DEVICE COMPRISING MULTI-DIRECTIONAL ANTENNAS IN SUBSTRATES COUPLED THROUGH FLEXIBLE INTERCONNECTS
A device that includes a first substrate comprising a first antenna, an integrated device coupled to the first substrate, an encapsulation layer located over the first substrate and the integrated device, a second substrate comprising a second antenna, and a flexible connection coupled to the first substrate and the second substrate. The device includes a shield formed over a surface of the encapsulation layer and a surface of the first substrate. The shield includes an electromagnetic interference (EMI) shield.
The present application is a continuation application to pending U.S. Application 16/810,621 and claims priority to pending U.S. Application 16/810,621, filed Mar. 5, 2020, and assigned to the assignee hereof and hereby expressly incorporated by reference herein as if fully set forth below and for all applicable purposes.
FIELDVarious features relate to devices with an antenna, but more specifically to a device that includes multi-directional antennas in substrates coupled through flexible interconnects.
BACKGROUNDVarious features relate to devices with an antenna, but more specifically to a device that includes multi-directional antennas in substrates coupled through flexible interconnects.
One example provides a device that includes a first substrate comprising a first antenna, an integrated device coupled to the first substrate, an encapsulation layer located over the first substrate and the integrated device, a second substrate comprising a second antenna, and a flexible connection coupled to the first substrate and the second substrate.
Another example provides an apparatus that includes a first substrate comprising a first antenna, an integrated device coupled to the first substrate, means for encapsulation located over the first substrate and the integrated device, a second substrate comprising a second antenna, and means for flexible connection coupled to the first substrate and the second substrate.
Another example provides a method for fabricating a device. The method provides a substrate that includes a first antenna and a second antenna. The method removes portions of the substrate to define (i) a first substrate comprising the first antenna, (ii) a second substrate comprising the second antenna, and (iii) a flexible connection coupled to the first substrate and the second substrate. The method couples an integrated device to the substrate. The method forms an encapsulation layer over the substrate and the integrated device.
Various features, nature and advantages may become apparent from the detailed description set forth below when taken in conjunction with the drawings in which like reference characters identify correspondingly throughout.
In the following description, specific details are given to provide a thorough understanding of the various aspects of the disclosure. However, it will be understood by one of ordinary skill in the art that the aspects may be practiced without these specific details. For example, circuits may be shown in block diagrams in order to avoid obscuring the aspects in unnecessary detail. In other instances, well-known circuits, structures and techniques may not be shown in detail in order not to obscure the aspects of the disclosure.
The present disclosure describes a device that includes a first substrate comprising a first antenna, an integrated device coupled to the first substrate, an encapsulation layer located over the first substrate and the integrated device, a second substrate comprising a second antenna, and a flexible connection coupled to the first substrate and the second substrate. The flexible connection is embedded in the first substrate and the second substrate. The first antenna may be embedded in the first substrate. The second antenna may be embedded in the second substrate. The first antenna may be configured to be facing a first antenna direction. The second antenna may be configured to be facing a second antenna direction that is different than the first antenna direction. The device includes a shield formed over a surface of the encapsulation layer and a surface of the first substrate. The shield may be formed over a side surface of the first substrate. The shield includes an electromagnetic interference (EMI) shield. The device described in the disclosure may provide an antenna device or an antenna in package (AiP) that has a smaller form factor and/or provides better performance (e.g., better transmission and reception performance) through the use of multi-directional antennas and the shielding of various components of the device and/or package. The device and/or AiP may include a radio frequency (RF) package.
Exemplary Device Comprising Substrates With Multi-Directional Antennas and Flexible ConnectionThe package 202 (e.g., first package) includes a substrate 220 (e.g., first substrate), one or more integrated devices (e.g., 222, 224), one or more passive devices (e.g., 226, 228), an encapsulation layer 210, and a shield 230. The substrate 220 includes one or more dielectric layers 221 and a plurality of interconnects 223. The integrated devices may include a die (e.g., processor die, memory die). As will be further described below, some of the plurality of interconnects 223 may be configured as one or more antennas.
