Abstract: The present disclosure provides an electronic device including a substrate, a first pad, an insulating layer, a second pad, a conductive element and a chip. The first pad is disposed on the substrate. The insulating layer is disposed on the first pad and has a plurality of first openings. The second pad is electrically connected to the first pad through the first openings. The conductive particle is disposed on the second pad. The chip is electrically connected to the second pad through the conductive element. In a top view of the electronic device, the first openings are arranged along a long edge of the first pad, and an outline of at least one first opening has a curved shape.

Abstract: A composite film for use in an LED wafer-level packaging process to facilitate adhesion of an LED wafer to a carrier and an LED wafer-level packaging process carried out with a heating process are introduced. The composite film includes a substrate including a first surface and a second surface; a heat-resisting pressure-sensing adhesive formed on the first surface of the substrate to allow the LED wafer to be adhered to the substrate; and a heat-resisting thermally-visbreaking pressure-sensing adhesive formed on the second surface of the substrate to allow the substrate to be adhered to the carrier. The heat-resisting thermally-visbreaking pressure-sensing adhesive undergoes the heating process to reduce its adhesiveness strength; thus, upon completion of the LED wafer-level packaging process, the carrier can be detached from the composite film easily.

Abstract: Provided is a LED light board including a substrate, a plurality of LEDs, and a colloid layer. The substrate has a plurality of adjacent light emission areas. These LEDs are respectively disposed on these light emission areas. The colloid layer is disposed on these light emission areas. These LEDs are disposed between the substrate and the colloid layer, and are covered by the colloid layer. The colloid layer has a plurality of recesses on each light emission area, and these recesses expose an upper surface of the substrate corresponding to these recesses. At least a portion of the recesses on each light emission area are disposed around the corresponding LED.

Abstract: The present disclosure provides an electronic device including a substrate, a conductive pad, a chip and an insulating layer. The conductive pad is disposed on the substrate. The chip is disposed on the conductive pad. The insulating layer is disposed between the conductive pad and the chip, wherein the insulating layer includes an opening, and the chip is electrically connected to the conductive pad through the opening. An outline of the opening includes a plurality of curved corners in a normal direction of the substrate.

Abstract: A connection structure is provided. The connection structure includes a first conductive pad, a first insulating layer, a second conductive pad, a second insulating layer, and a third conductive pad. The first insulating layer is disposed on the first conductive pad and includes a first through-hole. The second conductive pad is disposed on the first insulating layer and electrically connected to the first conductive pad through the first through-hole. The second insulating layer is disposed on the second conductive pad and includes a second through-hole and a first recessed portion. The first recessed portion overlaps the first through-hole. The third conductive pad is disposed on the second insulating layer and electrically connected to the second conductive pad through the second through-hole. The third conductive pad extends on a surface of the first recessed portion.

Abstract: An electronic device is provided. The electronic device includes a substrate, a first conductive pad and a floating pad. The first conductive pad is disposed on the substrate. The floating pad is disposed on the substrate and adjacent to the first conductive pad. The floating pad includes a metal frame, and an inner edge of the metal frame defines an outline of an observation region. In addition, in a bottom-view diagram of the electronic device, the outline of the observation region has at least one arc-shaped edge.

Abstract: A light source module includes a substrate, a light-emitting element, an optical adhesive layer and a reflective structure. The light-emitting element is disposed on the substrate. The optical adhesive layer is disposed on the substrate and covers the light-emitting element. The reflective structure is disposed in the optical adhesive layer and located above the light-emitting element. A display device using the aforementioned light source module is also provided. The light source module provided by the invention has the function of protecting the light-emitting element and improves the problem of the large thickness of the direct-type backlight module in prior art.

Abstract: A carrier plate applied for a load port is provided, which includes a first guide slot is provided with a first switch to drive a first nozzle to move up and down to switch the position, a second guide slot is provided with a second switch to drive a second nozzle to move up and down to switch the position, a third guide slot is provided with a third switch to drive a third nozzle to move obliquely to switch the position, and a fourth guide slot is provided with a fourth nozzle to move obliquely to switch the position, thereby, the first nozzle, the second nozzle, the third nozzle and the fourth nozzle move to the positions corresponding to the air holes on each of the bottoms of the wafer transfer cassettes to inflate or exhaust the wafer transfer cassette.

Abstract: A carbon-fiber composite golf club head comprises a carbon-fiber composite body, at least one carbon-fiber composite component and at least one weight component. The carbon-fiber composite body comprises a hollow body portion, one-piece formed by stacking carbon fiber prepreg materials, and a striking face portion disposed at a front end of the body portion. The at least one carbon-fiber composite component is mounted to at least one opening of one or both of a crown and a sole of the body portion. The at least one weight component is mounted at a rear end of the carbon-fiber composite body. By combining the carbon-fiber composite body, one-piece formed by carbon fiber composite material and comprising the body portion and the striking face portion, with the at least one carbon-fiber composite component, a weight of a main part of a club head is significantly reduced to increase a weight of counterweight.

Abstract: The present disclosure relates to an acrylic modified polyester resin, and specifically, a modified polyester resin prepared by grafting an acrylic monomer to a polyester prepolymer. The polyester prepolymer is formed from pentaerythritol, a polyol monomer, an organic polycarboxylic acid monomer and a cycloalkanedicarboxylic acid monomer and contains a double bond on its backbone. The present disclosure also relates to a method for preparing the acrylic modified polyester resin.

