Patents by Inventor An Cheon

An Cheon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11961030
    Abstract: A method includes receiving trace sensor data associated with a first manufacturing process of a manufacturing chamber. The method further includes processing the trace sensor data by a processing device to generate summary data associated with the trace sensor data. The method further includes generating a quality index score based on the summary data. The method further includes providing an alert to a user based on the quality index score. The alert includes an indication that the manufacturing chamber performance does not meet a first threshold.
    Type: Grant
    Filed: January 27, 2022
    Date of Patent: April 16, 2024
    Assignee: Applied Materials, Inc.
    Inventors: Sejune Cheon, Jeong Jin Hong, Mikyung Shim, Xiaoqun Zou, Jinkyeong Lee, Sang Hong Kim
  • Patent number: 11961640
    Abstract: A flexible flat cable according to various embodiments of the disclosure may include a first insulation layer having a plate shape, a first conductive pattern disposed on the first insulation layer, a second conductive pattern disposed on the first insulation layer to be spaced apart from the first conductive pattern at a predetermined interval, a second insulation layer covering at least a portion of the first conductive pattern and disposed on the first insulation layer to cover the first conductive pattern, a first shield member including a first shield layer disposed on the first insulation layer and the second insulation layer to cover the first conductive pattern and the second conductive pattern, and a second shield layer disposed on the first shield layer to cover the first shield layer, and a third insulation layer surrounding the first shield layer such that at least a portion of the first shield layer of the first shield member, which is exposed between the first insulation layer and the second shi
    Type: Grant
    Filed: July 15, 2020
    Date of Patent: April 16, 2024
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Bumhee Bae, Junghwan Yeom, Changwon Jang, Jeongnam Cheon
  • Patent number: 11959691
    Abstract: A refrigerator includes a cabinet and a door. The door includes a door body filled with an insulator and a door panel detachably mounted on the door body. The door panel includes a panel defining a front appearance of the door, and a panel bracket disposed on a rear surface of the panel and including a mounting protrusion protruding rearward. The door body includes a cap deco that defines a portion of a perimeter surface of the door body and includes a protrusion accommodating part receiving the mounting protrusion, and a deco cover that shields an opening of the cap deco and includes a restraining protrusion protruding into the cap deco. The restraining protrusion is in contact with the protrusion accommodating part when the deco cover is mounted and maintains a restrained state of the mounting protrusion and the protrusion accommodating part.
    Type: Grant
    Filed: July 7, 2022
    Date of Patent: April 16, 2024
    Assignee: LG Electronics Inc.
    Inventors: Omin Kwon, Sanghyun Cheon
  • Patent number: 11961207
    Abstract: Provided is an image processing apparatus including a memory storing one or more instructions and a processor configured to execute the one or more instructions stored in the memory, wherein the processor is further configured to execute the one or more instructions to generate a second image by performing a deconvolution operation on a first image and a kernel comprising one or more weights, set values of the one or more weights based on the second image, and adjust the values of the one or more weights based on positions of the one or more weights in the kernel.
    Type: Grant
    Filed: September 11, 2019
    Date of Patent: April 16, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Iljun Ahn, Yongsup Park, Jaeyeon Park, Minsu Cheon, Tammy Lee
  • Publication number: 20240118460
    Abstract: A window includes a window base with a groove having a recessed shape on an upper surface thereof, and a first blocking ink layer and a second blocking ink layer each disposed in the groove, where the first blocking ink layer and the second blocking ink layer are disposed in a same layer as each other, and the first blocking ink layer surrounds the second blocking ink layer in a plan view.
    Type: Application
    Filed: August 15, 2023
    Publication date: April 11, 2024
    Inventors: TECKSOO KIM, DONG-CHEON SHIN, JUNGA LEE, BANG-GEUL CHOI
  • Publication number: 20240121971
    Abstract: Solar cell modules and methods of fabrication are described. In an embodiment, a pair of tandem solar cells are bonded together along a contact ledge of a first tandem solar cell using a solid electrically conductive bonding material.