The package 204 (e.g., second package) includes a substrate 240 (e.g., second substrate), one or more integrated devices (e.g., 242), one or more passive devices (e.g., 246), an encapsulation layer 270, and a shield 250. The substrate 240 includes one or more dielectric layers 241 and a plurality of interconnects 243. The integrated devices may include a die (e.g., processor die, memory die). As will be further described below, some of the plurality of interconnects 243 may be configured as one or more antennas (e.g., at least one interconnect from the plurality of interconnects 243 may define at least one antenna).
The package 202 is coupled to the package 204 though the flexible connection 206. Thus, the flexible connection 206 may be coupled to the package 202 (e.g., first package) and the package 204 (e.g., second package). The flexible connection 206 may be embedded in the package 202 and the package 204. The flexible connection 206 includes at least one dielectric layer 260 and at least one interconnect 262. The at least one dielectric layer 260 may include polyimide or liquid crystal polymer. The flexible connection 206 may be configured to electrically couple the package 202 and the package 204. The flexible connection 206 may be configured to allow different currents (e.g., signal, power, ground) to travel between the package 202 and the package 204. For example, the flexible connection 206 may include (i) at least one first interconnect configured for a signal (e.g., input/output signal), (ii) at least one second interconnect configured for power, and (iii) at least one third interconnect configured for ground. The flexible connection 206 is bendable such that the package 204 may be positioned at an angle to the package 202, and vice versa. The flexible connection 206 may be means for flexible connection. Although not shown, the flexible connection 206 may include a cover protective material or be covered with a protective material. In at least some implementations, the flexible connection 206 may be configured to be bendable up to 180 degrees without fracturing. Thus, for example, components of the flexible connection 206, such as the at least one dielectric layer 260 and the at least one interconnect 262, may bend up to 180 degrees without causing damage, a crack and/or a fracture in the flexible connection 206. Various implementations of the flexible connection 206 may be bendable up to different degrees. For example, in at least some implementations, the flexible connection 206 may be configured to be bendable up to 90 degrees without fracturing and/or cracking. In at least some implementations, the flexible connection 206 may be configured to be bendable by at least 10 degrees (or more) without fracturing and/or cracking. The term “flexible” may mean that a component is (i) bendable by at least 10 degrees (or more) without fracturing and/or cracking, and/or (ii) bendable up to 180 degrees without fracturing and/or cracking.
As shown in
As mentioned above, the substrate 220 includes a plurality of interconnects 223, where some of the interconnects may be configured to operate as one or more antennas.
As mentioned above, the substrate 240 includes a plurality of interconnects 243, where some of the interconnects may be configured to operate as one or more antennas.
As will be further described below, the substrate 220 and/or the substrate 240 may include interconnects that are configured as external input/output (I/O) terminals, which allow the substrate 220 and/or the substrate 240 to be coupled to external components. Moreover, as will be further described below, the substrate 220, the substrate 240 and the flexible connection 206 may be fabricated concurrently as part of the same substrate.
Having described an example of a device that includes substrates with multi-directional antennas, various other examples of devices that include substrates with multi-directional antennas are further illustrated and described below.
Exemplary Devices Comprising Substrates With Multi-Directional Antennas and Flexible ConnectionDifferent implementations may couple the substrates through the flexible connection 206 differently.
In some implementations, more than two substrates may be coupled together through several flexible connections.
Different implementations may use substrates with different sizes and shapes. Different implementations may include a different number of substrates, a different number of flexible connections, that are coupled along different surfaces of the substrates. The relative angles between the different substrates may vary and is not limited to perpendicular angles. The relative locations and/or angles between substrates may be in a range of 0-360 degrees. Thus, the positions, shapes, sizes, angles of the substrates that are shown are merely exemplary. Moreover, various components (e.g., integrated device, passive device), encapsulation layer(s) and/or shield(s) may be coupled to and/or formed over the substrates.
