Patents by Inventor Amrik Singh

Amrik Singh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230313382
    Abstract: A support for supporting a component to be plated in a chromic acid-free plating process, the support having a contact surface comprising iodine-treated and/or bromine-treated plastic.
    Type: Application
    Filed: October 2, 2020
    Publication date: October 5, 2023
    Inventors: Trevor PEARSON, Alison HYSLOP, Amrik SINGH, Roderick HERDMAN
  • Patent number: 11661966
    Abstract: A threaded fitting comprising a first plurality of threads from a first end of the fitting to a transition thread and a second plurality of threads from the transition thread to a second end of the fitting. The first plurality of threads is configured to provide a labyrinth type seal minimizing the migration of at least dust and/or gases across a thick-walled enclosure. The second plurality of threads is configured to engage a lock-nut in thin-walled enclosures, or a plurality of pre-formed threads within an aperture of thick-walled enclosures, for minimizing the migration of at least fluids/water across one of the thin- or thick-walled enclosure. The first and second plurality of threads are serially-arranged and may be used either thin or thick-walled enclosures to retard a passage of at least one of either gas, fluid, dust and flame.
    Type: Grant
    Filed: July 31, 2020
    Date of Patent: May 30, 2023
    Assignee: EATON INTELLIGENT POWER LIMITED
    Inventor: Amrik Singh Garcha
  • Publication number: 20220340343
    Abstract: A top-gripping beverage can carrier including a main panel of cardboard sheet material having at least one, and preferably multiple, can receiving apertures. The carrier is provided with locking tabs, which are hingedly connected to the main panel and which are for engaging an underside of a radially protruding portion of a beverage can to be received in the can receiving aperture. The carrier further includes a cover panel for at least partly covering at least a lid of one of the one or multiple cans to be held by the carrier. The cover panel is hingedly connected to the main panel via an intermediate panel, wherein the intermediate panel is hingedly connected to the main panel by means of a first cover fold line, and wherein the intermediate panel is hingedly connected to the cover panel by means of a second cover fold line. The carrier further includes a connector panel which is hingedly connected to the cover panel by means of a third cover fold line.
    Type: Application
    Filed: September 11, 2020
    Publication date: October 27, 2022
    Applicant: Smurfit Kappa Development Centre B.V.
    Inventors: Jacob Albert Mark VAN DE VEGTE, Amrik Singh TATLA, Jan MEIJER
  • Patent number: 11201752
    Abstract: Disclosed herein is a technique for a connection from an Ethernet physical transceiver (PHY) to an integrated connector module (ICM) where the connection and the ICM lack a common mode choke. The ICM can include a magnetic coupler that directly couples an Ethernet jack and the PHY.
    Type: Grant
    Filed: December 19, 2016
    Date of Patent: December 14, 2021
    Assignee: CISCO TECHNOLOGY, INC.
    Inventors: George Edward Curtis, William Oberlin, Chris Desiniotis, Amrik Singh Bains
  • Publication number: 20210033136
    Abstract: A threaded fitting comprising a first plurality of threads from a first end of the fitting to a transition thread and a second plurality of threads from the transition thread to a second end of the fitting. The first plurality of threads is configured to provide a labyrinth type seal minimizing the migration of at least dust and/or gases across a thick-walled enclosure. The second plurality of threads is configured to engage a lock-nut in thin-walled enclosures, or a plurality of pre-formed threads within an aperture of thick-walled enclosures, for minimizing the migration of at least fluids/water across one of the thin- or thick-walled enclosure. The first and second plurality of threads are serially-arranged and may be used either thin or thick-walled enclosures to retard a passage of at least one of either gas, fluid, dust and flame.
    Type: Application
    Filed: July 31, 2020
    Publication date: February 4, 2021
    Applicant: Eaton Intelligent Power Limited
    Inventor: Amrik Singh Garcha
  • Patent number: 10895016
    Abstract: An electrolytic cell and a method of electrochemical oxidation of manganese(II) ions to manganese(III) ions in the electrolytic cell are described. The electrolytic cell comprises (1) an electrolyte solution of manganese(II) ions in a solution of at least one acid; (2) a cathode immersed in the electrolyte solution; and (3) an anode immersed in the electrolyte solution and spaced apart from the cathode. Various anode materials are described including vitreous carbon, reticulated vitreous carbon, woven carbon fibers, lead and lead alloy. Once the electrolyte is oxidized to form a metastable complex of manganese(III) ions, a platable plastic may be contacted with the metastable complex to etch the platable plastic. In addition, a pretreatment step may also be performed on the platable plastic prior to contacting the platable plastic with the metastable complex to condition the plastic surface.
