Patents by Inventor An-Chun LIU

An-Chun LIU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240121552
    Abstract: The present disclosure provides a vibrating diaphragm for a miniature sound-producing device and the miniature sound-producing device. The vibrating diaphragm is made of nitrile rubber; the nitrile rubber is prepared by performing cross-linking polymerization on polyacrylonitrile as a polymerization main monomer and a crosslinking monomer which is polybutadiene, and the content of a polyacrylonitrile block of the polymerization main monomer in the nitrile rubber is 10 to 70 wt %. The vibrating diaphragm provided by the present disclosure has more excellent structural stability, anti-polarization capability and low frequency sensitivity. The miniature sound-producing device provided by the present disclosure has more excellent acoustic performance.
    Type: Application
    Filed: December 24, 2019
    Publication date: April 11, 2024
    Applicant: Goertek, Inc.
    Inventors: Bing Hui, Fengguang Ling, Chun Li, Chunfa Liu
  • Publication number: 20240117154
    Abstract: Disclosed are a vibrating diaphragm of a sound-producing apparatus and the sound-producing apparatus. The vibrating diaphragm includes at least one elastomer layer, wherein the elastomer layer is made of butadiene rubber; the butadiene rubber is any one of nickel butadiene rubber, rare earth butadiene rubber and cobalt butadiene rubber, and a content of cis-form is greater than 80% to 100%. The vibrating diaphragm of the present disclosure can maintain excellent acoustic performance under extreme conditions of low temperature. (FIG.
    Type: Application
    Filed: December 25, 2019
    Publication date: April 11, 2024
    Applicant: Goertek Inc.
    Inventors: WEIFENG PENG, Fengguang Ling, Chun Li, Chunla Liu
  • Patent number: 11955338
    Abstract: A method includes providing a substrate having a surface such that a first hard mask layer is formed over the surface and a second hard mask layer is formed over the first hard mask layer, forming a first pattern in the second hard mask layer, where the first pattern includes a first mandrel oriented lengthwise in a first direction and a second mandrel oriented lengthwise in a second direction different from the first direction, and where the first mandrel has a top surface, a first sidewall, and a second sidewall opposite to the first sidewall, and depositing a material towards the first mandrel and the second mandrel such that a layer of the material is formed on the top surface and the first sidewall but not the second sidewall of the first mandrel.
    Type: Grant
    Filed: January 30, 2023
    Date of Patent: April 9, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Shih-Chun Huang, Ya-Wen Yeh, Chien-Wen Lai, Wei-Liang Lin, Ya Hui Chang, Yung-Sung Yen, Ru-Gun Liu, Chin-Hsiang Lin, Yu-Tien Shen
  • Patent number: 11955441
    Abstract: An interconnect structure comprises a first dielectric layer, a first metal layer, a second dielectric layer, a metal via, and a second metal layer. The first dielectric layer is over a substrate. The first metal layer is over the first dielectric layer. The first metal layer comprises a first portion and a second portion spaced apart from the first portion. The second dielectric layer is over the first metal layer. The metal via has an upper portion in the second dielectric layer, a middle portion between the first and second portions of the first metal layer, and a lower portion in the first dielectric layer. The second metal layer is over the metal via. From a top view the second metal layer comprises a metal line having longitudinal sides respectively set back from opposite sides of the first portion of the first metal layer.
    Type: Grant
    Filed: March 28, 2022
    Date of Patent: April 9, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Jian-Hong Lin, Kuo-Yen Liu, Hsin-Chun Chang, Tzu-Li Lee, Yu-Ching Lee, Yih-Ching Wang
  • Patent number: 11955026
    Abstract: A method, computer program product, and computer system for public speaking guidance is provided. A processor retrieves speaker data regarding a speech made by a user. A processor separates the speaker data into one or more speaker modalities. A processor extracts one or more speaker features from the speaker data for the one or more speaker modalities. A processor generates a performance classification based on the one or more speaker features. A processor sends to the user guidance regarding the speech based on the performance classification.
