Abstract: Embodiments of the present invention relate to semiconducting carbon-containing devices and methods of making thereof. The semi-conducting carbon containing devices comprise an n-type semiconducting layer and a p-type semiconducting layer, both of which are positioned over a substrate. The n-type semiconducting layer can be formed by pyrolyzing a carbon- and nitrogen-containing polymer, and the p-type semiconducting layer can be formed by pyrolyzing an aromatic- and aliphatic-group-containing polymer. In some embodiments, the devices are solar cell devices.

Abstract: A transparent electrically-conductive hard-coated substrate of the invention comprises a transparent base material; a deposited carbon nanotubes layer formed on the transparent base material; and a cured resin layer formed on the deposited carbon nanotubes layer, wherein the deposited carbon nanotubes layer has a thickness of 10 nm or less, the total thickness of the deposited carbon nanotubes layer and the cured resin layer is 1.5 ?m or more, and part of the deposited carbon nanotubes layer is diffused into the cured resin layer so that carbon nanotubes are present in the cured resin layer. The transparent electrically-conductive hard-coated substrate possesses high transparency and hard coating properties and also has electrical conductivity.

Abstract: A method for producing dispersible carbon nanotubes of the invention comprises subjecting single-walled carbon nanotubes to UV treatment in the presence of ozone such that carboxyl groups are introduced into the single-walled carbon nanotubes and that the single-walled carbon nanotubes are fragmented. A carbon nanotubes obtained by the method has a good dispersibility.

Abstract: A light emitting composition includes a light-emitting lumophore-functionalized nanoparticle, such as an organic-inorganic light-emitting lumophore-functionalized nanoparticle. A light emitting device includes an anode, a cathode, and a layer containing such a light-emitting composition. In an embodiment, the light emitting device can emit white light.

Abstract: The present invention provides a process for producing an electro-optic hybrid circuit board, which comprises the steps of: forming an undercladding layer on a metal foil side of a metal transfer sheet that comprises a releasable substrate and a metal foil formed thereon; forming a core layer on the undercladding layer; forming an overcladding layer so as to cover the core layer and the undercladding layer; stripping the releasable substrate from the metal foil; and etching the metal foil to thereby form a predetermined conductor pattern.

Abstract: The present invention provides a process for producing an optical waveguide, comprising the steps of: continuously applying a fluorene derivative layer onto a continuous substrate and curing the layer to thereby form a lower cladding layer; continuously applying a photosensitive fluorene derivative layer onto the lower cladding layer; continuously exposing the applied photosensitive fluorene derivative layer to a light through a photomask having a predetermined pattern; continuously subjecting the exposed photosensitive fluorene derivative layer to post-exposure heating; continuously developing the heated photosensitive fluorene derivative layer to remove the unexposed areas therein, thereby forming into the predetermined pattern; curing the developed photosensitive fluorene derivative layer to thereby form a core layer having the predetermined pattern on the lower cladding layer; and continuously applying a fluorene derivative layer over the lower cladding layer so as to cover the core layer and curing the f

Abstract: The invention provides a process for producing an optical waveguide, which comprises the steps of: forming a substrate adhesion layer on a surface of a substrate from a layer-forming material containing a coupling agent; forming an undercladding layer on the substrate adhesion layer; and forming a core layer having a predetermined pattern on the undercladding layer through a wet process with a developing solution.

Abstract: The present invention provides a process for producing an optical waveguide which comprises: disposing on an undercladding layer at least one member for forming an optical-path deflection plane; forming a photosensitive resin layer over the undercladding layer so as to at least partly cover the member for forming an optical-path deflection plane; subjecting the photosensitive resin layer to exposure and then development to thereby form at least one core layer; and forming an overcladding layer over the undercladding layer so as to cover the at least one core layer.

Abstract: The invention provides an electro-optic hybrid circuit board having an optical waveguide superposed on a wiring circuit board, the electro-optic hybrid circuit board comprising: an insulating layer; a conductor pattern formed on the insulating layer; an undercladding layer formed on the conductor pattern-having insulating layer so as to surround the conductor pattern; a core layer formed on the undercladding layer; and an overcladding layer formed to cover the core layer and the undercladding layer.

Abstract: An optical waveguide and a production method thereof that can provide increased production efficiency, improved workability, and/or production stability. According to non-limiting example embodiments a photopolymerizable resin composition comprising a fluorene derivative and a photoacid generator is coated over an under clad layer and then is dried, to form a resin layer having substantially no surface tack. The resin layer is exposed to light in the state of being contacted with a photo mask by a contact exposure method and then is developed, to form the resin layer into a pattern. Thereafter, the resin layer is cured to form a core layer and then an over clad layer is formed on the under clad layer in such a manner as to cover the core layer, to thereby produce an optical waveguide.