    Type: Grant
    Filed: November 21, 2016
    Date of Patent: January 19, 2021
    Assignee: MacDermid Acumen, Inc.
    Inventors: Trevor Pearson, Terrence Clark, Roshan V. Chapaneri, Craig Robinson, Alison Hyslop, Amrik Singh
  • Patent number: 10095254
    Abstract: Various implementations disclosed herein include a power distribution system that provides flexible and/or multi-source supply capacity in response to changes in load power demand relative to active power supply capacity, and based at least in part on a performance objective function. In some implementations, a power distribution system includes a plurality of power supplies, and a power control module connected to control the plurality of power supplies. The power supplies are configured to deliver a current to a power supply node, and are also configured to responsively adjust the current in response to a control command. The power control module provides control commands that are produced in response to threshold changes in load power demand relative to active power supply capacity provided by one or more of the plurality of power supplies, and based at least in part on a performance objective function, such as efficiency, redundancy, and demand tracking.
    Type: Grant
    Filed: March 25, 2015
    Date of Patent: October 9, 2018
    Assignee: CISCO TECHNOLOGY, INC.
    Inventors: Luis R. Saavedra, Amrik Singh Bains, Samir Bouadjel
  • Publication number: 20180175675
    Abstract: Disclosed herein is a technique for a connection from an Ethernet physical transceiver (PHY) to an integrated connector module (ICM) where the connection and the ICM lack a common mode choke. The ICM can include a magnetic coupler that directly couples an Ethernet jack and the PHY.
    Type: Application
    Filed: December 19, 2016
    Publication date: June 21, 2018
    Inventors: George Edward Curtis, William Oberlin, Chris Desiniotis, Amrik Singh Bains
  • Patent number: 9843492
    Abstract: Methods and systems are disclosed which can perform cable characterization at link-up and during in-service monitoring to provide the best data throughput. In some embodiments a plurality of frequency tones may be sent across a cable to a remote system. A plurality of return loss values associated with sending the plurality of frequency tones may then be measured and stored. Next, a crosstalk value across the cable may be computed. A quality value for the cable may then be determined based on at least the plurality of return loss values and the crosstalk value.
    Type: Grant
    Filed: April 15, 2015
    Date of Patent: December 12, 2017
    Assignee: Cisco Technology, Inc.
    Inventors: Amrik Singh Bains, Kenneth Christian Naumann, Samir Bouadjel
  • Publication number: 20170067176
    Abstract: An electrolytic cell and a method of electrochemical oxidation of manganese(II) ions to manganese(III) ions in the electrolytic cell are described. The electrolytic cell comprises (1) an electrolyte solution of manganese(II) ions in a solution of at least one acid; (2) a cathode immersed in the electrolyte solution; and (3) an anode immersed in the electrolyte solution and spaced apart from the cathode. Various anode materials are described including vitreous carbon, reticulated vitreous carbon, woven carbon fibers, lead and lead alloy. Once the electrolyte is oxidized to form a metastable complex of manganese(III) ions, a platable plastic may be contacted with the metastable complex to etch the platable plastic. In addition, a pretreatment step may also be performed on the platable plastic prior to contacting the platable plastic with the metastable complex to condition the plastic surface.
    Type: Application
    Filed: November 21, 2016
    Publication date: March 9, 2017
    Inventors: Trevor Pearson, Terrence Clark, Roshan V. Chapaneri, Craig Robinson, Alison Hyslop, Amrik Singh
  • Patent number: 9534306
    Abstract: An electrolytic cell and a method of electrochemical oxidation of manganese(II) ions to manganese(III) ions in the electrolytic cell are described. The electrolytic cell comprises (1) an electrolyte solution of manganese(II) ions in a solution of at least one acid; (2) a cathode immersed in the electrolyte solution; and (3) an anode immersed in the electrolyte solution and spaced apart from the cathode. Various anode materials are described including vitreous carbon, reticulated vitreous carbon, woven carbon fibers, lead and lead alloy. Once the electrolyte is oxidized to form a metastable complex of manganese(III) ions, a platable plastic may be contacted with the metastable complex to etch the platable plastic. In addition, a pretreatment step may also be performed on the platable plastic prior to contacting the platable plastic with the metastable complex to condition the plastic surface.
    Type: Grant
    Filed: March 12, 2013
    Date of Patent: January 3, 2017
    Inventors: Trevor Pearson, Terence Clarke, Roshan V. Chapaneri, Craig Robinson, Alison Hyslop, Amrik Singh
  • Publication number: 20160308742
    Abstract: Methods and systems are disclosed which can perform cable characterization at link-up and during in-service monitoring to provide the best data throughput. In some embodiments a plurality of frequency tones may be sent across a cable to a remote system. A plurality of return loss values associated with sending the plurality of frequency tones may then be measured and stored. Next, a crosstalk value across the cable may be computed. A quality value for the cable may then be determined based on at least the plurality of return loss values and the crosstalk value.
