Patents by Inventor Alphonso P. Lanzetta
Alphonso P. Lanzetta has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 5433631Abstract: A flex circuit card with an elastomeric cable connector assembly is provided for transmitting high speed signals between two or more printed circuit boards in a high performance computer system. The flex circuit card connects a cable assembly to a printed circuit board. A conductor trace in the flex circuit card extends into an elastomeric end and terminates with a ball shaped contact which is angled to wipe against mating pads on the printed circuit card for making electrical contact. The cable assembly uses multiple wires attached to a plurality of elastomeric connectors. At least one elastomeric connector is attached to each end of the cable assembly and each elastomeric connector has a plurality of contacts which are used to mate with a plurality of pads on the surface of the printed circuit board. The elastomeric connector described in the present invention provides a high density, cable-to-board interconnection that is perpendicular to the surface of the printed circuit board.Type: GrantFiled: June 29, 1994Date of Patent: July 18, 1995Assignee: International Business Machines CorporationInventors: Brian S. Beaman, Fuad E. Doany, Thomas J. Dudek, Alphonso P. Lanzetta, Da-Yuan Shih, William J. Tkazyik, George F. Walker
-
Patent number: 5421079Abstract: A high density circuit package includes a pair of planar packages, the planar packages exhibiting front and back surfaces and positioned back-to-back in the high density circuit package. Each planar package includes a flexible circuit carrier having a plurality of circuit chips mounted thereon. Front and back planar metallic heat sinks sandwich the circuit carriers, at least one of the heat sinks contacting a surface of the chips mounted on the sandwiched circuit carriers. Each heat sink is provided with air flow apertures formed in its planar surface and adjacent to each circuit chip. A circuit card interconnects with the circuit carriers in an interconnection region and is pluggable into a female connector. The planar metallic heat sinks and circuit carriers are mechanically packaged so as to provide a planar arrangement which aligns the apertures in both the front and rear heat sinks.Type: GrantFiled: November 8, 1993Date of Patent: June 6, 1995Assignee: International Business Machines CorporationInventors: Thomas M. Cipolla, Paul W. Coteus, Alphonso P. Lanzetta
-
Patent number: 5386344Abstract: A flex circuit card with an elastomeric cable connector assembly is provided for transmitting high speed signals between two or more printed circuit boards in a high performance computer system. The flex circuit card connects a cable assembly to a printed circuit board. A conductor trace in the flex circuit card extends into an elastomeric end and terminates with a ball shaped contact which is angled to wipe against mating pads on the printed circuit card for making electrical contact. The cable assembly uses multiple wires attached to a plurality of elastomeric connectors. At least one elastomeric connector is attached to each end of the cable assembly and each elastomeric connector has a plurality of contacts which are used to mate with a plurality of pads on the surface of the printed circuit board. The elastomeric connector described in the present invention provides a high density, cable-to-board interconnection that is perpendicular to the surface of the printed circuit board.Type: GrantFiled: January 26, 1993Date of Patent: January 31, 1995Assignee: International Business Machines CorporationInventors: Brian S. Beaman, Fuad E. Doany, Thomas J. Dudek, Alphonso P. Lanzetta, Da-Yuan Shih, William J. Tkazyik, George F. Walker
-
Patent number: 5360946Abstract: The present invention relates to an improved flex (or TAB) product suitable for silicon carrier or other types of chip carrier applications, wherein the flex reliability problems caused for example by Cu thermal cycling are substantially reduced or eliminated. More particularly, the invention embodies a number of coatings for use in such products and diverse methods of making and using same.Type: GrantFiled: September 17, 1991Date of Patent: November 1, 1994Assignee: International Business Machines CorporationInventors: Claudius Feger, Teresita O. Graham, Kurt R. Grebe, Alphonso P. Lanzetta, John J. Liutkus, Linda C. Matthew, Michael J. Palmer, Nelson R. Tanner, Ho-Ming Tong, Charles H. Wilson, Helen L. Yeh
-
Patent number: 5322204Abstract: A conductor attachment wherein each conductor is mounted on a dielectric tape and has an attachment portion that is supported by the tape to an adjacent location a uniform distance from the bonding location and that contacts on a level with the plane of the underside of the tape. One conductor supporting tape has portions of the tape that extend into a central contacting area opening to contact locations at contacting pads in rows remote from the edge. Another supporting tape has window openings at the contacting locations. The conductor ends are brought into the level of the underside of the tape by a manufacturing rolling operation between an elastomer surface roller and a solid backing roller.Type: GrantFiled: June 21, 1993Date of Patent: June 21, 1994Assignee: International Business Machines CorporationInventors: Mark F. Bregman, Raymond R. Horton, Alphonso P. Lanzetta, Ismail C. Noyan, Michael J. Palmer, Ho-Ming Tong