    Type: Application
    Filed: August 30, 2023
    Publication date: April 11, 2024
    Inventors: Tomas Leijtens, Jiang Huang, In Cheon Baik
  • Publication number: 20240115641
    Abstract: Disclosed are an oral film and stick jelly containing glutathione and a milk thistle extract. Provided are an oral disintegrating film, an oral mucosal adhesive film, and a stick jelly that contain glutathione, a milk thistle extract, or the like as an active ingredient, and thus are highly efficacious in improving absorption in the oral mucosa, antioxidant activity, and anti-inflammatory activity, strengthening immunity, and enhancing liver function of humans and companion animals.
    Type: Application
    Filed: February 17, 2022
    Publication date: April 11, 2024
    Applicants: ESTHER FORMULA CO., LTD., BIO360 CO., LTD
    Inventors: Esther LYUH, Kun Se KIM, Eun Soo SUH, Byoung Hag KIM, Mi Young AN, Dae Seong CHEON, Jae Hun KIM, Young Jae PARK, Byeong Hyeon KIM, Hyo Seon CHOI
  • Publication number: 20240120177
    Abstract: A substrate processing method is provided. The substrate processing method comprises loading a substrate onto a substrate support inside a chamber, forming a plasma inside the chamber, providing a first DC pulse signal to an electromagnet that generates a magnetic field inside the chamber and processing the substrate with the plasma, wherein the first DC pulse signal is repeated at a first period including a first section and a second section subsequent to the first section, the first DC pulse signal has a first level during the first section, and the first DC pulse signal has a second level different from the first level during the second section.
    Type: Application
    Filed: September 19, 2023
    Publication date: April 11, 2024
    Inventors: Ji Mo LEE, Dong Hyeon NA, Myeong Soo SHIN, Woong Jin CHEON, Kyung-Sun KIM, Jae Bin KIM, Tae-Hwa KIM, Seung Bo SHIM
  • Publication number: 20240120318
    Abstract: A semiconductor package includes a buffer die, semiconductor chip stacks stacked on the buffer die, each of the semiconductor chip stacks including a plurality of first semiconductor chips and a second semiconductor chip on the plurality of first semiconductor chips, and a mold layer covering an upper surface of the buffer die and side surfaces of the semiconductor chip stacks. Each of the first semiconductor chips and the second semiconductor chip includes a wiring part including multilayer wirings, an upper connection structure on the wiring part and having a plurality of upper conductive pads and a lower connection structure under the wiring part and having a plurality of lower conductive pads, and the second semiconductor chip further includes a redistribution layer on the upper connection structure and having an insulating layer and a plurality of redistribution pads in the insulating layer.
    Type: Application
    Filed: May 4, 2023
    Publication date: April 11, 2024
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Kyung Don Mun, Sang Cheon Park
  • Publication number: 20240120276
    Abstract: A three-dimensional semiconductor integrated circuit device including an inter-die interface is provided. The device includes a top die including a plurality of micro cells provided on a top surface of the top die, a plurality of micro bumps provided on a bottom surface of the top die, and wiring patterns connecting the plurality of micro cells to the plurality of micro bumps; and a bottom die including a plurality of macro cells provided on a top surface thereof, wherein the plurality of macro cells are electrically connected to the plurality of micro bumps, respectively, wherein a size of a region in which the plurality of micro cells are provided is smaller than a size of a region in which the plurality of micro bumps are provided.
    Type: Application
    Filed: July 27, 2023
    Publication date: April 11, 2024
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jae Seung CHOI, Byung-Su KIM, Bong Il PARK, Chang Seok KWAK, Sun Hee PARK, Sang Joon CHEON
  • Publication number: 20240119111
    Abstract: The present invention relates to a method and apparatus for performing two dimension fast fourier transform for hologram processing. A method for processing a hologram according to an embodiment of the present disclosure may comprise: generating complex data by multiplying the digital image by a random phase value; performing inverse fast fourier transform (IFFT) processing on the complex data; generating pattern information by multiplying a result of the IFFT processing by a quadrant phase; and processing the hologram based on the pattern information. Here, the IFFT processing may comprise a IFFT core operation that performs row-base IFFT and column-base IFFT on the complex data, and a single shift IFFT operation that applies a predefined rule to a result of one or more of the row-based IFFT or the column-based IFFT.
