Patents by Inventor An-Chin Cheng

An-Chin Cheng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240097888
    Abstract: In a file sharing system, a key manager unit realizes a correspondence between the first user identifier and the first public key in response to a registration request of the first user, generates a first key material for encrypting the first file into a first encrypted file, and generates a first credential according to the first user identifier, the first file identifier, the first public key and the first key material after receiving an access-right claim request to the first file from the first user. A file storage unit stores the first encrypted file and the first credential. The first user uses the first user identifier, the first file identifier and the first private key to retrieve the first key material out of the first credential, and uses the first key material to decrypt the first encrypted file into the first file.
    Type: Application
    Filed: September 18, 2023
    Publication date: March 21, 2024
    Inventors: CHIA-JUNG LIANG, CHIHHUNG LIN, CHIH-PING HSIAO, YU-JIE SU, CHIA-HSIN CHENG, TUN-HOU WANG, MENG-CHAO TSAI, YUEH-CHIN LIN
  • Publication number: 20240097323
    Abstract: In some examples, a device can include an antenna to emit waves in a radiation pattern having a first beamwidth, a directional radiation control device located in a path of the waves, where the directional radiation control device is to receive the waves from the antenna and is shaped to cause the waves to be directed in a different radiation pattern having a second beamwidth that is larger than the first beamwidth.
    Type: Application
    Filed: September 15, 2022
    Publication date: March 21, 2024
    Inventors: Chin-Hung Ma, Pai-Cheng Huang, Po Chao Chen, Shih-Huang Wu
  • Patent number: 11935452
    Abstract: An electronic circuit for operating with a display panel including touch sensors and fingerprint sensors is provided. The electronic circuit includes a first circuit, a second circuit, a third circuit, a first switch circuit and a control circuit. The first circuit generates display driving signals for driving the display panel. The second circuit receives fingerprint sensing signals from the fingerprint sensors. The third circuit determines a touch information according to touch sensing signals from the touch sensors. The first switch circuit includes a plurality of first switch units, each of the first switch units includes a first switch element and a second switch element. The control circuit controls the first switch circuit to transmit the display driving signals in a first time interval, controls the first switch circuit to transmit the fingerprint sensing signals in a second time interval, and controls the third circuit to receive the fingerprint sensing signals in a third time interval.
    Type: Grant
    Filed: February 17, 2023
    Date of Patent: March 19, 2024
    Assignee: Novatek Microelectronics Corp.
    Inventors: Huan-Teng Cheng, Ting-Hsuan Hung, Tzu-Wen Hsieh, Wei-Lun Shih, Huang-Chin Tang
  • Patent number: 11936299
    Abstract: A transistor includes a gate structure over a substrate, wherein the substrate includes a channel region. The transistor further includes a source/drain (S/D) in the substrate adjacent to the gate structure. The transistor further includes a lightly doped drain (LDD) region adjacent to the S/D, wherein a dopant concentration in the first LDD is less than a dopant concentration in the S/D. The transistor further includes a doping extension region adjacent the LDD region, wherein the doping extension region extends farther under the gate structure than the LDD region, and a maximum depth of the doping extension region is 10-times to 30-times greater than a maximum depth of the LDD.
    Type: Grant
    Filed: September 21, 2020
    Date of Patent: March 19, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chu Fu Chen, Chi-Feng Huang, Chia-Chung Chen, Chin-Lung Chen, Victor Chiang Liang, Chia-Cheng Pao
  • Publication number: 20240084447
    Abstract: A sealing article includes a body and a coating layer disposed on at least one surface of the body. The body comprises a polymeric elastomer such as perfluoroelastomer or fluoroelastomer. The coating layer comprises at least one metal. The sealing article may be a seal, a gasket, an O-ring, a T-ring or any other suitable product. The sealing article is resistant to ultra-violet (UV) light and plasma, and may be used for sealing a semiconductor processing chamber.
