Patents by Inventor Alois Stelzl

Alois Stelzl has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of producing a surface acoustic wave component
    Patent number: 6449828
    Abstract: A method of making a SAW component has electrically conductive structures on a substrate. A cap cover encapsulates and seals the structures against environmental influences. An RF shield is placed on the cap cover. The RF shield is a metallization formed of a material layer sequence of TiW, Cu or Ni and Au which is then reinforced with current-less or galvanic deposition.
    Type: Grant
    Filed: February 28, 2001
    Date of Patent: September 17, 2002
    Assignee: Siemens Matsushita Components GmbH & Co. KG
    Inventors: Wolfgang Pahl, Alois Stelzl, Hans Krüger
  • Electronic component in particular an saw component operating with surface acoustic waves and a method for its production
    Patent number: 6310420
    Abstract: The SAW component has electrical structures which are encapsulated and sealed against environmental influences by a cap cover. Connecting pads of the electrical structures are exposed in a window of the cap cover and the pads are provided with a metallization. Solderable metallized areas are formed on the cap cover, and they are connected to the pad metallizations via through-plated holes.
    Type: Grant
    Filed: June 22, 1998
    Date of Patent: October 30, 2001
    Assignee: Siemens Aktiengesellschaft
    Inventors: Wolfgang Pahl, Alois Stelzl, Hans Krüger
  • Method of producing a surface acoustic wave component
    Publication number: 20010010444
    Abstract: The SAW component has electrically conductive structures on a substrate. A cap cover encapsulates and seals the structures against environmental influences. An RF shield is placed on the cap cover. The RF shield is a metallization formed of a material layer sequence of TiW, Cu or Ni and Au which may be reinforced with current-less or galvanic deposition.
    Type: Application
    Filed: February 28, 2001
    Publication date: August 2, 2001
    Applicant: Siemens Matsushita Components GmbH & Co. KG
    Inventors: Wolfgang Pahl, Alois Stelzl, Hans Kruger
  • Electrical component, in particular saw component operating with surface acoustic waves, and a method for its production
    Patent number: 6242842
    Abstract: The SAW component has electrically conductive structures on a substrate. A cap cover encapsulates and seals the structures against environmental influences. An RF shield is placed on the cap cover. The RF shield is a metallization formed of a material layer sequence of TiW, Cu or Ni and Au which may be reinforced with current-less or galvanic deposition.
    Type: Grant
    Filed: June 22, 1998
    Date of Patent: June 5, 2001
    Assignee: Siemens Matsushita Components GmbH & Co. KG
    Inventors: Wolfgang Pahl, Alois Stelzl, Hans Krüger
  • Method of producing an electronic component, in particular a surface acoustic wave component
    Patent number: 6136175
    Abstract: The electronic component, specifically a SAW component with conductive structures disposed on a substrate is encapsulated for protection against environmental influences. The electrically conductive structures are sealed with a gas diffusion-constricting protective layer formed with an electrochemical or ion bombardment process.
    Type: Grant
    Filed: June 22, 1998
    Date of Patent: October 24, 2000
    Assignee: Siemens Aktiengesellschaft
    Inventors: Alois Stelzl, Hans Kruger, Wolfgang Pahl, Jurgen Machui
  • Method for the production of flip-chip mounting-ready contacts of electrical components
    Patent number: 6057222
    Abstract: Contacts of SAW components are produced which are suitable for flip-chip mounting. Electrically conductive structures on a substrate are tightly encapsulated within a cover and contact pads of the electrically conductive structures are exposed in a window formed in the cover. Solderable layers are vapor deposited onto the contact pads of the electrically conductive structures after the cover is produced.
    Type: Grant
    Filed: June 22, 1998
    Date of Patent: May 2, 2000
    Assignee: Siemens Aktiengesellschaft
    Inventors: Wolfgang Pahl, Alois Stelzl, Hans Kruger