-
Patent number: 5268815Abstract: A high density circuit package includes a pair of planar packages, the planar packages exhibiting front and back surfaces and positioned back-to-back in the high density circuit package. Each planar package includes a flexible circuit carrier having a plurality of circuit chips mounted thereon. Front and back planar metallic heat sinks sandwich the circuit carriers, at least one of the heat sinks contacting a surface of the chips mounted on the sandwiched circuit carriers. Each heat sink is provided with air flow apertures formed in its planar surface and adjacent to each circuit chip. A circuit card interconnects with the circuit carriers in an interconnection region and is pluggable into a female connector. The planar metallic heat sinks and circuit carriers are mechanically packaged so as to provide a planar arrangement which aligns the apertures in both the front and rear heat sinks.Type: GrantFiled: July 30, 1992Date of Patent: December 7, 1993Assignee: International Business Machines CorporationInventors: Thomas M. Cipolla, Paul W. Coteus, Brian C. Derdall, Christina M. Knoedler, Alphonso P. Lanzetta, John J. Liutkus, Linda C. Matthew, Lawrence S. Mok, Irene A. Sterian
-
Patent number: 5233221Abstract: A conductor attachment wherein each conductor is mounted on a dielectric tape and has an attachment portion that is supported by the tape to an adjacent location a uniform distance from the bonding location and that contacts on a level with the plane of the underside of the tape. One conductor supporting tape has portions of the tape that extend into a central contacting area opening to contact locations at contacting pads in rows remote from the edge. Another supporting tape has window openings at the contacting locations. The conductor ends are brought into the level of the underside of the tape by a manufacturing rolling operation between an elastomer surface roller and a solid backing roller.Type: GrantFiled: July 26, 1991Date of Patent: August 3, 1993Assignee: International Business Machines CorporationInventors: Mark F. Bregman, Raymond R. Horton, Alphonso P. Lanzetta, Ismail C. Noyan, Michael J. Palmer, Ho-Ming Tong
-
Patent number: 5229328Abstract: A method for bonding conductors to semiconductor chip contact pads wherein each conductor is mounted on a dielectric tape and has an attachment portion that is supported by the tape to an adjacent location a uniform distance from the bonding location and that contacts on a level with the plane of the underside of the tape. One conductor supporting tape has portions of the tape that extend into a central contacting area opening to contact locations at contacting pads in rows remote from the edge. Another supporting tape has window openings at the contacting locations. The conductor ends are brought into the level of the underside of the tape by a manufacturing rolling operation between an elastomer surface roller and a solid backing roller.Type: GrantFiled: June 30, 1992Date of Patent: July 20, 1993Assignee: International Business Machines CorporationInventors: Mark F. Bregman, Raymond R. Horton, Alphonso P. Lanzetta, Ismail C. Noyan, Michael J. Palmer, Ho-Ming Tong
-
Patent number: 5117275Abstract: A conductor attachment wherein each conductor is mounted on a dielectric tape and has an attachment portion that is supported by the tape to an adjacent location a uniform distance from the bonding location and that contacts on a level with the plane of the underside of the tape. One conductor supporting tape has portions of the tape that extend into a central contacting area opening to contact locations at contacting pads in rows remote from the edge. Another supporting tape has window openings at the contacting locations. The conductor ends are brought into the level of the underside of the tape by a manufacturing rolling operation between an elastomer surface roller and a solid backing roller.Type: GrantFiled: October 24, 1990Date of Patent: May 26, 1992Assignee: International Business Machines CorporationInventors: Mark F. Bregman, Raymond R. Horton, Alphonso P. Lanzetta, Ismail C. Noyan, Michael J. Palmer, Ho-Ming Tong
-
Patent number: 5052606Abstract: A hitch feeder for a TAB tape is described which comprises: a stationary jas assembly having opposing jaws for gripping edges of the tape when closed, and not gripping the edges when open; a movable gripping assembly which includes a lower movable gripper positioned below the tape and an upper movable gripper positioned above the tape. The lower and upper movable grippers may be moved both towards and away from the tape, each said movable gripper gripping the tape when moved towards it and releasing the tape when moved away from it. Both grippers are physically clear of any features on the tape when moved away from it. A tape feeder is provided for reciprocally moving the movable gripper assembly along the tape length, both towards and away from the stationary jaw assembly.Type: GrantFiled: June 29, 1990Date of Patent: October 1, 1991Assignee: International Business Machines Corp.Inventors: Thomas M. Cipolla, Raymond R. Horton, Alphonso P. Lanzetta, Michael J. Palmer, Mark B. Ritter