    Type: Application
    Filed: November 17, 2023
    Publication date: March 14, 2024
    Inventors: Peng-Cheng Hong, Jun-Liang Pu, W.L. Hsu, Chung-Hao Kao, Chia-Chun Hung, Cheng-Yi Wu, Chin-Szu Lee
  • Publication number: 20240087980
    Abstract: A semiconductor device includes a substrate, a dielectric layer disposed over the substrate, and an interconnect structure extending through the dielectric layer. The dielectric layer includes a low-k dielectric material which includes silicon carbonitride having a carbon content ranging from about 30 atomic % to about 45 atomic %. The semiconductor device further includes a thermal dissipation feature extending through the dielectric layer and disposed to be spaced apart from the interconnect structure.
    Type: Application
    Filed: February 17, 2023
    Publication date: March 14, 2024
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Kai-Fang CHENG, Cherng-Shiaw TSAI, Cheng-Chin LEE, Yen-Ju WU, Yen-Pin HSU, Li-Ling SU, Ming-Hsien LIN, Hsiao-Kang CHANG
  • Publication number: 20240087207
    Abstract: Disclosed herein are system, method, and computer program product embodiments for reducing GPU load by programmatically controlling shading rates in computer graphics. GPU load may be reduced by applying different shading rates to different screen regions. By reading the depth buffer of previous frames and performing image processing, thresholds may be calculated that control the shading rates. The approach may be run on any platform that supports VRS hardware and primitive- or image-based VRS. The approach may be applied on a graphics driver installed on a client device, in a firmware layer between hardware and a driver, in a software layer between a driver and an application, or in hardware on the client device. The approach is flexible and adaptable and calculates and sets the variable rate shading based on the graphics generated by an application without requiring the application developer to manually set variable rate shading.
    Type: Application
    Filed: September 14, 2022
    Publication date: March 14, 2024
    Applicant: MediaTek Inc.
    Inventors: Po-Yu HUANG, Shih-Chin LIN, Jen-Jung CHENG, Tu-Hsiu LEE
  • Publication number: 20240081157
    Abstract: A semiconductor device includes a magnetic tunneling junction (MTJ) on a substrate, a first spacer on one side of the of the MTJ, a second spacer on another side of the MTJ, a first metal interconnection on the MTJ, and a liner adjacent to the first spacer, the second spacer, and the first metal interconnection. Preferably, each of a top surface of the MTJ and a bottom surface of the first metal interconnection includes a planar surface and two sidewalls of the first metal interconnection are aligned with two sidewalls of the MTJ.
    Type: Application
    Filed: November 6, 2023
    Publication date: March 7, 2024
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Hui-Lin Wang, Chen-Yi Weng, Yi-Wei Tseng, Chin-Yang Hsieh, Jing-Yin Jhang, Yi-Hui Lee, Ying-Cheng Liu, Yi-An Shih, I-Ming Tseng, Yu-Ping Wang
  • Patent number: 11920238
    Abstract: A method of making a sealing article that includes a body and a coating layer disposed on at least one surface of the body. The body comprises a polymeric elastomer such as perfluoroelastomer or fluoroelastomer. The coating layer comprises at least one metal. The sealing article may be a seal, a gasket, an O-ring, a T-ring or any other suitable product. The sealing article is resistant to ultra-violet (UV) light and plasma, and may be used for sealing a semiconductor processing chamber.
    Type: Grant
    Filed: July 22, 2022
    Date of Patent: March 5, 2024
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Peng-Cheng Hong, Jun-Liang Pu, W. L. Hsu, Chung-Hao Kao, Chia-Chun Hung, Cheng-Yi Wu, Chin-Szu Lee
  • Publication number: 20240071888
    Abstract: A package structure including a redistribution circuit structure, a wiring substrate, first conductive terminals, an insulating encapsulation, and a semiconductor device is provided. The redistribution circuit structure includes stacked dielectric layers, redistribution wirings and first conductive pads. The first conductive pads are disposed on a surface of an outermost dielectric layer among the stacked dielectric layers, the first conductive pads are electrically connected to outermost redistribution pads among the redistribution wirings by via openings of the outermost dielectric layer, and a first lateral dimension of the via openings is greater than a half of a second lateral dimension of the outermost redistribution pads. The wiring substrate includes second conductive pads. The first conductive terminals are disposed between the first conductive pads and the second conductive pads. The insulating encapsulation is disposed on the surface of the redistribution circuit structure.
