Patents by Inventor AN-CHANG LEI

AN-CHANG LEI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20150378589
    Abstract: One aspect is a method for utilizing key points in a progress bar to browse through content. The method includes displaying one or more hill-shaped flags at each of one or more key points on the progress bar such that a hill top of each of the one or more hill-shaped flags corresponds to a respective key point of the one or more key points. The progress bar has a slider configured to slide along the progress bar. The method further includes sliding the slider through a first hill-shaped flag, of the one or more hill-shaped flags, on the progress bar automatically, responsive to browsing content. The method further includes decreasing, by a computer processor, a content browsing speed from a first speed to a second speed, responsive to the slider sliding through the first hill-shaped flag.
    Type: Application
    Filed: June 22, 2015
    Publication date: December 31, 2015
    Inventors: Jian Wen Chi, Run Hua Chi, Zhen Hong Ding, Fang Liang Dong, Chang Lei, Zhao Yang, Wei Jun Zheng
  • Publication number: 20080297645
    Abstract: An exemplary camera module includes a lens holder, a lens module, an image sensor chip, at least three apart bonding pads, and a light transmittance element. The lens module is received in the lens holder. The lens module includes a barrel and at least one lens received in the barrel. The image sensor chip includes a photosensitive area configured for receiving light transmitted through the lens module. The image sensor chip is attached to an end of the lens holder facing away from the lens module. The bonding pads are arranged on the image sensor chip around the photosensitive area. The light transmittance element is fixed on the image sensor chip via the at least three bonding pads. The present invention also relates to a method for manufacturing the camera module.
    Type: Application
    Filed: September 18, 2007
    Publication date: December 4, 2008
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: SHIH-MIN LO, AN-CHANG LEI, JEN-CHAO WANG
  • Publication number: 20080280389
    Abstract: A method for assembling a camera module includes following steps: providing a circuit board having a connecting region; disposing a liquid anisotropic conductive adhesive on the connecting region of the circuit board; placing an image sensor module, on the connecting region of the circuit board; thermal press-bonding the image sensor module onto the circuit board to fix the image sensor module with the circuit board. Because the anisotropic conductive adhesive before being disposed on the circuit board is liquid and doesn't needs to be cut, flow-shop operations are easy to achieve, and costs are decreased.
    Type: Application
    Filed: October 24, 2007
    Publication date: November 13, 2008
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: JEN-CHAO WANG, AN-CHANG LEI