    Type: Grant
    Filed: September 26, 2019
    Date of Patent: April 9, 2024
    Assignee: International Business Machines Corporation
    Inventors: Cheng-Fang Lin, Ching-Chun Liu, Ting-Chieh Yu, Yu-Siang Chen, Ryan Young
  • Publication number: 20240113575
    Abstract: A hybrid permanent magnet motor rotor rotates around a central axis, and includes: a rotor core provided with a plurality of magnet installation slots; and a plurality of magnet parts embedded inside a plurality of magnet installation slots respectively, wherein the rotor is provided with a plurality of first magnetic pole parts and a plurality of second magnetic pole parts, the magnetic poles of the first magnetic pole part and the second magnetic pole part are arranged in opposite and alternately in the circumferential direction, and the magnetic placement of the first magnetic pole part is different from that of the second magnetic pole part, the amount of magnets used in the second magnetic pole part is greater than that used in the first magnetic pole part.
    Type: Application
    Filed: August 25, 2023
    Publication date: April 4, 2024
    Inventors: Kuan YANG, Pei-Chun SHIH, Ta-Yin LUO, Guo-Jhih YAN, Sheng-Chan YEN, Cheng-Tsung LIU
  • Publication number: 20240113071
    Abstract: An integrated circuit package including electrically floating metal lines and a method of forming are provided. The integrated circuit package may include integrated circuit dies, an encapsulant around the integrated circuit dies, a redistribution structure on the encapsulant, a first electrically floating metal line disposed on the redistribution structure, a first electrical component connected to the redistribution structure, and an underfill between the first electrical component and the redistribution structure. A first opening in the underfill may expose a top surface of the first electrically floating metal line.
    Type: Application
    Filed: January 5, 2023
    Publication date: April 4, 2024
    Inventors: Chung-Shi Liu, Mao-Yen Chang, Yu-Chia Lai, Kuo-Lung Pan, Hao-Yi Tsai, Ching-Hua Hsieh, Hsiu-Jen Lin, Po-Yuan Teng, Cheng-Chieh Wu, Jen-Chun Liao
  • Publication number: 20240114359
    Abstract: Apparatus and methods are provided for AI-ML model storage and transfer in the wireless network. In one novel aspect, the AI-ML model is stored at the AI server and transferred through the user plane (UP). In one embodiment, UE downloads the AI-ML model from the AI server through the UP connection. In one embodiment, the AI-ML model is updated at the RAN node, and the UE downloads the AI-ML model through the AI server. In another embodiment, the AI-ML model is updated at the UE, and the UE uploads the AI-ML model to the AI server through the UP connection. In another embodiment, the UE uploads the AI-ML model to the RAN through the AI server. In one embodiment, the UE mobility triggers the AI-ML model transfer. In one novel aspect, the AI dataset is shared and transferred among different entities through the UP connection or a new AI plane.
    Type: Application
    Filed: September 14, 2023
    Publication date: April 4, 2024
    Inventors: Ta-Yuan Liu, Hao Bi, CHIA-CHUN HSU
  • Publication number: 20240113414
    Abstract: Disclosed is an electronic device including a device body and an antenna module. The antenna module includes a conductive element and at least one antenna element. The conductive element includes a main body portion and at least one assembly portion connected with each other. The at least one assembly portion is assembled on the device body. The at least one antenna element is disposed on the device body and coupled with the conductive element to excite a first resonance mode. The at least one assembly portion overlaps the at least one antenna element in the length direction of the main body portion.
    Type: Application
    Filed: September 24, 2023
    Publication date: April 4, 2024
    Applicant: COMPAL ELECTRONICS, INC.
    Inventors: Chih-Heng Lin, Li-Chun Lee, Shih-Chia Liu, Jui-Hung Lai, Hung-Yu Yeh
  • Publication number: 20240114291
    Abstract: Provided is a vibrating diaphragm of a sound-producing apparatus. The vibrating diaphragm includes at least one elastomer layer, wherein the elastomer layer is made from polysulfide rubber; the polysulfide rubber is any one of type A polysulfide rubber, type FA polysulfide rubber and type ST polysulfide rubber, and a molecular weight of the polysulfide rubber is 1000-500000.
