Abstract: Electronic devices, electronic modules, and methods for manufacturing electronic devices and/or electronic modules are described herein. Some embodiments of the present invention may be directed to an electronic module that includes a multi-chip module (MCM) substrate having a first surface configured to be connected to a system printed circuit board and a second surface defining a central portion and a peripheral portion. The electronic module may include a main die positioned on the central portion of the second surface of the MCM substrate and in electrical communication with electrical traces of the MCM substrate. The electronic module may include MCM sockets positioned on the peripheral portion of the MCM substrate, where each MCM socket is configured to engage and support a mezzanine package substrate such that a main portion of the mezzanine package substrate extends beyond the peripheral portion of the MCM substrate.

Abstract: Electronic devices, electronic modules, and methods for manufacturing electronic devices and/or electronic modules are described herein. Some embodiments of the present invention may be directed to an electronic module that includes a multi-chip module (MCM) substrate having a first surface configured to be connected to a system printed circuit board and a second surface defining a central portion and a peripheral portion. The electronic module may include a main die positioned on the central portion of the second surface of the MCM substrate and in electrical communication with electrical traces of the MCM substrate. The electronic module may include MCM sockets positioned on the peripheral portion of the MCM substrate, where each MCM socket is configured to engage and support a mezzanine package substrate such that a main portion of the mezzanine package substrate extends beyond the peripheral portion of the MCM substrate.

Abstract: An example electronic module includes a multi-chip module (MCM) substrate comprising a central portion configured to receive a main die; a plurality of MCM sockets positioned about a peripheral portion of the MCM substrate; and a plurality of mezzanine packages coupled to respective MCM sockets of the plurality of MCM sockets. The plurality of MCM sockets and the MCM substrate are configured to enable communication of digital data between the main die and respective mezzanine packages of the plurality of mezzanine packages. The plurality of mezzanine packages includes at least one co-packaged copper (CPC) package; and at least one co-packaged optics (CPO) package.

Abstract: Some embodiments of the present disclosure are directed to an optical waveguide for co-packaged optics packages. For example, a module may include a substrate having a substrate optical waveguide, an interposer disposed on a surface of the substrate, where the interposer comprises an interposer optical waveguide, and where the interposer is configured to optically align the interposer optical waveguide with the substrate optical waveguide, a main die disposed on a surface of the interposer, and a photonic IC disposed on the surface of the interposer and configured to be in optical communication with the interposer optical waveguide. Additionally, or alternatively, the substrate optical waveguide may be configured to convey optical signals between the substrate and the interposer. Further, the interposer optical waveguide may be configured to convey optical signals between the surface of the substrate and the interposer.

Abstract: Some embodiments of the present disclosure are directed to optical connectors and methods of assembling the same. For example, the present disclosure provides for a “semi-detachable” connector. A mechanical receptacle may be actively aligned to the photonic integrated circuit die, allowing for full testing of the device and for a simplified assembly process. At a later step in the assembly process, the connector may be placed on the receptacle (passively—already tested) and the connector may be adhered to the receptacle. The present disclosure may result in a simplified assembly, and a smaller device size that fits inside an octal small form factor pluggable (OSFP) transceiver.

Abstract: Connectors for optical waveguide arrays (WGAs) are described herein. Some embodiments include an optical array connector that includes one component configured to mechanically connect to one WGA and another component configured to mechanically connect to another WGA. The components may be configured to removably connect to each other, mechanically connect the WGAs to each other, and optically align each waveguide of one WGA to a corresponding waveguide of the other WGA. In some embodiments, one component may be configured to expand and collimate light beams from one WGA, and the other component may be configured to focus each collimated light beam onto proximal apertures of the other WGA. Additionally, or alternatively, the components may be configured to direct the light beams via total internal reflection. In some embodiments, one or more of the components may include a microlens array and/or another WGA.

Abstract: Electronic devices, electronic modules, and methods for manufacturing electronic devices and/or electronic modules are described herein. Some embodiments of the present invention may be directed to an electronic module that includes a multi-chip module (MCM) substrate having a first surface configured to be connected to a system printed circuit board and a second surface defining a central portion and a peripheral portion. The electronic module may include a main die positioned on the central portion of the second surface of the MCM substrate and in electrical communication with electrical traces of the MCM substrate. The electronic module may include MCM sockets positioned on the peripheral portion of the MCM substrate, where each MCM socket is configured to engage and support a mezzanine package substrate such that a main portion of the mezzanine package substrate extends beyond the peripheral portion of the MCM substrate.

Abstract: A device may include a frame, an optical connector coupled to an external surface of the frame, and an optical fiber comprising a bent section positioned external to an interior of the frame and connected to the optical connector.

Abstract: A device may include a frame, an optical connector coupled to an external surface of the frame, and an optical fiber comprising a bent section positioned external to an interior of the frame and connected to the optical connector.

Abstract: A system may distribute radio networking traffic from a base station to one or more radio units in a bi-directional link. The system may transport the radio networking traffic over a digital network. The system may include a front-haul unit coupled to the radio units and in communication with the base station. The front-haul unit may encapsulate access signals from the base station within digital transport streams for transport over the digital network. The front-haul unit may multicast digital transport transmission streams to multiple radio units in a virtual cell. The digital transport streams may contain combined received access signals from multiple service providers in a neutral-host configuration. The radio units may map encapsulate incoming radio signals for return transport to the front-haul unit and then on the base station. The front-haul unit may transport data over the network to support wireless local area network service at the radio units.

