Abstract: A touch screen protective film structure with a penetrating-transmitting signal function includes a touch screen protective film and at least one signal transmission path. The at least one signal transmission path is embedded in the touch screen protective film partially or completely. The at least one signal transmission path includes a first end and a second end. The second end faces a specific touch area of a touch screen of an electronic apparatus. The first end receives a touch signal and transmits the touch signal to the second end. The specific touch area senses the touch signal to operate the electronic apparatus based on the touch signal. The second end defines at least one gap. The specific touch area penetrates the at least one gap defined by the second end to be touched for operating the electronic apparatus.

Abstract: A semiconductor device comprises a semiconductor die, comprising a stacking structure, a first bonding pad with a first bonding surface positioned away from the stack structure, and a second bonding pad; a carrier comprising a connecting surface; a third bonding pad which comprises a second bonding surface and is arranged on the connecting surface, and a fourth bonding pad arranged on the connecting surface of the carrier; and a conductive connecting layer comprising a first conductive part, comprising a first outer contour, and formed between and directly contacting the first bonding pad and the third bonding pad; a second conductive part formed between the second bonding pad and the fourth bonding pad; and a blocking part covering the first conductive part to form a covering area, wherein the first bonding surface comprises a first position which is the closest to the carrier within the covering area and a second position which is the farthest from the carrier within the covering area in a cross section vie

Abstract: A shower head assembly of an atomic layer deposition device has a first trapezoidal column component, a second trapezoidal column component and a column component, wherein a first bottom edge of the first trapezoidal column component is connected to a second top edge of the second trapezoidal column component, and a second bottom edge of the second trapezoidal column component is connected to a top edge of the column component. The first trapezoidal column component has a first bottom dimension distance, the second trapezoidal column component has a second vertical distance, and the column component has a column vertical distance, wherein a ratio of the column vertical distance to the second vertical distance is greater than or equal to 1.2, and a total distance of the second vertical distance and the column vertical distance is less than the first bottom dimension distance.

Abstract: An electronic device and a display panel are provided. The display panel includes a substrate, a light-emitting unit, a blocking structure and an encapsulation layer. The substrate has a through hole, a display area, and a non-display area disposed between the through hole and the display area. The light-emitting unit is arranged on the display area. The blocking structure is arranged on the non-display area. The encapsulation layer extends from the display area to the non-display area, and includes an organic layer and a first inorganic layer. A portion of the organic layer is disposed between the blocking structure and the first inorganic layer.

Abstract: A stylus, including a pen body, and a battery module and an electrically conductive structure disposed in the pen body, is provided. The pen body has a charging port. The battery module has at least one electrode. The electrically conductive structure includes a first electrically conductive assembly, a second electrically conductive assembly and a first electrically conductive elastic element. The first electrically conductive assembly is connected to the electrode, the second electrically conductive assembly is disposed between the first electrically conductive assembly and the charging port, and the first electrically conductive elastic element is connected to the second electrically conductive assembly and has a contact end. The contact end is in contact with the first electrically conductive assembly by an elastic force of the first electrically conductive elastic element, and the contact end is adapted to be separated from the first electrically conductive assembly by an external force.

Abstract: This disclosure discloses a light-emitting bulb. The light-emitting bulb includes a cover, an electrical associated with the cover, a board arranged between the cover and the electrical connector, and a first light-emitting device disposed on the board. The first light-emitting device includes a carrier having a first side and a second side, a first electrode part disposed near the first side and extending to the second side, a bended part disposed near to the second side and spaced apart from the first electrode part, and a second electrode part extending from the bended part to the first side. No light-emitting diode unit is arranged on the second electrode part.

Abstract: This invention provides an air disinfecting device for disinfecting or decontaminate air, which comprises a first metal plate and a second metal plate opposite to the first metal plate, a UVC LED mounted on the first metal plate, and a power supply providing power to the UVC LED. The second metal plate has an area large enough such that lights emitted from the UVC LED will be enclosed inside the air disinfection device.

Abstract: This invention provides an air disinfecting device for disinfecting or decontaminate air, which comprises a first metal plate and a second metal plate opposite to the first metal plate, a UVC LED mounted on the first metal plate, and a power supply providing power to the UVC LED. The second metal plate has an area large enough such that lights emitted from the UVC LED will be enclosed inside the air disinfection device.

Abstract: A stylus, including a pen body, and a battery module and an electrically conductive structure disposed in the pen body, is provided. The pen body has a charging port. The battery module has at least one electrode. The electrically conductive structure includes a first electrically conductive assembly, a second electrically conductive assembly and a first electrically conductive elastic element. The first electrically conductive assembly is connected to the electrode, the second electrically conductive assembly is disposed between the first electrically conductive assembly and the charging port, and the first electrically conductive elastic element is connected to the second electrically conductive assembly and has a contact end. The contact end is in contact with the first electrically conductive assembly by an elastic force of the first electrically conductive elastic element, and the contact end is adapted to be separated from the first electrically conductive assembly by an external force.

Abstract: The present invention relates to a two-phase composition comprising an oil phase comprising (a) at least one oil, and an aqueous phase comprising: (b) at least one crosslinked or non-crosslinked acrylamido-2-methylpropanesulfonic acid (AMPS) homopolymer; (c) at least one polysaccharide derived from microorganisms; and (d) water. The composition according to the present invention has two visually distinct phases, can transform into a single phase composition when being mixed, and can maintain the single phase for a long period of time without mixing.