Having described various configurations and arrangements of devices that include multi-directional antennas, a sequence for fabricating a device that includes multi-directional antennas will be further described below.
Exemplary Sequence for Fabricating a Device Comprising Substrates With Multi-Directional Antennas and Flexible ConnectionIt should be noted that the sequence of
Stage 1, as shown in
Stage 2 illustrates a state after several dielectric layers 1610 and a plurality of interconnects 1612 (e.g., traces, pads, vias) are formed over the carrier 1600. A deposition process may be used to form the dielectric layers 1610. Forming the plurality of interconnects 1612 may include forming a seed layer, performing a lithography process, a plating process, a stripping process and/or an etching process. In some implementations, the deposition, the lithography process, the plating process, the stripping process and/or the etching process may be performing iteratively.
Stage 3 illustrates a state after a dielectric layer 1620 is formed over the dielectric layer 1610 and the plurality of interconnects 1612. A deposition process may be used to form the dielectric layer 1620.
Stage 4 illustrates a state after cavities 1621 are formed in the dielectric layer 1620. An etching process may be used to form the cavities.
Stage 5, as shown in
Stage 6 illustrates a state after a dielectric layer 1630 and a plurality of interconnects 1632 are formed over the dielectric layer 1620 and the plurality of interconnects 1622. A deposition process may be used to form the dielectric layer 1630. Forming the plurality of interconnects 1632 may include forming a seed layer, performing a lithography process, a plating process, a stripping process and/or an etching process.
Stage 7 illustrates a state after the dielectric layer 1640 is formed over the dielectric layer 1630. A deposition process may be used to form the dielectric layer 1640.
Stage 8, as shown in
Stage 9 illustrates a state after the dielectric layer 1650 is formed over the dielectric layer 1640 and/or the plurality of interconnects 1642. A deposition process may be used to form the dielectric layer 1650.
Stage 10 illustrates a state after carrier 1600 is decoupled from the substrate 1670. The substrate 1670 may include the dielectric layers (e.g., 1610, 1620, 1630, 1640, 1650) and the plurality of interconnects (e.g., 1612, 1622, 1632, 1642). Examples of processes for fabricating the substrate 1670 includes a semi additive process (SAP) and a modified semi additive process (mSAP). However, different implementations may fabricate the substrate 1670 differently.
Stage 11, as shown in
Stage 12 illustrates a state after components are coupled to the substrate 1670. In particular, the integrated devices (e.g., 222, 224, 242) and the passive devices (e.g., 226, 228, 246) are coupled to a first surface of the substrate 1670. In some implementations, a pick and place operation may be used to couple the integrated devices and/or passive devices. The integrated devices and/or passive devices may be coupled to the substrates 220 and 240 through solder interconnects.
Stage 13, as shown in
Stage 14 illustrates a state after the shield 230 and the shield 250 are formed. The shield 230 is formed over the encapsulation layer 210 coupled to the substrate 220. The shield 250 is formed over the encapsulation layer 270 coupled to the substrate 240. A sputtering process may be used to form the shield 230 and/or the shield 250. The shield 230 may be formed and located over the outer surface of the encapsulation layer 210 and/or the surface (e.g., side surface) of the substrate 220. The shield 250 may be formed and located over the outer surface of the encapsulation layer 270 and/or the surface (e.g., side surface) of the substrate 240. In some implementations, a protective material may be disposed or formed over the flexible connection 206.
Stage 15, as shown in
In some implementations, fabricating a device that includes several substrates with multi-directional antennas includes several processes.