Abstract: Embodiments relate to a data storage circuit and a control method thereof, and a storage apparatus. The data storage circuit includes a first storage array and a sense amplifier array, the first storage array is positioned on a side of the sense amplifier array, and the sense amplifier array is electrically connected to a main bit line. The first storage array includes a plurality of first sub storage arrays, each of the plurality of first sub storage arrays includes a plurality of first sub bit lines and a plurality of first selector switches, each of the plurality of first sub bit lines is electrically connected to the main bit line via one of the plurality of first selector switches, and the sense amplifier array is configured to amplify a signal of the main bit line.

Abstract: The present disclosure relates to a compound of Formula I, or a geometric isomer, enantiomer, diastereomer, racemate, atropisomer, pharmaceutically acceptable salt, prodrug or solvate thereof. The present disclosure further relates to a composition comprising the compound of Formula (I). The compound and the composition described herein can be used to inhibit NADPH oxidase activity.

Abstract: Batch semiconductor packaging structures with back-deposited shielding layer and manufacturing method are provided. A grid having multiple frames is glued on an adhesive substrate. Multiple semiconductor devices respectively align with corresponding frames and are stuck on the adhesive substrate. Then a metal layer covers the semiconductor devices and the grid. A distance between four peripheries of a bottom of each semiconductor device and the corresponding frame is smaller than a distance between the bottom and the adhesive substrate, so that the a portion of the metal layer extended to the peripheries of the bottom is effectively reduced during forming the metal layer. After the semiconductor devices are picked up, no metal scrap is remined thereon. Therefore, the adhesive substrate does not need to form openings in advance and is reusable. The grid is also reusable so the manufacturing cost of the present invention is decreased.

Abstract: The present disclosure relates to a system, a method and a computer-readable medium for rendering a streaming on a user terminal. The method includes rendering the streaming in a first mode, receiving an environment parameter of the user terminal, receiving a timing when the user terminal closes the streaming, determining a threshold value of the environment parameter based on the timing the user terminal closes the streaming, receiving an updated environment parameter of the user terminal, and rendering the streaming in a second mode if the updated environment parameter meets the threshold value. The second mode includes fewer data objects than the first mode or includes a downgraded version of a data object in the first mode for the rendering. The present disclosure can customize the rendering mode for each user and maximize the satisfaction of viewing streaming for each user.

Abstract: The present disclosure provides a process variation detection circuit and a process variation detection method. The process variation detection circuit is arranged in a chip and includes: a first ring oscillator, where a first number of auxiliary elements of a preset type are arranged between two adjacent inverters of the first ring oscillator; and a second ring oscillator, where a second number of auxiliary elements of a preset type are arranged between two adjacent inverters of the second ring oscillator, the second number is larger than the first number; wherein, a number of the inverter of the first ring oscillator is the same as a number of the inverter of the second ring oscillator; a type and a size of a transistor of the first ring oscillator are the same as a type and a size of a transistor of the second ring oscillator.

Abstract: A chip carrier device includes a frame, a chip support and a limiter. The chip support is disposed on the frame, and includes a supporting film for chips to be adhered thereto. A peripheral portion of the supporting film is attached to a surrounding frame part of the frame. A crossing portion of the supporting film passes through a center of the supporting film, and interconnects two opposite points of the peripheral portion. The supporting film is formed with through holes. The limiter includes a limiting part that interconnects two opposite points of the surrounding frame part, that is positioned corresponding to the crossing portion, and that is positioned on one side of the supporting film where the chips are to be arranged.

Abstract: This disclosure discloses a light-emitting bulb. The light-emitting bulb includes a cover, an electrical associated with the cover, a board arranged between the cover and the electrical connector, and a first light-emitting device disposed on the board. The first light-emitting device includes a carrier having a first side and a second side, a first electrode part disposed near the first side and extending to the second side, a bended part disposed near to the second side and spaced apart from the first electrode part, and a second electrode part extending from the bended part to the first side. No light-emitting diode unit is arranged on the second electrode part.

Abstract: The present disclosure provides a process corner detection circuit and a process corner detection method. The process corner detection circuit includes: M ring oscillators disposed inside a chip, M?1, where types of N-type transistors in the M ring oscillators are not exactly the same, and types of P-type transistors in the M ring oscillators are not exactly the same; transistor types of the M ring oscillators include all transistor types used in the chip; the ring oscillators include symmetric ring oscillators and asymmetric ring oscillators; types of N-type transistors and P-type transistors in the symmetric ring oscillators are the same; and types of N-type transistors and P-type transistors in the asymmetric ring oscillators are different.

Abstract: A light guide device having a first surface and a second surface opposite to each other is provided. The first surface includes a plurality of light guide microstructures arranged in a first direction. Cross sections of at least one part of the light guide microstructures in the first direction are non-isosceles triangles. Herein, a distribution position of the light guide microstructures whose cross sections are non-isosceles triangles are symmetrical to a central axis of the light guide device in the first direction, and a maximum base angle of the cross section of each of the light guide microstructures is away from the central axis. A display apparatus including the light guide device is also provided. Through the light guide device and the display apparatus provided by the disclosure, light emission intensity of the display apparatus at a large viewing angle is improved.