    Type: Application
    Filed: October 4, 2023
    Publication date: April 11, 2024
    Applicant: Electronics and Telecommunications Research Institute
    Inventors: Won Ok KWON, Sang Hoon CHEON
  • Patent number: 11954235
    Abstract: A data diode chip provides a flexible device for collecting data from a data source and transmitting the data to a data destination using one-way data transmission. On-chip processing elements allow the data diode to identify automatically the type of connectivity provided to the data diode and configure the data diode to handle the identified type of connectivity.
    Type: Grant
    Filed: June 12, 2023
    Date of Patent: April 9, 2024
    Assignee: Fend Incorporated
    Inventors: Sang Cheon Lee, Colin Patrick Dunn
  • Patent number: 11957069
    Abstract: An approach to provide a semiconductor structure for a phase change memory cell with a first liner material surrounding a sidewall of a hole in a dielectric material where the hole in the dielectric is on a bottom electrode in the dielectric material. The semiconductor structure includes a layer of a second liner material on the first liner material, where the second liner material has an improved contact resistance to a phase change material. The semiconductor structure includes the phase change material abutting the layer of the second liner material on the first liner material. The phase change material fills the hole in the dielectric material. The second liner material that is between the phase change material and the first liner material provides a lower contact resistivity with the phase change material in the crystalline phase than the first liner material.
    Type: Grant
    Filed: October 22, 2021
    Date of Patent: April 9, 2024
    Assignee: International Business Machines Corporation
    Inventors: Injo Ok, Oleg Gluschenkov, Alexander Reznicek, Soon-Cheon Seo
  • Patent number: 11955271
    Abstract: A radio frequency (RF) weak magnetic field detection sensor includes a ferromagnetic core, a pickup coil disposed to surround the ferromagnetic core, a substrate that includes an opening, a core pad connected to the ferromagnetic core and a coil pad connected to the pickup coil, and an insulating tube interposed between the ferromagnetic core and the pickup coil. The insulating tube includes a bobbin around which the pickup coil is wound, and a core hole formed to pass through the bobbin and configured to accommodate the ferromagnetic core.
    Type: Grant
    Filed: May 23, 2023
    Date of Patent: April 9, 2024
    Assignees: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE, KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Jang Yeol Kim, In Kui Cho, Hyunjoon Lee, Sang-Won Kim, Seong-Min Kim, Jung Ick Moon, Woo Cheon Park, Je Hoon Yun, Jaewoo Lee, Ho Jin Lee, Dong Won Jang, Kibeom Kim, Seungyoung Ahn
  • Patent number: 11955449
    Abstract: A semiconductor package includes a substrate, a first semiconductor chip disposed on the substrate, and a second semiconductor chip disposed on a top surface of the first semiconductor chip. The first semiconductor chip includes a conductive pattern disposed on the top surface of the first semiconductor chip and a first protective layer covering the top surface of the first semiconductor chip and at least partially surrounds the conductive pattern. The second semiconductor chip includes a first pad that contacts a first through electrode on a bottom surface of the second semiconductor chip. A second protective layer surrounds the first pad and covers the bottom surface of the second semiconductor chip. A third protection layer fills a first recess defined in the second protective layer to face the inside of the second protective layer. The first protective layer and the third protective layer contact each other.
    Type: Grant
    Filed: November 10, 2022
    Date of Patent: April 9, 2024
    Assignee: SAMSUNG ELECTRONICS CO, LTD.
