Abstract: Some embodiments of the present disclosure are directed to a method for manufacturing detachable electronic modules. The method may include forming a detachable connector package by aligning a plurality of detachable connectors with respect to one another at a first alignment tolerance, wherein each of the plurality of detachable connectors comprises a first kinematic interface, and providing a co-packaged optics (CPO) device, the CPO device comprising a plurality of photonics integrated circuits (PICs), wherein each PIC of the plurality of PICs is coupled to a CPO connector comprising a second kinematic interface. The method may further include attaching the detachable connector package to a co-packaged optics (CPO) device by engaging each first kinematic interface with a corresponding second kinematic interface such that each of the plurality of detachable connectors aligns with each of the plurality of PICs within a predetermined sub-micron tolerance.

Abstract: Some embodiments of the present disclosure are directed to a detachable connector for a co-packaged optics (CPO) device. The detachable connector may include a kinematic mount, where the kinematic mount includes a first kinematic interface configured to engage a corresponding kinematic interface of the CPO device. In some embodiments, the kinematic mount is configured for repeated detachment and attachment with substantially identical alignment between the detachable connector and the CPO device within a predetermined sub-micron tolerance. Furthermore, in an attached state, the kinematic mount may be configured to provide an optical transmission path between the CPO device and the detachable connector, where a transmission loss along the optical transmission path remains within a predetermined threshold tolerance.

Abstract: A cable tray assembly accommodates a plurality of cables therein, particularly for accommodating multiple cables of the same length but that connect connection points that are different distances apart. The cable tray comprises a plurality of cable pathways, wherein each of the plurality of cable pathways route a cable around one or more curves between a first connection point of a plurality of first connection points and a second connection point of a plurality of second connection points; wherein each of the first connection points accommodates one cable and the plurality of first connection points are spaced apart from one another; and wherein each of the plurality of cable pathways accommodate cables having an at least substantially identical length.

Abstract: An optical shuffle box connects each of a plurality of optical adapters with all of a plurality of computing resources that are connected to the shuffle box via a plurality of optical backplane connectors. The optical shuffle box comprises a plurality of optical backplane connectors; a front panel comprising a plurality of optical adapters; a plurality of fibers connecting the plurality of optical backplane connectors with the plurality of optical adapters; and wherein the optical shuffle box is detachably connectable with one or more optical I/O computing resources in part by the plurality of optical backplane connectors to optically connect each of the plurality of optical adapters of the front panel with each of the one or more optical I/O computing resources.

Abstract: Electronic devices, electronic modules, and methods for manufacturing electronic devices and/or electronic modules are described herein. Some embodiments of the present invention may be directed to an electronic module that includes a multi-chip module (MCM) substrate having a first surface configured to be connected to a system printed circuit board and a second surface defining a central portion and a peripheral portion. The electronic module may include a main die positioned on the central portion of the second surface of the MCM substrate and in electrical communication with electrical traces of the MCM substrate. The electronic module may include MCM sockets positioned on the peripheral portion of the MCM substrate, where each MCM socket is configured to engage and support a mezzanine package substrate such that a main portion of the mezzanine package substrate extends beyond the peripheral portion of the MCM substrate.

Abstract: Electronic devices, electronic modules, and methods for manufacturing electronic devices and/or electronic modules are described herein. Some embodiments of the present invention may be directed to an electronic module that includes a multi-chip module (MCM) substrate having a first surface configured to be connected to a system printed circuit board and a second surface defining a central portion and a peripheral portion. The electronic module may include a main die positioned on the central portion of the second surface of the MCM substrate and in electrical communication with electrical traces of the MCM substrate. The electronic module may include MCM sockets positioned on the peripheral portion of the MCM substrate, where each MCM socket is configured to engage and support a mezzanine package substrate such that a main portion of the mezzanine package substrate extends beyond the peripheral portion of the MCM substrate.

Abstract: An example electronic module includes a multi-chip module (MCM) substrate comprising a central portion configured to receive a main die; a plurality of MCM sockets positioned about a peripheral portion of the MCM substrate; and a plurality of mezzanine packages coupled to respective MCM sockets of the plurality of MCM sockets. The plurality of MCM sockets and the MCM substrate are configured to enable communication of digital data between the main die and respective mezzanine packages of the plurality of mezzanine packages. The plurality of mezzanine packages includes at least one co-packaged copper (CPC) package; and at least one co-packaged optics (CPO) package.

Abstract: Some embodiments of the present disclosure are directed to optical connectors and methods of assembling the same. For example, the present disclosure provides for a “semi-detachable” connector. A mechanical receptacle may be actively aligned to the photonic integrated circuit die, allowing for full testing of the device and for a simplified assembly process. At a later step in the assembly process, the connector may be placed on the receptacle (passively—already tested) and the connector may be adhered to the receptacle. The present disclosure may result in a simplified assembly, and a smaller device size that fits inside an octal small form factor pluggable (OSFP) transceiver.

Abstract: Some embodiments of the present disclosure are directed to an optical waveguide for co-packaged optics packages. For example, a module may include a substrate having a substrate optical waveguide, an interposer disposed on a surface of the substrate, where the interposer comprises an interposer optical waveguide, and where the interposer is configured to optically align the interposer optical waveguide with the substrate optical waveguide, a main die disposed on a surface of the interposer, and a photonic IC disposed on the surface of the interposer and configured to be in optical communication with the interposer optical waveguide. Additionally, or alternatively, the substrate optical waveguide may be configured to convey optical signals between the substrate and the interposer. Further, the interposer optical waveguide may be configured to convey optical signals between the surface of the substrate and the interposer.