    Type: Application
    Filed: April 15, 2015
    Publication date: October 20, 2016
    Inventors: Amrik Singh Bains, Kenneth Christian Naumann, Samir Bouadjel
  • Publication number: 20160282892
    Abstract: Various implementations disclosed herein include a power distribution system that provides flexible and/or multi-source supply capacity in response to changes in load power demand relative to active power supply capacity, and based at least in part on a performance objective function. In some implementations, a power distribution system includes a plurality of power supplies, and a power control module connected to control the plurality of power supplies. The power supplies are configured to deliver a current to a power supply node, and are also configured to responsively adjust the current in response to a control command. The power control module provides control commands that are produced in response to threshold changes in load power demand relative to active power supply capacity provided by one or more of the plurality of power supplies, and based at least in part on a performance objective function, such as efficiency, redundancy, and demand tracking.
    Type: Application
    Filed: March 25, 2015
    Publication date: September 29, 2016
    Inventors: Luis R. Saavedra, Amrik Singh Bains, Samir Bouadjel
  • Patent number: 7858146
    Abstract: Methods of electroless metallalization are disclosed. The methods include treating through-holes of printed wiring boards to increase catalyst adsorption on the walls of the through-holes. The increased catalyst adsorption improves electroless metallization of the through-hole walls.
    Type: Grant
    Filed: June 29, 2007
    Date of Patent: December 28, 2010
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Mark A. Poole, Andrew J. Cobley, Amrik Singh, Kevin Bass
  • Patent number: 7665500
    Abstract: The invention is directed to a temporary window shade that may include an elongated cover having a top end and a bottom end, and that may be adapted to be oriented in a retracted position, an extended position, and a plurality of intermediate positions. The temporary window shade may also include a top rail that may be attached to the top end of the elongated cover, a cord having a first end that may be connected to the top rail, and a bottom rail that may be attached to the bottom end of the elongated cover. The bottom rail may have a slot disposed through a surface of the bottom rail, and the slot may be adapted to receive the cord. At least a portion of the slot may have a width less than the thickness of the cord such that the slot may engage the cord to support the weight of the bottom rail and an accumulated portion of the elongated cover when the cord is engaged by the at least a portion of the slot.
    Type: Grant
    Filed: August 14, 2007
    Date of Patent: February 23, 2010
    Assignee: Newell Window Furnishings, Inc.
    Inventors: Alejandro Rossato, Amrik Singh, Cliff Birch
  • Patent number: 7611569
    Abstract: Electroless copper and copper alloys plating baths are disclosed. The electroless baths are formaldehyde free and are environmentally friendly. The electroless baths are stable and deposit a bright or copper alloy on substrates.
    Type: Grant
    Filed: July 6, 2007
    Date of Patent: November 3, 2009
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Mark A. Poole, Andrew J. Cobley, Amrik Singh, Deborah V. Hirst
  • Patent number: 7527681
    Abstract: Electroless copper plating baths are disclosed. The electroless copper baths are formaldehyde free and are environmentally friendly. The electroless copper baths are stable and deposit a bright copper deposit on substrates.
    Type: Grant
    Filed: July 6, 2007
    Date of Patent: May 5, 2009
    Assignee: Rohm and Haas Electronic Materials LLP
    Inventors: Mark A. Poole, Andrew J. Cobley, Amrik Singh, Deborah V. Hirst
  • Patent number: 7501014
    Abstract: Electroless copper and copper alloy plating baths are disclosed. The electroless baths are formaldehyde free and are environmentally friendly. The electroless baths are stable and deposit a bright copper or copper alloy on substrates.
    Type: Grant
    Filed: July 6, 2007
    Date of Patent: March 10, 2009
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Mark A. Poole, Andrew J. Cobley, Amrik Singh, Deborah V. Hirst
  • Publication number: 20090004382
    Abstract: Methods of electroless metallalization are disclosed. The methods include treating through-holes of printed wiring boards to increase catalyst adsorption on the walls of the through-holes. The increased catalyst adsorption improves electroless metallization of the through-hole walls.
    Type: Application
    Filed: June 29, 2007
    Publication date: January 1, 2009
    Applicant: Rohm and Haas Electronic Materials LLC
    Inventors: Mark A. Poole, Andrew J. Cobley, Amrik Singh, Kevin Bass
  • Patent number: D807830
    Type: Grant
    Filed: February 17, 2016
    Date of Patent: January 16, 2018
    Assignee: Cisco Technology, Inc.
    Inventors: George Edward Curtis, Edward John Kliewer, Amrik Singh Bains