Patents by Inventor Ameya GALINDE

Ameya GALINDE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230155273
    Abstract: A device that includes a first substrate comprising a first antenna, an integrated device coupled to the first substrate, an encapsulation layer located over the first substrate and the integrated device, a second substrate comprising a second antenna, and a flexible connection coupled to the first substrate and the second substrate. The device includes a shield formed over a surface of the encapsulation layer and a surface of the first substrate. The shield includes an electromagnetic interference (EMI) shield.
    Type: Application
    Filed: November 4, 2022
    Publication date: May 18, 2023
    Inventors: Jeahyeong HAN, Rajneesh KUMAR, Suhyung HWANG, Jaehyun YEON, Mohammad Ali TASSOUDJI, Darryl Sheldon JESSIE, Ameya GALINDE
  • Patent number: 11495873
    Abstract: A device that includes a first substrate comprising a first antenna, an integrated device coupled to the first substrate, an encapsulation layer located over the first substrate and the integrated device, a second substrate comprising a second antenna, and a flexible connection coupled to the first substrate and the second substrate. The device includes a shield formed over a surface of the encapsulation layer and a surface of the first substrate. The shield includes an electromagnetic interference (EMI) shield.
    Type: Grant
    Filed: March 5, 2020
    Date of Patent: November 8, 2022
    Assignee: Qualcomm Incorporated
    Inventors: Jeahyeong Han, Rajneesh Kumar, Suhyung Hwang, Jaehyun Yeon, Mohammad Ali Tassoudji, Darryl Sheldon Jessie, Ameya Galinde
  • Publication number: 20210280959
    Abstract: A device that includes a first substrate comprising a first antenna, an integrated device coupled to the first substrate, an encapsulation layer located over the first substrate and the integrated device, a second substrate comprising a second antenna, and a flexible connection coupled to the first substrate and the second substrate. The device includes a shield formed over a surface of the encapsulation layer and a surface of the first substrate. The shield includes an electromagnetic interference (EMI) shield.
    Type: Application
    Filed: March 5, 2020
    Publication date: September 9, 2021
    Inventors: Jeahyeong HAN, Rajneesh KUMAR, Suhyung HWANG, Jaehyun YEON, Mohammad Ali TASSOUDJI, Darryl Sheldon JESSIE, Ameya GALINDE