It should be noted that the sequence of
The method forms (at 1705) a substrate (e.g., 1670) that include at least one dielectric layer (e.g., 221) and interconnects (e.g., 223). Some of the interconnects may form one or more antennas in the substrate. The fabrication of the substrate may include a lamination process and a plating process. Examples of processes for fabricating a substrate includes a semi additive process (SAP) and a modified semi additive process (mSAP). However, different implementations may fabricate a substrate differently. Stages 1-10 of
The method removes (at 1710) portions of the substrate (e.g., 1670) to expose and/or define a flexible connection 206 between a first substrate (e.g., 220) and a second substrate (e.g., 240). An etching process, a mechanical process, and/or a laser process may be used to remove portions of the substrate 1670. Portions of a substrate that are removed include at least one dielectric layer. In some implementations, at least one metal layer (e.g., interconnects) may be removed. Stage 11 of
The method couples (at 1715) integrated device(s) (e.g., 222, 224, 242) and/or passive device(s) (e.g., 226, 228, 246) to a first surface of at least one substrate (e.g., 220, 240). Solder interconnects may be used to couple the integrated device(s) and/or passive device(s) to the substrate. A reflow process may be used to couple the integrated devices and passive devices to the substrate. Stage 12 of
The method encapsulates (at 1720) the integrated device(s) and the passive device(s) with at least one encapsulation layer (e.g., 210, 270). For example, the encapsulation layer 210 may be provided such that the encapsulation layer 210 encapsulates the integrated devices and/or passive devices located over the substrate. Different implementations may provide the encapsulation layer 210 over the substrate by using various processes. For example, the encapsulation layer 210 may be provided over the substrate by using a compression and transfer molding process, a sheet molding process, or a liquid molding process. Stage 13 of
The method forms (at 1725) a shield (e.g., 230, 250) over the encapsulation layer (e.g., 210, 270) and over a side portion of the substrate 220 and the substrate 240. The shield 212 may include one or more metal layers (e.g., patterned metal layer(s)). The shield 212 may be configured to operate as an electromagnetic interference (EMI) shield. A plating process, a chemical vapor deposition (CVD) process, a physical vapor deposition (PVD) process, a sputtering process, and/or a spray coating may be used to form the shield. Stage 14 of
The method bends (at 1730) the flexible connection (e.g., 206) to position the substrate 240 relative to the substrate 220 such that the substrate 220 faces a first antenna direction, and the substrate 240 faces a second antenna direction that is different than the first antenna direction. Stage 15 of
One or more of the components, processes, features, and/or functions illustrated in
It is noted that the figures in the disclosure may represent actual representations and/or conceptual representations of various parts, components, objects, devices, packages, integrated devices, integrated circuits, and/or transistors. In some instances, the figures may not be to scale. In some instances, for purpose of clarity, not all components and/or parts may be shown. In some instances, the position, the location, the sizes, and/or the shapes of various parts and/or components in the figures may be exemplary. In some implementations, various components and/or parts in the figures may be optional.
The word “exemplary” is used herein to mean “serving as an example, instance, or illustration.” Any implementation or aspect described herein as “exemplary” is not necessarily to be construed as preferred or advantageous over other aspects of the disclosure. Likewise, the term “aspects” does not require that all aspects of the disclosure include the discussed feature, advantage or mode of operation. The term “coupled” is used herein to refer to the direct or indirect coupling between two objects. For example, if object A physically touches object B, and object B touches object C, then objects A and C may still be considered coupled to one another—even if they do not directly physically touch each other. The term “electrically coupled” may mean that two objects are directly or indirectly coupled together such that an electrical current (e.g., signal, power, ground) may travel between the two objects. Two objects that are electrically coupled may or may not have an electrical current traveling between the two objects. The use of the terms “first”, “second”, “third” and “fourth” (and/or anything above fourth) is arbitrary. Any of the components described may be the first, second, third or fourth. For example, a component that is referred to a second component, may be the first component, the second component, the third component or the fourth component. The term “encapsulating” means that the object may partially encapsulate or completely encapsulate another object. It is further noted that the term “over” as used in the present application in the context of one component located over another component, may be used to mean a component that is on another component and/or in another component (e.g., on a surface of a component or embedded in a component). Thus, for example, a first component that is over the second component may mean that (1) the first component is over the second component, but not directly touching the second component, (2) the first component is on (e.g., on a surface of) the second component, and/or (3) the first component is in (e.g., embedded in) the second component. The term “about ‘value X’”, or “approximately value X”, as used in the disclosure means within 10 percent of the ‘value X’. For example, a value of about 1 or approximately 1, would mean a value in a range of 0.9-1.1.