Abstract: The present invention provides a process for producing a flexible optical waveguide which comprises the steps of: immersing a substrate having an optical waveguide formed thereon in water to thereby reduce adhesion between the optical waveguide and the substrate and then peeling the optical waveguide from the substrate; temporarily bonding the peeled optical waveguide to a surface of a pressure-sensitive adhesive layer containing a foaming agent; cutting the temporarily bonded optical waveguide into a given length; allowing the foaming-agent-containing pressure-sensitive adhesive layer after the cutting step to foam by heating, thereby reducing adhesion between the foaming-agent-containing pressure-sensitive adhesive layer and the optical waveguide; and peeling the optical waveguide cut into the given length from the foamed adhesive layer.

Abstract: The present photosensitive resin composition 2 comprises a polyamic acid resin 4, a photosensitive agent, a dispersible compound 3 dispersible in the polyamic acid resin 4, and a solvent. The porous resin is obtained by removing the solvent from the photosensitive resin composition 2 to form a composition in which the dispersible compound 3 is dispersed in the polyamic acid resin 4, removing the dispersible compound to make the composition porous, and curing the porous photosensitive resin composition. The porous resin enables forming a fine circuit pattern and has a low dielectric constant and, when used as an insulating layer of a circuit board, brings about improved high frequency characteristics.

Abstract: The present invention provides a process for producing an optical waveguide which comprises: disposing on an undercladding layer at least one member for forming an optical-path deflection plane; forming a photosensitive resin layer over the undercladding layer so as to at least partly cover the member for forming an optical-path deflection plane; subjecting the photosensitive resin layer to exposure and then development to thereby form at least one core layer; and forming an overcladding layer over the undercladding layer so as to cover the at least one core layer.

Abstract: This invention provides a process for producing a three-dimensional polyimide optical waveguide, which comprises: (I) irradiating a polyamic acid film with a laser beam while converging the laser beam at an inside portion of the film and relatively moving the light convergence point, the polyamic acid film containing: (a) a polyamic acid obtained from a tetracarboxylic dianhydride and a diamine; and (b) per 100 parts of the polyamic acid, from 0.5 part by weight to less than 10 parts by weight of a specific 1,4-dihydropyridine derivative represented by formula (I): and then, (II) heating the polyamic acid film to imidize the polyamic acid, thereby obtaining an optical waveguide having a continuous core region where the refraction index has been changed, in the thus formed polyimide film.

Abstract: The present invention provides a polyimide resin for an electrical insulating material which comprises a polyimide resin having a repeating unit represented by general formula (I): wherein R1 represents a bivalent organic group.

Abstract: The present invention provides a process for producing a filmy optical waveguide from a filmy structure having one or more optical-waveguide parts formed therein, which process comprises: cutting each optical-waveguide part out of the filmy structure to thereby form an optical waveguide having a light entrance end face and a light emission end face, wherein the cutting for making the light entrance end face and the light emission end face is conducted with a laser light and the cutting for making cut surfaces other than said end faces is conducted by punching with a die.

Abstract: The present invention provides a process for producing an electro-optic hybrid circuit board, which comprises the steps of: forming an undercladding layer on a metal foil side of a metal transfer sheet that comprises a releasable substrate and a metal foil formed thereon; forming a core layer on the undercladding layer; forming an overcladding layer so as to cover the core layer and the undercladding layer; stripping the releasable substrate from the metal foil; and etching the metal foil to thereby form a predetermined conductor pattern.

Abstract: A photosensitive polyimide resin precursor composition capable of providing a polyimide resin that is not substantially colored, is transparent and has heat resistance, an optical polyimide resin obtained from the composition, and an optical waveguide using the polyimide resin. The photosensitive polyimide resin precursor composition contains (a) 100 parts by weight of a polyamic acid obtained from a tetracarboxylic acid dianhydride and a diamine, (b) 0.01 parts by weight or more and less than 5 parts by weight of a 1,4-dihydropyridine derivative, (c) 5–50 parts by weight of a glycol (ether). The optical polyimide resin is obtained by irradiating the photosensitive resin precursor composition with UV light, followed by exposure, heating, development, and then heating. The optical waveguide comprises a core layer comprising the optical polyimide resin, and a cladding layer thereof.

Abstract: An optical film which comprises (i) a substrate without a vertical alignment layer and (ii) a homeotropic alignment liquid crystal film layer formed on the substrate. The homeotropic alignment liquid crystal film layer comprises a homeotropically aligned liquid crystal polymer.

Abstract: The invention provides an electro-optic hybrid circuit board having an optical waveguide superposed on a wiring circuit board, the electro-optic hybrid circuit board comprising: an insulating layer; a conductor pattern formed on the insulating layer; an undercladding layer formed on the conductor pattern-having insulating layer so as to surround the conductor pattern; a core layer formed on the undercladding layer; and an overcladding layer formed to cover the core layer and the undercladding layer.