Abstract: Electroless copper plating baths are disclosed. The electroless copper baths are formaldehyde free and are environmentally friendly. The electroless copper baths are stable and deposit a bright copper deposit on substrates.

Abstract: Electroless copper and copper alloy plating baths are disclosed. The electroless baths are formaldehyde free and are environmentally friendly. The electroless baths are stable and deposit a bight copper or copper alloy on substrates.

Abstract: Electroless copper and copper alloys plating baths are disclosed. The electroless baths are formaldehyde and are environmentally friendly. The electroless baths are stable and deposit a bright or copper alloy on substrates.

Abstract: Electroless copper and copper alloy plating baths are disclosed. The electroless baths are formaldehyde free and are environmentally friendly. The electroless baths are stable and deposit a bright copper on substrates.

Abstract: The invention is directed to a temporary window shade that may include an elongated cover having a top end and a bottom end, and that may be adapted to be oriented in a retracted position, an extended position, and a plurality of intermediate positions. The temporary window shade may also include a top rail that may be attached to the top end of the elongated cover, a cord having a first end that may be connected to the top rail, and a bottom rail that may be attached to the bottom end of the elongated cover. The bottom rail may have a slot disposed through a surface of the bottom rail, and the slot may be adapted to receive the cord. At least a portion of the slot may have a width less than the thickness of the cord such that the slot may engage the cord to support the weight of the bottom rail and an accumulated portion of the elongated cover when the cord is engaged by the at least a portion of the slot.

Abstract: The invention is directed to a temporary window shade that may include an elongated cover having a top end and a bottom end, and that may be adapted to be oriented in a retracted position, an extended position, and a plurality of intermediate positions. The temporary window shade may also include a top rail that may be attached to the top end of the elongated cover, a cord having a first end that may be connected to the top rail, and a bottom rail that may be attached to the bottom end of the elongated cover. The bottom rail may have a slot disposed through a surface of the bottom rail, and the slot may be adapted to receive the cord. At least a portion of the slot may have a width less than the thickness of the cord such that the slot may engage the cord to support the weight of the bottom rail and an accumulated portion of the elongated cover when the cord is engaged by the at least a portion of the slot.

Abstract: A technique for guiding a riser in an offshore environment. The technique utilizes a keel guide that permits the passage of connectors or other components therethrough. A bushing is mounted within the keel guide to guide the relative linear motion of the riser assembly through the keel guide.

Abstract: The invention is directed to a temporary window shade that may include an elongated cover having a top end and a bottom end, and that may be adapted to be oriented in a retracted position, an extended position, and a plurality of intermediate positions. The temporary window shade may also include a top rail that may be attached to the top end of the elongated cover, a cord having a first end that may be connected to the top rail, and a bottom rail that may be attached to the bottom end of the elongated cover. The bottom rail may have a slot disposed through a surface of the bottom rail, and the slot may be adapted to receive the cord. At least a portion of the slot may have a width less than the thickness of the cord such that the slot may engage the cord to support the weight of the bottom rail and an accumulated portion of the elongated cover when the cord is engaged by the at least a portion of the slot.

Abstract: A combined adhesion promotion method of a metal to a non-conductive substrate and directly metallizing the non-conductive substrate with the metal. The method involves texturing a non-conductive substrate with a cobalt etch followed by applying a sulfide to the textured non-conductive substrate to provide an electrically conductive surface on the non-conductive substrate. After the surface of the non-conductive substrate has been made electrically conductive, the surface of the non-conductive substrate can be directly metallized. The method reduces the number of process steps for direct metallization of a non-conductive substrate. Thus, the method is more efficient in contrast to conventional methods of metallizing a non-conductive substrate.

Abstract: A technique for guiding a riser in an offshore environment. The technique utilizes a keel guide that permits the passage of connectors or other components therethrough. A bushing is mounted within the keel guide to guide the relative linear motion of the riser assembly through the keel guide.

Abstract: A control valve for a gas appliance comprising a gas valve body with a gas feed inlet, a first gas outlet for providing a gas supply to a pilot burner, a second gas outlet for providing a gas supply to an appliance main burner and valve means responsive to rotational movement of a spindle by an electric motor, whereupon rotational movement of the spindle opens the first gas outlet, and then further rotation produces axial movement of an associated rod member that opens or closes the second gas outlet.

Abstract: A combined adhesion promotion method of a metal to a non-conductive substrate and directly metallizing the non-conductive substrate with the metal. The method involves texturing a non-conductive substrate with a cobalt etch followed by applying a sulfide to the textured non-conductive substrate to provide an electrically conductive surface on the non-conductive substrate. After the surface of the non-conductive substrate has been made electrically conductive, the surface of the non-conductive substrate can be directly metallized. The method reduces the number of process steps for direct metallization of a non-conductive substrate. Thus, the method is more efficient in contrast to conventional methods of metallizing a non-conductive substrate.

Abstract: A recording medium on a hard disk is provided that includes a magnetic data recording layer on the disk, a hydrogenated carbon buffer layer over the data recording layer, and a nitrogenated carbon overcoat layer over the hydrogenated carbon buffer layer. The composition ratios and thickness of the recording and nitrogenated carbon overcoat layers are suitably controlled to optimum ranges.

Abstract: A method for manufacturing a recording medium on a hard disk includes forming a data recording layer on the disk, forming a nitrogenated carbon overcoat layer over the data recording layer, (with or without intervening layers), and the processing data recording layer to protect it from the nitrogen used in the process of forming the nitrogenated carbon. In one approach, the step of processing the data recording layer is accomplished by forming a buffer layer between the data recording layer and the overcoat layer by depositing carbon on the data recording layer using a carbon deposition process excluding nitrogen, then forming the overcoat layer by depositing carbon on the buffer layer using a carbon deposition process that includes a nitrogen source.

Abstract: A process is disclosed for the preparation of N.sup.G -monoalkyl-L-arginine and related compounds and salts thereof, for example N.sup.G -monomethyl-L-arginine by reacting N-alkylaminoiminomethane sulphonic acid of formula (II) with an amino acid of formula (III).

Abstract: Process for at least partially dissolving a copper oxide surface layer by contacting the surface layer with one or more copper oxide dissolving compounds. When used in the manufacture of a multilayer printed circuit board, the process improves adhesion between board layers, reduces or eliminates localized delamination of a multilayer board that occurs during through-hole drilling, and eliminates or substantially reduces the occurrence of pink ring.