In some implementations, an interconnect is an element or component of a device or package that allows or facilitates an electrical connection between two points, elements and/or components. In some implementations, an interconnect may include a trace, a via, a pad, a pillar, a redistribution metal layer, and/or an under bump metallization (UBM) layer. In some implementations, an interconnect is an electrically conductive material that may be configured to provide an electrical path for a signal (e.g., a data signal), ground and/or power. An interconnect may be part of a circuit. An interconnect may include more than one element or component. An interconnect may be defined by one or more interconnects. Different implementations may use different processes and/or sequences for forming the interconnects. In some implementations, a chemical vapor deposition (CVD) process, a physical vapor deposition (PVD) process, a sputtering process, a spray coating, and/or a plating process may be used to form the interconnects.
Also, it is noted that various disclosures contained herein may be described as a process that is depicted as a flowchart, a flow diagram, a structure diagram, or a block diagram. Although a flowchart may describe the operations as a sequential process, many of the operations can be performed in parallel or concurrently. In addition, the order of the operations may be re-arranged. A process is terminated when its operations are completed.
The various features of the disclosure described herein can be implemented in different systems without departing from the disclosure. It should be noted that the foregoing aspects of the disclosure are merely examples and are not to be construed as limiting the disclosure. The description of the aspects of the present disclosure is intended to be illustrative, and not to limit the scope of the claims. As such, the present teachings can be readily applied to other types of apparatuses and many alternatives, modifications, and variations will be apparent to those skilled in the art.
Claims
1. A device comprising:
- a first substrate comprising a first antenna;
- an integrated device coupled to the first substrate;
- an encapsulation layer located over the first substrate and the integrated device, wherein the encapsulation layer encapsulates the integrated device;
- a connector coupled to the first substrate and configured to provide one or more external input/output terminals;
- a second substrate comprising a second antenna; and
- a flexible connection coupled to the first substrate and the second substrate, wherein the flexible connection is embedded in the first substrate and the second substrate.
2. The device of claim 1,
- wherein the first substrate includes a first plurality of antennas,
- wherein the first plurality of antennas are embedded in the first substrate,
- wherein each antenna from the first plurality of antennas is adjacent to another antenna from the first plurality of antennas, and
- wherein the first antenna is an antenna from the first plurality of antennas.
3. The device of claim 1,
- wherein the second substrate includes a second plurality of antennas,
- wherein the second plurality of antennas are embedded in the second substrate,
- wherein each antenna from the second plurality of antennas is adjacent to another antenna from the second plurality of antennas, and
- wherein the second antenna is an antenna from the second plurality of antennas.
4. The device of claim 1,
- wherein the first substrate comprises a plurality of interconnects, and
- wherein the connector is coupled to one or more interconnects from the plurality of interconnects of the first substrate.
5. The device of claim 4, wherein the connector is coupled to the integrated device through the one or more interconnects from the plurality of interconnects of the first substrate.
6. The device of claim 1, wherein the integrated device and the connector are coupled to a first surface of the first substrate.
7. The device of claim 6,
- wherein the first antenna is configured to face towards a second surface of the first substrate, and
- wherein the second surface of the first substrate is opposite to the first surface of the first substrate.
8. The device of claim 1, wherein the connector is external to the encapsulation layer that encapsulates the integrated device.