Abstract: A package substrate has a substrate surface and a chip region on the substrate surface. The package substrate includes circuit layers, conductive vias, and byte region rows. The circuit layers are sequentially spaced below the substrate surface. Each conductive via is connected to at least two of the circuit layers. The byte region rows are arranged side by side sequentially from an edge of the chip region to a center of the chip region, and each byte region row includes byte regions arranged in a row. Each byte region includes pads located on the circuit layer closest to the substrate surface. The pads of the byte regions of the byte region row closer to the edge of the chip region extend from the chip region to an outside of the chip region through traces of the circuit layer closer to the substrate surface.

Abstract: A drive device with multiple swinging blocks drivingly connected with each other includes a driven unit connected with a driven apparatus (such as a power generation motor or a generator), a driving unit drivingly connected with the driven unit and an actuating unit connected with the driving unit. The driven unit includes a flywheel. The driving unit includes three dynamic energy modules respectively connected with the flywheel at intervals. Each dynamic energy module has a gear engaged with the flywheel and a swinging block disposed on the gear. There is a 120-degree angle difference between the corresponding angular positions of each two adjacent swinging blocks. The actuating unit includes an actuating motor, a driving member driven by the actuating motor and connected with one of the dynamic energy modules and transmission members drivingly connected with the dynamic energy modules for driving the driven unit to together rotate.

Abstract: A light-emitting diode circuit substrate including multiple light-emitting diode chips, a redistribution structure, and multiple bonding pads is provided. The light-emitting diode chips include multiple contacts. The redistribution structure is disposed on the light-emitting diode chips and in direct contact with the plurality of contacts. The plurality of bonding pads are disposed on the redistribution structure and electrically connected to the plurality of contacts of the light-emitting diode chips via the redistribution structure. A manufacturing method of the light-emitting diode circuit substrate is also provided.

Abstract: A touch screen protective film structure with a penetrating-transmitting signal function includes a touch screen protective film and at least one signal transmission path. The at least one signal transmission path is embedded in the touch screen protective film partially or completely. The at least one signal transmission path includes a first end and a second end. The second end faces a specific touch area of a touch screen of an electronic apparatus. The first end receives a touch signal and transmits the touch signal to the second end. The specific touch area senses the touch signal to operate the electronic apparatus based on the touch signal. The second end defines at least one gap. The specific touch area penetrates the at least one gap defined by the second end to be touched for operating the electronic apparatus.

Abstract: A semiconductor device comprises a semiconductor die, comprising a stacking structure, a first bonding pad with a first bonding surface positioned away from the stack structure, and a second bonding pad; a carrier comprising a connecting surface; a third bonding pad which comprises a second bonding surface and is arranged on the connecting surface, and a fourth bonding pad arranged on the connecting surface of the carrier; and a conductive connecting layer comprising a first conductive part, comprising a first outer contour, and formed between and directly contacting the first bonding pad and the third bonding pad; a second conductive part formed between the second bonding pad and the fourth bonding pad; and a blocking part covering the first conductive part to form a covering area, wherein the first bonding surface comprises a first position which is the closest to the carrier within the covering area and a second position which is the farthest from the carrier within the covering area in a cross section vie

Abstract: The embodiments of the present invention discloses an arrangement of bond pads on an integrated circuit chip. The integrated circuit chip includes: a first row of bond pads; and a second row of bond pads, wherein bond pads in the first row are positioned alternately with bond pads in the second row, and a short side of the bond pads in the first row and the second row is parallel to a long side of the integrated circuit chip. With this arrangement of bond pads on the integrated circuit chip, the bond pads may occupy a reduced area of a surface of the integrated circuit chip.

Abstract: A shower head assembly of an atomic layer deposition device has a first trapezoidal column component, a second trapezoidal column component and a column component, wherein a first bottom edge of the first trapezoidal column component is connected to a second top edge of the second trapezoidal column component, and a second bottom edge of the second trapezoidal column component is connected to a top edge of the column component. The first trapezoidal column component has a first bottom dimension distance, the second trapezoidal column component has a second vertical distance, and the column component has a column vertical distance, wherein a ratio of the column vertical distance to the second vertical distance is greater than or equal to 1.2, and a total distance of the second vertical distance and the column vertical distance is less than the first bottom dimension distance.

Abstract: The present disclosure provides a process corner detection circuit and a process corner detection method. The process corner detection circuit includes: M ring oscillators disposed inside a chip, M?1, where types of N-type transistors in the M ring oscillators are not exactly the same, and types of P-type transistors in the M ring oscillators are not exactly the same; transistor types of the M ring oscillators include all transistor types used in the chip; the ring oscillators include symmetric ring oscillators and asymmetric ring oscillators; types of N-type transistors and P-type transistors in the symmetric ring oscillators are the same; and types of N-type transistors and P-type transistors in the symmetric ring oscillators are different.

Abstract: This disclosure discloses a light-emitting bulb. The light-emitting bulb includes a cover, an electrical associated with the cover, a board arranged between the cover and the electrical connector, and a first light-emitting device disposed on the board. The first light-emitting device includes a carrier having a first side and a second side, a first electrode part disposed near the first side and extending to the second side, a bended part disposed near to the second side and spaced apart from the first electrode part, and a second electrode part extending from the bended part to the first side. No light-emitting diode unit is arranged on the second electrode part.

Abstract: A semiconductor package having a partial outer metal layer and packaging method thereof is disclosed. In the method, a specific packaging substrate or a specific positioning plate is used to package multiple semiconductor devices and a partial outer metal layer is quickly formed on an encapsulation of each semiconductor device in the same step.