Abstract: Connectors for optical waveguide arrays (WGAs) are described herein. Some embodiments include an optical array connector that includes one component configured to mechanically connect to one WGA and another component configured to mechanically connect to another WGA. The components may be configured to removably connect to each other, mechanically connect the WGAs to each other, and optically align each waveguide of one WGA to a corresponding waveguide of the other WGA. In some embodiments, one component may be configured to expand and collimate light beams from one WGA, and the other component may be configured to focus each collimated light beam onto proximal apertures of the other WGA. Additionally, or alternatively, the components may be configured to direct the light beams via total internal reflection. In some embodiments, one or more of the components may include a microlens array and/or another WGA.

Abstract: Electronic devices, electronic modules, and methods for manufacturing electronic devices and/or electronic modules are described herein. Some embodiments of the present invention may be directed to an electronic module that includes a multi-chip module (MCM) substrate having a first surface configured to be connected to a system printed circuit board and a second surface defining a central portion and a peripheral portion. The electronic module may include a main die positioned on the central portion of the second surface of the MCM substrate and in electrical communication with electrical traces of the MCM substrate. The electronic module may include MCM sockets positioned on the peripheral portion of the MCM substrate, where each MCM socket is configured to engage and support a mezzanine package substrate such that a main portion of the mezzanine package substrate extends beyond the peripheral portion of the MCM substrate.

Abstract: A device may include a frame, an optical connector coupled to an external surface of the frame, and an optical fiber comprising a bent section positioned external to an interior of the frame and connected to the optical connector.

Abstract: A device may include a frame, an optical connector coupled to an external surface of the frame, and an optical fiber comprising a bent section positioned external to an interior of the frame and connected to the optical connector.

Abstract: A system may distribute radio networking traffic from a base station to one or more radio units in a bi-directional link. The system may transport the radio networking traffic over a digital network. The system may include a front-haul unit coupled to the radio units and in communication with the base station. The front-haul unit may encapsulate access signals from the base station within digital transport streams for transport over the digital network. The front-haul unit may multicast digital transport transmission streams to multiple radio units in a virtual cell. The digital transport streams may contain combined received access signals from multiple service providers in a neutral-host configuration. The radio units may map encapsulate incoming radio signals for return transport to the front-haul unit and then on the base station. The front-haul unit may transport data over the network to support wireless local area network service at the radio units.

Abstract: A system for providing a reduced common public radio interface (CPRI) framelet link includes one or more cellular towers, each cellular tower including one or more cellular antennas and coupled to a first short CPRI fiber link. An access subsystem is coupled to a baseband pool. The access subsystem is coupled to the first short CPRI fiber link via a first framelet block, and the first framelet block facilitates interfacing the first short CPRI fiber link to the access subsystem.

Abstract: A mapper physical layer device (PHY) is disclosed that performs a protocol conversion of an input data stream that is formatted according to a first wired communication protocol to provide an output data stream that is formatted according to a second wired communication protocol. The mapper PHY can be synchronized to a common reference clock or clocking source to ensure that data streams provided by multiple mapper PHYs are sufficiently aligned to satisfy frame timing alignment accuracy requirements of a wireless communication protocol.

Abstract: Systems and methods are provided to use of out-of-band (OOB) channels for the transport of network-synchronization signals and network control information. These OOB channels transport synchronization and control channels over low-frequency bands outside of the frequency bands used for the data channels. Locating expensive network-synchronization functions in the optical network unit (ONU) and sharing the derived synchronization signals among multiple downstream customer premises equipment (CPE) devices results in cost savings and provides a means for maintaining a continuous, end-to-end synchronization reference, even during periods when the data channels on the copper network segment are in an energy-efficiency mode (e.g., a low-power and/or sleep mode).

Abstract: A system may distribute radio networking traffic from a base station to one or more radio units in a bi-directional link. The system may transport the radio networking traffic over a digital network. The system may include a front-haul unit coupled to the radio units and in communication with the base station. The front-haul unit may encapsulate access signals from the base station within digital transport streams for transport over the digital network. The front-haul unit may multicast digital transport transmission streams to multiple radio units in a virtual cell. The digital transport streams may contain combined received access signals from multiple service providers in a neutral-host configuration. The radio units may map encapsulate incoming radio signals for return transport to the front-haul unit and then on the base station. The front-haul unit may transport data over the network to support wireless local area network service at the radio units.

Abstract: A system for providing a reduced common public radio interface (CPRI) framelet link includes one or more cellular towers, each cellular tower including one or more cellular antennas and coupled to a first short CPRI fiber link. An access subsystem is coupled to a baseband pool. The access subsystem is coupled to the first short CPRI fiber link via a first framelet block, and the first framelet block facilitates interfacing the first short CPRI fiber link to the access subsystem.

Abstract: A mapper PHY is disclosed that performs a protocol conversion of an input data stream that is formatted according to a first wired communication protocol to provide an output data stream that is formatted according to a second wired communication protocol. The mapper PHY can be synchronized to a common reference clock or clocking source to ensure that data streams provided by multiple mapper PHYs are sufficiently aligned to satisfy frame timing alignment accuracy requirements of a wireless communication protocol.