180), the pad's first surface (121a) with a semiconductor chip (110) attached; further a plurality of leads (122) in a parallel second horizontal plane (190) offset from the first plane in the direction of the attached chip, the leads having a third surface (122a) with bonding wires, and an opposite fourth surface (122b); a package (140) encapsulating leadframe, chip, and wires, the package having a fifth surface (140a) parallel to the first and second planes; a plurality of recess holes (150) in the package, each hole stretching from the fifth surface to the fourth surface of respective leads; and solder (160) filling the recess holes, the solder attached to the fourth lead surface and extending to the fifth package surface.

Abstract: A semiconductor device (100) comprising a leadframe (120) having an assembly pad (121) in a first horizontal plane (180), the pad's first surface (121a) with a semiconductor chip (110) attached; further a plurality of leads (122) in a parallel second horizontal plane (190) offset from the first plane in the direction of the attached chip, the leads having a third surface (122a) with bonding wires, and an opposite fourth surface (122b); a package (140) encapsulating leadframe, chip, and wires, the package having a fifth surface (140a) parallel to the first and second planes; a plurality of recess holes (150) in the package, each hole stretching from the fifth surface to the fourth surface of respective leads; and solder (160) filling the recess holes, the solder attached to the fourth lead surface and extending to the fifth package surface.

Abstract: A semiconductor device (100) comprising a leadframe (120) having an assembly pad (121) in a first horizontal plane (180), the pad's first surface (121a) with a semiconductor chip (110) attached; further a plurality of leads (122) in a parallel second horizontal plane (190) offset from the first plane in the direction of the attached chip, the leads having a third surface (122a) with bonding wires, and an opposite fourth surface (122b); a package (140) encapsulating leadframe, chip, and wires, the package having a fifth surface (140a) parallel to the first and second planes; a plurality of recess holes (150) in the package, each hole stretching from the fifth surface to the fourth surface of respective leads; and solder (160) filling the recess holes, the solder attached to the fourth lead surface and extending to the fifth package surface.

Abstract: Embodiments of the invention provide a method for forming a dual sided embedded die system. The method begins with starting material including a top surface and a bottom surface, a plurality of vias, a plurality of plated metal posts, die pads, and stiffeners. The surface are planarized to expose the included metal which is than selectively etching from die attach pad DAP areas to form cavities. Create a stiffener by using photo resist patterning and plating. Apply tacky tape. Attach a die. Laminate and grind. Remove tacky tape. Form redistribution layers RDLs and a solder mask. Mounting Surface Mount Devices.

Abstract: A circuit assembly includes a substrate having a substrate electrical circuit, opposite top and bottom substrate surfaces, and a substrate hole extending through the substrate. The circuit assembly also includes a discrete component assembly electrically connected to the substrate electrical circuit and a support member attached to the discrete component. At least a portion of the discrete component is physically mounted in the substrate hole.

Abstract: A method for bonding a first semiconductor body having a plurality of electromagnetic radiation detectors to a second semiconductor body having read out integrated circuits for the detectors. The method includes: aligning electrical contacts for the plurality of electromagnetic radiation detectors with electrical contacts of the read out integrated circuits; tacking the aligned electrical contacts for the plurality of electromagnetic radiation detectors with electrical contacts of the read out integrated circuits to form an intermediate stage structure; packaging the intermediate stage structure into a vacuum sealed electrostatic shielding container having flexible walls; inserting the package with the intermediate stage structure therein into an isostatic pressure chamber; and applying the isostatic pressure to the intermediate stage structure through walls of the container. The container includes a stand-off to space walls of the container from edges of the first semiconductor body.

Abstract: Embodiments of the invention provide a method for forming a dual sided embedded die system. The method begins with starting material including a top surface and a bottom surface, a plurality of vias, a plurality of plated metal posts, die pads, and stiffeners. The surface are planarized to expose the included metal which is than selectively etching from die attach pad DAP areas to form cavities. Create a stiffener by using photo resist patterning and plating. Apply tacky tape. Attach a die. Laminate and grind. Remove tacky tape. Form redistribution layers RDLs and a solder mask. Mounting Surface Mount Devices.

Abstract: A method for bonding a first semiconductor body having a plurality of electromagnetic radiation detectors to a second semiconductor body having read out integrated circuits for the detectors. The method includes: aligning electrical contacts for the plurality of electromagnetic radiation detectors with electrical contacts of the read out integrated circuits; tacking the aligned electrical contacts for the plurality of electromagnetic radiation detectors with electrical contacts of the read out integrated circuits to form an intermediate stage structure; packaging the intermediate stage structure into a vacuum sealed electrostatic shielding container having flexible walls; inserting the package with the intermediate stage structure therein into an isostatic pressure chamber; and applying the isostatic pressure to the intermediate stage structure through walls of the container. The container includes a stand-off to space walls of the container from edges of the first semiconductor body.