    Type: Application
    Filed: August 28, 2022
    Publication date: February 29, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chien-Chang Lin, Yen-Fu Su, Chin-Liang Chen, Wei-Yu Chen, Hsin-Yu Pan, Yu-Min Liang, Hao-Cheng Hou, Chi-Yang Yu
  • Publication number: 20240071906
    Abstract: A semiconductor structure including a substrate and a pad structure is provided. The pad structure is located on the substrate. The pad structure includes material pairs and pads. The material pairs are stacked on the substrate to form a stair step structure. Each of the material pairs includes a conductive layer and a dielectric layer located on the conductive layer. Each of the pads includes a conductive pillar and a pad layer. The conductive pillar is embedded in the material pair and is connected to the conductive layer of the material pair. The pad layer is located on the conductive pillar.
    Type: Application
    Filed: August 31, 2022
    Publication date: February 29, 2024
    Applicant: MACRONIX International Co., Ltd.
    Inventor: Chin-Cheng Yang
  • Publication number: 20240074328
    Abstract: A semiconductor device includes a magnetic tunneling junction (MTJ) on a substrate, a first spacer on one side of the of the MTJ, a second spacer on another side of the MTJ, a first metal interconnection on the MTJ, and a liner adjacent to the first spacer, the second spacer, and the first metal interconnection. Preferably, each of a top surface of the MTJ and a bottom surface of the first metal interconnection includes a planar surface and two sidewalls of the first metal interconnection are aligned with two sidewalls of the MTJ.
    Type: Application
    Filed: November 6, 2023
    Publication date: February 29, 2024
    Applicant: United Microelectronics Corp.
    Inventors: Hui-Lin Wang, Chen-Yi Weng, Yi-Wei Tseng, Chin-Yang Hsieh, Jing-Yin Jhang, Yi-Hui Lee, Ying-Cheng Liu, Yi-An Shih, I-Ming Tseng, Yu-Ping Wang
  • Publication number: 20240067476
    Abstract: A medium thickness detection device includes: a light emitting element; a constant-current control circuit controlling, in a constant-current manner, the light emitting element to output light passing through a medium for an irradiation time; a light-receiving element receiving the light passing through the medium to obtain an analog signal; a receiver circuit receiving the analog signal; a maximum holding circuit holding a maximum of the analog signal; an analog-to-digital converter circuit reading the maximum of the analog signal and converting the maximum of the analog signal into a digital signal; a reset circuit resetting the maximum holding circuit; and a processor controlling operations of the constant-current control circuit, the reset circuit and the analog-to-digital converter circuit, and determining a thickness of the medium according to the digital signal when a specification of the medium is unknown.
    Type: Application
    Filed: June 14, 2023
    Publication date: February 29, 2024
    Inventors: WEI CHIN CHENG, YU-LANG WANG
  • Patent number: 11912837
    Abstract: The present disclosure provides a thin film including a first thermoplastic polyolefin (TPO) elastomer which is anhydride-grafted. The present disclosure further provides a method for manufacturing the thin film, a laminated material and a method for adhesion.
    Type: Grant
    Filed: August 2, 2021
    Date of Patent: February 27, 2024
    Assignee: SAN FANG CHEMICAL INDUSTRY CO., LTD.
    Inventors: Chih-Yi Lin, Kuo-Kuang Cheng, Chi-Chin Chiang, Wen-Hsin Tai, Ming-Chen Chang
  • Patent number: 11915992
    Abstract: A method for forming a package structure is provided, including forming an interconnect structure over a carrier substrate and forming a semiconductor die over a first side of the interconnect structure. A removable film is formed over the semiconductor die. The method includes forming a first stacked die package structure over the first side of the interconnect structure. A top surface of the removable film is higher than a top surface of the first stacked die package structure. The method includes forming a package layer, removing a portion of the package layer to expose a portion of the removable film, removing the removable film to form a recess, forming a lid structure over the semiconductor die and the first stacked die package structure. The lid structure has a main portion and a protruding portion disposed in the recess and extending from the main portion.
