Abstract: Disclosed are methods and devices for providing improved semiconductor packages and POP IC assemblies using the improved packages with reduced warping. According to disclosed embodiments of the inventions, a packaged semiconductor device for use in a POP assembly includes an encapsulated region generally defined by the substrate surface. The encapsulant is provided with contact apertures permitting external communication with contacts on the substrate and coupled to an encapsulated chip. Preferred embodiments of the invention are described in which the contact aperture sidewalls are angled within the range of approximately 10-30 degrees or more from vertical and in which the contact aperture is provided a gas release channel to permit gas to escape during reflow.

Abstract: A method, comprising bonding a first wire to a single die bond pad to form a first bond, bonding the first wire to a bond post to form a second bond, bonding a second wire to the first bond, and coupling the second wire to the bond post.

Abstract: The invention relates to microelectronic semiconductor device assemblies having vertically stacked semiconductor device layers. In a disclosed example of a preferred embodiment, a semiconductor device includes a base substrate, an interposing layer, and a second semiconductor device. The interposing layer features a thin insulating film with numerous electrical contacts on its surfaces for electrically coupling with electrical contacts on the adjacent layers. The interposing layer further includes electrical contacts for coupling with one or more non-adjacent layers. Particular examples of preferred embodiments of the invention disclose the use of polyimide film for the interposing layer material and metal studs for non-adjacent layer contacts.

Abstract: A motorized vehicle that is capable of operating in a mode in which motive power is being supplied wholly or partially from electric power is provided with an exterior indicator showing this mode of operation to other vehicle operators. In this way other drivers are alerted to the fact that the vehicle is under electric power and is not likely to be accelerated, particularly uphill.

Abstract: The present invention provides a warning apparatus for an automotive vehicle. The apparatus includes an air pressure sensor mounted on a side of the vehicle. This sensor provides an indication which is a function of sensed local air pressure. A connection mechanism is provided between the sensor and an indicator which provides an indication of the pressure to a driver of the vehicle. The pressure sensor thus provides an indication, alert, warning or indicator with respect to the closeness of a passing vehicle.

Abstract: A patient angle sensor is employed in conjunction with gastric feeding devices to shut off or to reverse the flow of fluid in the tube when the angle of a bed ridden patient becomes sufficient to allow gastric juices to percolate up through the esophagus and into the patient's lungs. In this way incidents of aspirational pneumonia in hospitalized patients is significantly reduced or eliminated.

Abstract: A retrofittable device is employed to remediate the problem of fluid aspiration in patients being fed through a feeding tube. In one embodiment the feeding pump is plugged into the device which is plugged into a power outlet. A patient angle sensor triggers power cutoff to the pump and stoppage of fluid flow. In another embodiment, the device responds to the angle sensor by actuating a flow limiting device which either pinches the tube closed or actuates a controllable valve disposed within the flow path.

Abstract: A solder ball pad that includes a substrate and a bonding pad attached to the substrate. The bonding pad has a bonding pad surface and a bonding pad edge. The solder ball pad also includes a solder mask attached to the substrate in which the solder mask at least partially surrounds, but does not substantially cover, the bonding pad. The solder ball pad also has an anchor pad coupled to the bonding pad and extending between the substrate and the solder mask.

Abstract: A patient stomach fullness sensor is employed in conjunction with an optional patient angle sensor to shut off or to reverse the flow of fluid in a gastric tube when the combination of stomach fullness and patient angle relative to the horizontal becomes sufficient to indicate that gastric juices may enter the esophagus or go even higher. In this way incidents of aspirational pneumonia in hospitalized patients is significantly reduced or eliminated.

Abstract: A microelectronics package comprising: a die, a lead frame comprising: a substrate having a first side and a second side, an array of contacts positioned on the first side and the second side, and an aperture extending through the substrate between the contacts, wherein at least one contact is electrically coupled to the die, and a mold compound encapsulating the die and the substrate.

Abstract: The present invention provides a warning apparatus for an automotive vehicle. The apparatus includes an air pressure sensor mounted on a side of the vehicle. This sensor provides an indication which is a function of sensed local air pressure. A connection mechanism is provided between the sensor and an indicator which provides an indication of the pressure to a driver of the vehicle. The pressure sensor thus provides an indication, alert, warning or indicator with respect to the closeness of a passing vehicle.

Abstract: A method, comprising bonding a first wire to a single die bond pad to form a first bond, bonding the first wire to a bond post to form a second bond, bonding a second wire to the first bond, and coupling the second wire to the bond post.

Abstract: A semiconductor die has three rows or more of bond pads with minimum pitch. The die is mounted on a package substrate having three rows or more of bond fingers and/or conductive rings. The bond pads on the outermost part of the die (nearest the perimeter of the die) are connected by a relatively lower height wire achieved by reverse stitching to the innermost ring(s) or row (farthest from the perimeter of the package substrate) of bond fingers. The innermost row of bond pads is connected by a relatively higher height wire achieved by ball bond to wedge bond to the outermost row of the bond fingers. The intermediate row of bond pads is connected by relatively intermediate height wire by ball bond to wedge bond to the intermediate row of bond fingers. The varying height wire allows for tightly packed bond pads. The structure is adaptable for stacked die.

Abstract: A Body Access System for the collection of samples and the administration of fluids comprising means to prevent complete withdrawal of a needle stylet, means to dispose of needles and needle stylets provides for limited exposure to samples collected, needle sticks and stylet sticks.

Abstract: A multi-chip assembly (100) uses a clip (110) to retain multiple integrated circuits (124-130) to an assembly substrate (140). The use of a thermal medium between the integrated circuits and the heat sinks (120, 122) allows the assembly to be disassembled for rework purposes. The clip contains edge clamps (112), alignment rails (114), and alignment features (116, 316, 416) to properly orient the clip, heat sink, integrated circuits, and assembly substrate.

Abstract: An acoustic lens device is provided for use in facilitating oral communication in a space which is acoustically challenged. The lens device includes at least one acoustic reflector for positioning proximate to a dashboard of a passenger portion of a transport vehicle. The reflector is formed by an upper portion with an ellipsoidal surface obtained when an ellipse having two foci on an axis extending in a substantially vertical direction is rotated about the axis. In consequence, the upper portion encloses at least one of the two foci such that each of the at least one reflectors is disposed at a predetermined distance from the other with parallel axes. The first loci is disposed such that voice signals emitted from the mouths of persons seated in the front passenger compartment are directed from the first foci to the device. Accordingly, a sound pressure of a voice signal reaches the axis of the at least one reflector and is focused by the device and directed to the second focus in the back passenger portion.

Abstract: A Spinal Fluid Collection System comprising means to prevent complete withdrawal of a needle stylet, means to dispose of needles and needle stylets and means to collect fluid samples provides for limited exposure to spinal fluid samples and to needle sticks from spinal tap needles and stylets during and after the performance of a spinal tap.

Abstract: A common complication of vaginal delivery is the tearing of the muscles of the vagina and perineum. This tearing results in an irregular laceration which the surgeon must then repair. Current obstetrical practice is to prevent this irregular laceration by performing an episiotomy to create a regular laceration which is later sutured. However, both natural tearing of the vaginal and perineal muscles during delivery and surgical episiotomies are subject to further, more grave, complications. The use of medical therapy instead of surgical therapy will reduce the incidence of lacerations of the muscles of the vagina and perineum. The use of medical therapy for the relaxation of the muscles of the vagina and perineum is described.