    Type: Application
    Filed: December 25, 2019
    Publication date: April 4, 2024
    Applicant: Goertek Inc.
    Inventors: WEIFENG PENG, Fengguang Ling, Chun Li, Chunfa Liu
  • Patent number: 11945950
    Abstract: The present invention provides a germ-repellent silicone rubber comprising: a silicone rubber substrate and a germ-repellent active ingredient incorporated therein; wherein, the silicone rubber substrate includes polydimethylsiloxane; the germ-repellent active ingredients include poly(ethylene oxide) and silicone oil or their derivatives. The disclosed germ-repellent silicone rubber reduces the bacterial growth by inhibiting their adherence to the surface instead of killing them, does not contribute to super bacteria formation nor cause skin irritation.
    Type: Grant
    Filed: October 22, 2021
    Date of Patent: April 2, 2024
    Assignee: Hongrita Plastics Ltd.
    Inventors: Xiaonan Huang, Xianqiao Liu, Chun Kit Choi
  • Publication number: 20240101768
    Abstract: Disclosed are a vibrating diaphragm of a sound-producing apparatus and the sound-producing apparatus. The vibrating diaphragm includes a polyurethane rubber film layer and the polyurethane rubber film layer includes a block polymer formed by soft segment portions and hard segment portions that are arranged alternately, wherein each of the soft segment portions includes polyhydric alcohol and each of the hard segment portions includes isocyanate and a chain extender, and the polyurethane rubber is represented by a structural formula as follows: wherein R is the chain extender, R1 is polyhydric alcohol and n is a natural number. (FIG.
    Type: Application
    Filed: December 25, 2019
    Publication date: March 28, 2024
    Applicant: Goertek Inc.
    Inventors: Shuqiang Wang, Fengguang Ling, Chun Li, Chunfa Liu
  • Publication number: 20240106104
    Abstract: An electronic device includes a device body and an antenna module disposed in the device body and including a conductive structure and a coaxial cable including a core wire, a shielding layer wrapping the core wire, and an outer jacket wrapping the shielding layer. The conductive structure includes a structure body and a slot formed on the structure body and penetrating the structure body in a thickness direction of the structure body. A section of the shielding layer extends from the outer jacket and is connected to the structure body. A physical portion of the structure body and the section of the shielding layer are respectively located on two opposite sides of the slot in a width direction of the slot. A section of the core wire extends from the section of the shielding layer and overlaps the slot and the physical portion in the thickness direction.
    Type: Application
    Filed: September 8, 2023
    Publication date: March 28, 2024
    Applicant: COMPAL ELECTRONICS, INC.
    Inventors: Hung-Yu Yeh, Shih-Chia Liu, Yen-Hao Yu, Li-Chun Lee, Chih-Heng Lin, Jui-Hung Lai
  • Patent number: 11941298
    Abstract: A host system initiates an abort of a command that has been placed into a submission queue (SQ) of the host system. The host system identifies at least one of a first outcome and a second outcome. When the first outcome indicates that the command is not completed and the second outcome indicates that the SQ entry has been fetched from the SQ, the host system sends an abort request to a storage device, and issues a cleanup request to direct the host controller to reclaim host hardware resources allocated to the command. The host system adds a completion queue (CQ) entry to a CQ and sets an overall command status (OCS) value of the CQ entry based on at least one of the first outcome and the second outcome.
    Type: Grant
    Filed: April 19, 2022
    Date of Patent: March 26, 2024
    Assignee: MediaTek Inc.