    Type: Grant
    Filed: February 24, 2022
    Date of Patent: February 27, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Shin-Puu Jeng, Po-Yao Lin, Feng-Cheng Hsu, Shuo-Mao Chen, Chin-Hua Wang
  • Patent number: 11912816
    Abstract: A polymer and a light-emitting device employing the same are provided. The polymer includes a first repeat unit with a structure represented by Formula (I): wherein the definitions of R1, R2, A1, A2, A3, and Z1 and n are as defined in the specification. At least one of A1, A2, and A3 is not hydrogen.
    Type: Grant
    Filed: April 28, 2021
    Date of Patent: February 27, 2024
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Chin-Hui Chou, Han-Cheng Yeh, Jia-Lun Liou, Mei-Rurng Tseng
  • Patent number: 11898061
    Abstract: A modified conductive structure includes a conductive substrate and a polymer film disposed over a surface of the polymer film. A chemical bond exists between the polymer film and the conductive substrate, and the polymer film includes repeating units as shown below: wherein A is an antifouling molecule group; B is a sulfur-containing group or a nitrogen-containing group; R is a single bond or a first linking group; C is -L-E, wherein L is a second linking group, E is an enzyme unit; x and z are each independently 0 or an integer from 1 to 10000, and y is an integer from 1 to 10000; o is 0 or an integer from 1 to 50, and when o is an integer from 1 to 50, m and n are each independently 0 or an integer from 1 to 50.
    Type: Grant
    Filed: October 21, 2019
    Date of Patent: February 13, 2024
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Hsin-Chieh Lin, Chih Chang, Chin Pen Lai, Wang-Chin Cheng
  • Patent number: 11902368
    Abstract: A method is provided for managing over-the-top delivery of content through a plurality of content delivery networks (CDN). The method provided works transparently with standard HTTP servers supporting an initial request for content from a client to a first preferred CDN. If the first CDN does not have the content, the method includes provisions for the first CDN to acquire the content from a second CDN, or for the client to request the content from a second CDN directly. A system is also specified for implementing a client and server infrastructure in accordance with the provisions of the method.
    Type: Grant
    Filed: January 22, 2021
    Date of Patent: February 13, 2024
    Assignee: Telefonaktiebolaget LM Ericsson (publ)
    Inventors: Kevin J. Ma, Raj Nair, Robert Hickey, Daniel Biagini, Chin-Cheng Wu
  • Patent number: 11901311
    Abstract: A method of fabricating a memory device includes patterning a stacked structure to form a first staircase structure and a second staircase structure; patterning a conductive layer under the stacked structure to form a first slit trench along a first direction; forming a first dielectric layer overlaying the first staircase structure and the second staircase structure and filling into the first slit trench, wherein the first dielectric layer filled in the first slit trench forms a first slit; patterning the first dielectric layer, the stacked structure, and the conductive layer to form multiple second slit trenches, wherein the second slit trenches along a second direction perpendicular to the first direction; performing a replacement process to replace the sacrificial layers with multiple gate conductive layers; and filling a second dielectric layer in the second slit trenches to form multiple second slits.
    Type: Grant
    Filed: July 30, 2021
    Date of Patent: February 13, 2024
    Assignee: MACRONIX International Co., Ltd.
    Inventor: Chin-Cheng Yang
  • Patent number: 11898655
    Abstract: A tank valve system comprises a main valve body, an overfill protection device (OPD), a gauge drive apparatus and a fuel level indicator. The OPD and gauge drive apparatus are configured to both be inserted through a narrow neck of a fuel storage tank prior to connecting the valve body to the neck. The valve body includes a primary fuel channel and a shuttle interface channel. The OPD includes an overfill float driving an overfill shutoff valve for controlling fluid flow from the primary channel into the tank. The gauge drive apparatus includes a gauge float, a shuttle, and an elongated extension body. The gauge float is movable with respect to the extension body between an uppermost position and a lowermost position, thereby driving the shuttle. The shuttle has a gauge actuation portion transportable within the shuttle interface channel to thereby actuate the fuel level indicator.
    Type: Grant
    Filed: July 22, 2022
    Date of Patent: February 13, 2024
    Assignee: YSN Imports, LLC
    Inventors: Shmuel Dovid Newman, Chin-Cheng Chang