Abstract: A semiconductor device (100) comprising a leadframe (120) having an assembly pad (121) in a first horizontal plane (180), the pad's first surface (121a) with a semiconductor chip (110) attached; further a plurality of leads (122) in a parallel second horizontal plane (190) offset from the first plane in the direction of the attached chip, the leads having a third surface (122a) with bonding wires, and an opposite fourth surface (122b); a package (140) encapsulating leadframe, chip, and wires, the package having a fifth surface (140a) parallel to the first and second planes; a plurality of recess holes (150) in the package, each hole stretching from the fifth surface to the fourth surface of respective leads; and solder (160) filling the recess holes, the solder attached to the fourth lead surface and extending to the fifth package surface.

Abstract: A discrete component assembly includes a discrete component having a central longitudinal axis and having an outer surface with a laterally outermost point positioned at a first radial distance from the central longitudinal axis. The assembly includes a support structure mounted on the discrete component. The assembly also includes a plurality of contact pads electrically connected to the discrete component and mounted on the support structure at radial distances from the central longitudinal axis greater than the first radial distance.

Abstract: A circuit assembly includes a substrate having a substrate electrical circuit, opposite top and bottom substrate surfaces, and a substrate hole extending through the substrate. The circuit assembly also includes a discrete component assembly electrically connected to the substrate electrical circuit and a support member attached to the discrete component. At least a portion of the discrete component is physically mounted in the substrate hole.

Abstract: A device is employed that can be retrofit onto existing feed pumps to remediate the problem of fluid aspiration in patients being fed through a feeding tube from the pump. In one embodiment the feeding pump is plugged into the device which is plugged into a power outlet. A patient angle sensor triggers power cutoff to the pump and stoppage of fluid flow. The angle sensor and operating program may be part of a smart phone. Power to the pump may be shut off due to a BLUETOOTH® signal from the smart phone to a BLUETOOTH® controlled power strip into which the pump is plugged to receive power.

Abstract: A device is employed that can be retrofit onto existing feed pumps to remediate the problem of fluid aspiration in patients being fed through a feeding tube from the pump. In one embodiment the feeding pump is plugged into the device which is plugged into a power outlet. A patient angle sensor triggers power cutoff to the pump and stoppage of fluid flow. The angle sensor and operating program may be part of a smart phone. Power to the pump may be shut off due to a Bluetooth signal from the smart phone to a Bluetooth controlled power strip into which the pump is plugged to receive power.

Abstract: A cellular telephone or other portable communication device is provided with program instructions which cause the device to be set into a “meeting mode” by a user. When in this mode, callers are provided with a message indicating the meeting status. The called party is preferably then provided with the option of responding to questions from the caller by selectably activating button icons on a user interface which cause an audio transmission to the called party which is not also transmitted to the device's external speaker. The icons are labeled with such short responses such as: NO, YES, MAYBE, OKAY, MORE, LESS, TODAY, TOMORROW, and NEVER.

Abstract: A system and method is described in which energy source identification information is impressed upon electrical conductors employed in an electrical energy distribution network. The present invention negates the concept that electrical energy in a power distribution system is or should be treated as a fungible quantity. The present invention provides a mechanism by which end-users are rendered capable of determining and requesting that the electrical energy being provided to them is derived from renewable resources in general or from specific renewable resources. The present invention also enhances the capabilities for monitoring and controlling the production of greenhouse gases, particularly carbon dioxide.

Abstract: A motorized vehicle that is capable of operating in a mode in which motive power is being supplied wholly or partially from electric power is provided with an exterior indicator showing this mode of operation to other vehicle operators. In this way other drivers are alerted to the fact that the vehicle is under electric power and is not likely to be accelerated, particularly uphill.

Abstract: A process flow employing a liquid cleaning agent (510) such as flux to penetrate the interface between the glassy coats (402) and the surface of metal (120) and to delaminate the coats from the metal, and then, at elevated temperatures, to use the agent's vapor pressure to break up the glassy coats into smaller pieces (403). The glassy coats are prevented by their low density to penetrate into the molten solder. Finally, at ambient temperature, the floating filler debris is water-washed and rinsed away. Cleaning agents include low-viscosity liquids (oils) and flux, which do not decompose at elevated temperatures and are mixed with components operable to provide, at the elevated temperatures, the fumes for sufficient vapor pressure to break up and dislodge the coats from the metal contacts.

Abstract: A patient angle sensor is employed in conjunction with gastric feeding devices to shut off or to reverse the flow of fluid in the tube when the angle of a bed ridden patient becomes sufficient to allow gastric juices to percolate up through the esophagus and into the patient's lungs. In this way incidents of aspirational pneumonia in hospitalized patients is significantly reduced or eliminated.

Abstract: A patient angle sensor is employed in conjunction with gastric feeding devices to shut off or to reverse the flow of fluid in the tube when the angle of a bed ridden patient becomes sufficient to allow gastric juices to percolate up through the esophagus and into the patient's lungs. In this way incidents of aspirational pneumonia in hospitalized patients is significantly reduced or eliminated.

Abstract: Stacked semiconductor chip package system vertical interconnects and related methods are disclosed. A preferred embodiment of the invention includes a first semiconductor chip with a surface bearing a plurality of first fusible metallic coupling elements. A second semiconductor chip has a plurality of second fusible metallic coupling elements. The first and second fusible metallic coupling elements correspond at the adjoining surfaces of the first and second semiconductor chips when stacked, and are fused to form a gold-tin eutectic alloy fused metallic coupling vertically interconnecting the stacked chips.