    Inventors: Jihwan Suh, Un-Byoung Kang, Taehun Kim, Hyuekjae Lee, Jihwan Hwang, Sang Cheon Park
  • Patent number: 11953366
    Abstract: A fluid level measurement system using a buoyant body includes a guide part installed in a direction perpendicular to the bottom surface of a fluid storage tank, and provided with a space in which a fluid can move therein; a buoyant body inserted into the guide part, and configured to float along the surface of the fluid inside the guide part; and a measurement part coupled to the top end of the guide part, and configured to measure the level of the surface of the fluid inside the fluid storage tank by transmitting a signal toward the buoyant body in the inner space of the guide part and then receiving a signal reflected from the buoyant body.
    Type: Grant
    Filed: July 7, 2022
    Date of Patent: April 9, 2024
    Assignee: HANRA IMS CO., LTD
    Inventors: Suk Joon Ji, Young Gu Kim, Jong Min Chung, Chae Ho Lee, I-Hwan Cheon, Kwang Ik Chun, Dong Sik Jang
  • Patent number: 11956975
    Abstract: Structures and methods are provided for integrating a resistance random access memory (ReRAM) in a back-end-on-the-line (BEOL) fat wire level. In one embodiment, a ReRAM device area contact structure is provided in the BEOL fat wire level that has at least a lower via portion that contacts a surface of a top electrode of a ReRAM device area ReRAM-containing stack. In other embodiments, a tall ReRAM device area bottom electrode is provided in the BEOL fat wire level and embedded in a dielectric material stack that includes a dielectric capping layer and an interlayer dielectric material layer.
    Type: Grant
    Filed: September 16, 2021
    Date of Patent: April 9, 2024
    Assignee: International Business Machines Corporation
    Inventors: Soon-Cheon Seo, Dexin Kong, Takashi Ando, Paul Charles Jamison, Hiroyuki Miyazoe, Youngseok Kim, Nicole Saulnier, Vijay Narayanan, Iqbal Rashid Saraf
  • Publication number: 20240109461
    Abstract: A seat rail locking device for a vehicle includes a lower rail having a plurality of locking grooves formed in an inner flange and opened downward, a locking plate having a plurality of locking teeth configured to be inserted into or withdrawn from the plurality of locking grooves when the locking plate moves upward or downward, an upper rail inserted into the lower rail so as to be slidable straight and having a locking-lifting mechanism configured to switch a locking state by moving the locking plate upward or downward, and an anti-rotation mechanism configured to suppress a rotation of the locking plate against a transverse load applied to the upper rail.
    Type: Application
    Filed: September 12, 2023
    Publication date: April 4, 2024
    Inventors: Cheon KIM, Kyeong Ho SEO, Heoung Su LIM, Seong Jun HWANG
  • Publication number: 20240110868
    Abstract: A water examination device includes a main body; a fluid accommodation unit formed in the main body; a wave source for irradiating waves toward the fluid accommodation unit; a detector for detecting a laser speckle in time series, the laser speckle being generated due to multiple scattering of the waves in the fluid; and a controller for estimating existence of foreign material in the fluid in real-time by using the detected laser speckle. An imaginary first plane passing through the wave source is parallel to an imaginary second plane passing through the detector.
    Type: Application
    Filed: September 1, 2022
    Publication date: April 4, 2024
    Applicant: THE WAVE TALK, INC.
    Inventors: Young Dug KIM, Kyoung Man CHO, Doo Young CHEON
  • Patent number: 11947772
    Abstract: According to various embodiments, an electronic device including a memory, and at least one processor may be provided, wherein the at least one processor stores, in the memory, multiple files acquired based on execution of multiple applications and information on the multiple files including first information on the multiple applications and second information associated with the multiple files, executes a first application including at least one of an authority or a function for acquiring the information on the multiple files, and displays a first execution screen of the executed first application having a partial area including multiple thumbnails associated with at least some of the multiple files and multiple icons corresponding to applications, based on at least a part of the first information included in the information on the multiple files. Various other embodiments are possible.
    Type: Grant
    Filed: August 16, 2022
    Date of Patent: April 2, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Seongsu Yoon, Junho Kim, Hyejung Kim, Jaehong Cheon