9. The device of claim 1, wherein the flexible connection comprises:
- at least one dielectric layer;
- at least one interconnect; and
- a protective material that covers the at least one dielectric layer and the at least one interconnect.
10. The device of claim 9, wherein the at least one dielectric layer and the at least one interconnect of the flexible connection, extend into the first substrate and the second substrate.
11. The device of claim 1, further comprising a shield located over a surface of the encapsulation layer, wherein the shield is configured as an electromagnetic interference (EMI) shield.
12. The device of claim 1,
- wherein the first antenna is embedded in the first substrate,
- wherein the first substrate is configurable to face a first antenna direction,
- wherein the second antenna is embedded in the second substrate, and
- wherein the second substrate is configurable to face a second antenna direction.
13. The device of claim 1, wherein the flexible connection is coupled to a length side of the first substrate and a length side of the second substrate.
14. The device of claim 1, wherein the flexible connection is coupled to a length side of the first substrate and a width side of the second substrate.
15. The device of claim 1, wherein the flexible connection is coupled to a width side of the first substrate and a length side of the second substrate.
16. The device of claim 1, wherein the flexible connection is coupled to a width side of the first substrate and a width side of the second substrate.
17. A method for fabricating a device, comprising:
- providing a substrate comprising a first antenna and a second antenna;
- removing portions of the substrate to define (i) a first substrate comprising the first antenna, (ii) a second substrate comprising the second antenna, and (iii) a flexible connection coupled to the first substrate and the second substrate, wherein the flexible connection is embedded in the first substrate and the second substrate;
- coupling an integrated device to the first substrate;
- forming an encapsulation layer over the first substrate and the integrated device; and
- coupling a connector to the first substrate, wherein the connector is configured to provide one or more external input/output terminals.
18. The method of claim 17,
- wherein the first substrate includes a first plurality of antennas,
- wherein the first plurality of antennas are embedded in the first substrate,
- wherein each antenna from the first plurality of antennas is adjacent to another antenna from the first plurality of antennas,
- wherein the first antenna is an antenna from the first plurality of antennas,
- wherein the second substrate includes a second plurality of antennas,
- wherein the second plurality of antennas are embedded in the second substrate,
- wherein each antenna from the second plurality of antennas is adjacent to another antenna from the second plurality of antennas, and
- wherein the second antenna is an antenna from the second plurality of antennas.
19. The method of claim 17,
- wherein the first substrate comprises a plurality of interconnects,
- wherein the connector is coupled to one or more interconnects from the plurality of interconnects of the first substrate,
- wherein the connector is coupled to the integrated device through the one or more interconnects from the plurality of interconnects of the first substrate,
- wherein the integrated device and the connector are coupled to a first surface of the first substrate,
- wherein the first antenna is configured to face towards a second surface of the first substrate, and
- wherein the second surface of the first substrate is opposite to the first surface of the first substrate.
20. The method of claim 17,
- wherein the first antenna is embedded in the first substrate,
- wherein the first substrate is configurable to face a first antenna direction,
- wherein the second antenna is embedded in the second substrate,
- wherein the second substrate is configurable to face a second antenna direction, and
- wherein the flexible connection comprises: at least one dielectric layer; at least one interconnect; and wherein the at least one dielectric layer and the at least one interconnect of the flexible connection, extend into the first substrate and the second substrate.
Type: Application
Filed: Nov 4, 2022
Publication Date: May 18, 2023
Inventors: Jeahyeong HAN (San Diego, CA), Rajneesh KUMAR (San Diego, CA), Suhyung HWANG (Rancho Mission Viejo, CA), Jaehyun YEON (San Diego, CA), Mohammad Ali TASSOUDJI (San Diego, CA), Darryl Sheldon JESSIE (San Diego, CA), Ameya GALINDE (San Francisco, CA)
Application Number: 17/981,176