Abstract: A system for providing a reduced common public radio interface (CPRI) framelet link includes one or more cellular towers, each cellular tower including one or more cellular antennas and coupled to a first short CPRI fiber link. An access subsystem is coupled to a baseband pool. The access subsystem is coupled to the first short CPRI fiber link via a first framelet block, and the first framelet block facilitates interfacing the first short CPRI fiber link to the access subsystem.

Abstract: A mapper physical layer device (PHY) is disclosed that performs a protocol conversion of an input data stream that is formatted according to a first wired communication protocol to provide an output data stream that is formatted according to a second wired communication protocol. The mapper PHY can be synchronized to a common reference clock or clocking source to ensure that data streams provided by multiple mapper PHYs are sufficiently aligned to satisfy frame timing alignment accuracy requirements of a wireless communication protocol.

Abstract: Systems and methods are provided to use of out-of-band (OOB) channels for the transport of network-synchronization signals and network control information. These OOB channels transport synchronization and control channels over low-frequency bands outside of the frequency bands used for the data channels. Locating expensive network-synchronization functions in the optical network unit (ONU) and sharing the derived synchronization signals among multiple downstream customer premises equipment (CPE) devices results in cost savings and provides a means for maintaining a continuous, end-to-end synchronization reference, even during periods when the data channels on the copper network segment are in an energy-efficiency mode (e.g., a low-power and/or sleep mode).

Abstract: A system may distribute radio networking traffic from a base station to one or more radio units in a bi-directional link. The system may transport the radio networking traffic over a digital network. The system may include a front-haul unit coupled to the radio units and in communication with the base station. The front-haul unit may encapsulate access signals from the base station within digital transport streams for transport over the digital network. The front-haul unit may multicast digital transport transmission streams to multiple radio units in a virtual cell. The digital transport streams may contain combined received access signals from multiple service providers in a neutral-host configuration. The radio units may map encapsulate incoming radio signals for return transport to the front-haul unit and then on the base station. The front-haul unit may transport data over the network to support wireless local area network service at the radio units.

Abstract: A system for providing a reduced common public radio interface (CPRI) framelet link includes one or more cellular towers, each cellular tower including one or more cellular antennas and coupled to a first short CPRI fiber link. An access subsystem is coupled to a baseband pool. The access subsystem is coupled to the first short CPRI fiber link via a first framelet block, and the first framelet block facilitates interfacing the first short CPRI fiber link to the access subsystem.

Abstract: A mapper PHY is disclosed that performs a protocol conversion of an input data stream that is formatted according to a first wired communication protocol to provide an output data stream that is formatted according to a second wired communication protocol. The mapper PHY can be synchronized to a common reference clock or clocking source to ensure that data streams provided by multiple mapper PHYs are sufficiently aligned to satisfy frame timing alignment accuracy requirements of a wireless communication protocol.

Abstract: Systems and methods are provided to use of out-of-band (OOB) channels for the transport of network-synchronization signals and network control information. These OOB channels transport synchronization and control channels over low-frequency bands outside of the frequency bands used for the data channels. Locating expensive network-synchronization functions in the optical network unit (ONU) and sharing the derived synchronization signals among multiple downstream customer premises equipment (CPE) devices results in cost savings and provides a means for maintaining a continuous, end-to-end synchronization reference, even during periods when the data channels on the copper network segment are in an energy-efficiency mode (e.g., a low-power and/or sleep mode).

Abstract: Aspects of a system for transforming compressed video traffic to network-aware Ethernet traffic with A/V bridging capabilities and A/V bridging extensions may include a graphics processing unit (GPU) that may enable encapsulation of compressed video data within a Display Port protocol data unit (PDU). A LAN subsystem may enable encapsulation of the Display Port PDU within an encapsulating PDU. The LAN subsystem may enable determination of a traffic class designation associated with the encapsulating PDU. The LAN subsystem may enable transmission of the encapsulating PDU via a network based on the traffic class designation. The LAN subsystem may also enable the encapsulation of compressed video data within Ethernet frames. A computing device, which receives the Ethernet frames may de-compress the compressed video data and send the uncompressed video data, which may be encapsulated within one or more Display Port mini-packets, to a multimedia monitor.

Abstract: Aspects of a method and system for implementing redundancy for streaming data in audio video bridging networks are provided. Network resources may be reserved over a plurality of network paths. Reserved resources may be utilized for the transmission and/or reception of a corresponding plurality of data streams, wherein one or more of the streams may comprise redundant data. A plurality of data streams may be transmitted and/or received by a plurality of network interface hardware devices. Similarly, a plurality of data streams may be transmitted and/or received by a plurality of ports integrated into a single network interface hardware device. Each of the plurality of data streams may be assigned a unique identifier and the identifier of a first data stream may differ by one bit from an identifier of a data stream comprising data redundant to the first data stream.

Abstract: A network interface device for use with a host computer that includes a host processor and a memory, and which is configured to concurrently run a master operating system and at least one virtual operating system. The device includes a bus interface that communicates over a bus with the host processor and the memory, and a network interface, which is coupled to send and receive data packets carrying data over a packet network. A protocol processor is coupled between the bus interface and the network interface so as to convey the data between the network interface and the memory while performing protocol processing on the data packets under instructions from the at least one virtual operating system, while bypassing the master operating system.