    Inventors: Chih-Chieh Chou, Chia-Chun Wang, Liang-Yen Wang, Chin Chin Cheng, Szu-Chi Liu
  • Patent number: 11941841
    Abstract: A computer-implemented method according to one embodiment includes running an initial network on a plurality of images to detect actors pictured therein and body joints of the detected actors. The method further includes running fully-connected networks in parallel, one fully-connected network for each of the detected actors, to reconstruct complete three-dimensional poses of the actors. Sequential model fitting is performed on the plurality of images. The sequential model fitting is based on results of running the initial network and the fully-connected networks. The method further includes determining, based on the sequential model fitting, a locational position for a camera in which the camera has a view of a possible point of collision of two or more of the actors. The camera is instructed to be positioned in the locational position.
    Type: Grant
    Filed: September 22, 2021
    Date of Patent: March 26, 2024
    Assignee: International Business Machines Corporation
    Inventors: Yu-Siang Chen, Ching-Chun Liu, Ryan Young, Ting-Chieh Yu
  • Publication number: 20240095989
    Abstract: Apparatuses, systems, and techniques to generate a video using two or more images comprising objects to be included in the video. In at least one embodiment, objects are identified in two or more images using one or more neural networks, to generate a video to include the objects in the video.
    Type: Application
    Filed: September 15, 2022
    Publication date: March 21, 2024
    Inventors: Arun Mohanray Mallya, Ting-Chun Wang, Ming-Yu Liu
  • Publication number: 20240094482
    Abstract: In some examples, an electronic device includes a light guide. In some examples, the light guide includes a facial side and a rear side. In some examples, the facial side includes a lens to focus incoming light. In some examples, the rear side includes exit features to guide outgoing light. In some examples, the electronic device includes an image sensor disposed behind the lens to capture the incoming light.
    Type: Application
    Filed: September 21, 2022
    Publication date: March 21, 2024
    Inventors: Super Liao, Xiao Jun Zhu, Hai Tao Liu, Hong Chun Wang
  • Publication number: 20240096781
    Abstract: A package structure including a semiconductor die, a redistribution circuit structure and an electronic device is provided. The semiconductor die is laterally encapsulated by an insulating encapsulation. The redistribution circuit structure is disposed on the semiconductor die and the insulating encapsulation. The redistribution circuit structure includes a colored dielectric layer, inter-dielectric layers and redistribution conductive layers embedded in the inter-dielectric layers. The electronic device is disposed over the colored dielectric layer and electrically connected to the redistribution circuit structure.
    Type: Application
    Filed: March 20, 2023
    Publication date: March 21, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chun-Ti Lu, Hao-Yi Tsai, Chia-Hung Liu, Yu-Hsiang Hu, Hsiu-Jen Lin, Tzuan-Horng Liu, Chih-Hao Chang, Bo-Jiun Lin, Shih-Wei Chen, Hung-Chun Cho, Pei-Rong Ni, Hsin-Wei Huang, Zheng-Gang Tsai, Tai-You Liu, Po-Chang Shih, Yu-Ting Huang
  • Publication number: 20240096784
    Abstract: Some embodiments of the present disclosure relate to an integrated chip including an extended via that spans a combined height of a wire and a via and that has a smaller footprint than the wire. The extended via may replace a wire and an adjoining via at locations where the sizing and the spacing of the wire are reaching lower limits. Because the extended via has a smaller footprint than the wire, replacing the wire and the adjoining via with the extended via relaxes spacing and allows the size of the pixel to be further reduced. The extended via finds application for capacitor arrays used for pixel circuits.
    Type: Application
    Filed: January 3, 2023
    Publication date: March 21, 2024
    Inventors: Meng-Hsien Lin, Hsing-Chih Lin, Ming-Tsong Wang, Min-Feng Kao, Kuan-Hua Lin, Jen-Cheng Liu, Dun-Nian Yaung, Ko Chun Liu
  • Patent number: 11934959
    Abstract: Apparatuses, systems, and techniques are presented to synthesize consistent images or video. In at least one embodiment, one or more neural networks are used to generate one or more second images based, at least in part, on one or more point cloud representations of one or more first images.
    Type: Grant
    Filed: June 1, 2020
    Date of Patent: March 19, 2024
    Assignee: NVIDIA CORPORATION
    Inventors: Arun Mallya, Ting-Chun Wang, Ming-Yu Liu, Karan Sapra