Abstract: Disclosed are methods and kits for high-performance liquid chromatography (HPLC) fluorescence or chemiluminescence detection. Beneficially, the kits are miniaturized, portable, and can provide low-cost instrumentation. The systems disclosed can utilize a smartphone, tablet or similar device to capture emitted fluorescence or chemiluminescence and to analyze the data to provide chromatograms in different detection channels by plotting red, green, and blue color intensities of emitted fluorescence or chemiluminescence versus time. The systems preferably comprise a flow cell capable of withstanding high mobile phase flow rates, a chamber box, and for fluorescence an LED as a light source and fiber optics to transmit emitted fluorescence to a smartphone camera.

Abstract: A system and method for 3D printed polymeric ionic liquid (PIL) extraction sorbents that includes a photocuring 3D printer utilizing a buildplate having a plurality of holes and a resin tank formed of a plurality of individual wells with a prepolymer monomer blended with a crosslinker and a photoinitiator is placed in the plurality of wells to form a plurality of 3D printed PIL sorbents on the buildplate, a fabrication device that prepares the polymeric ionic liquid (PIL) for extraction, at least one container for conditioning, extracting, and desorption of the polymeric ionic liquid (PIL); and a high-performance liquid chromatography (HPLC) to provide separation resulting in batch production of PIL sorbents. A polymeric ionic liquid (PIL) sorbent printed by 3D printer includes at least one PIL sorbent and can be in the form of a blade or fiber that has a high level of consistency.

Abstract: The present disclosure provides a power control system for motor preheating including a current sensor, a power calculation module, a power error calculation module, a power control module, a current control module and a voltage control module. The current sensor senses a motor current output by the motor. The power calculation module calculates an output power of the motor according to the voltage command and the motor current. The power error calculation module calculates a power error according to a power command and the output power. The power control module outputs a current braking command according to the power error. The current control module calculates a voltage command according to the current braking command and the motor current. The voltage control module outputs a three-phase voltage according to the voltage command, and the motor is operated in a stationary state, and the stator of the motor is preheated.

Abstract: A testing board (i.e., testing fixture) includes a printed circuit board (PCB), an external connection port, and plural coaxial radio frequency (RF) connector sets. The external connection port is located on the printed circuit board. Each of the coaxial RF connector sets includes a top coaxial RF connector and a bottom coaxial RF connector. The top coaxial RF connector and the bottom coaxial RF connector are respectively disposed on a top surface and a bottom surface of the printed circuit board in a coaxial arrangement and electrically connect to the external connection port.

Abstract: Disclosed herein is a method or a pharmaceutical composition for the treatment of dry eye disease or corneal wound healing, comprising administering to a subject in need thereof a therapeutically effective amount of secretome of amniotic fluid stem cells. Also provided is a use of secretome of amniotic fluid stem cells for manufacturing a medicament for the treatment of dry eye disease or corneal wound healing.

Abstract: A flat connector includes an electrical signal conductor, a substrate, and plural conductive terminals. The substrate has plural accommodating holes. Each of the conductive terminals includes a foot part, an elastic compression part, and a head part that are arranged in sequence. The foot part is attached to the substrate and is electrically connected to the electrical signal conductor. The elastic compression part is located in the accommodating hole. When the conductive terminal is not compressed, the head part penetrates out of the accommodating hole from a working surface, and the elastic compression part of the conductive terminal is suspended in the accommodating hole. When the conductive terminal is compressed, the head part of the conductive terminal moves towards the inside of the accommodating hole, and the elastic compression part is freely deformed in the accommodating hole.

Abstract: A connector includes a first grounding terminal, a first signal terminal, a second signal terminal, a second grounding terminal, and a substrate. The first grounding terminal, the first signal terminal, the second signal terminal, and the second grounding terminal are arranged in sequence, and each of them has a contact area. The first grounding terminal, the first signal terminal, the second signal terminal, and the second grounding terminal are sequentially disposed on the substrate and are parallel to each other. The substrate has plural through holes disposed between the first signal terminal and the second signal terminal.

Abstract: A semiconductor structure includes a substrate, and an active device and a passive device over the substrate. The active device is disposed in a first region of the substrate, and the passive device is disposed in a second region of the substrate. The semiconductor structure further includes a shielding structure and a passivation layer. The shielding structure includes a barrier layer and a ceiling layer. The barrier layer is on the passive device and the active device, and the ceiling layer is on the barrier layer. The passivation layer is under the barrier layer and covers a top surface of the passive device. An air cavity is defined by sidewalls of the barrier layer, a bottom surface of the ceiling layer, and the substrate.

Abstract: The present disclosure provides a power control system for motor preheating including a current sensor, a power calculation module, a power error calculation module, a power control module, a current control module and a voltage control module. The current sensor senses a motor current output by the motor. The power calculation module calculates an output power of the motor according to the voltage command and the motor current. The power error calculation module calculates a power error according to a power command and the output power. The power control module outputs a current braking command according to the power error. The current control module calculates a voltage command according to the current braking command and the motor current. The voltage control module outputs a three-phase voltage according to the voltage command, and the motor is operated in a stationary state, and the stator of the motor is preheated.

Abstract: A digital-to-analog converter (DAC)-based voltage-mode transmit driver architecture. One example transmit driver circuit generally includes an impedance control circuit coupled to a plurality of DAC driver slices. The impedance control circuit generally includes a tunable impedance configured to be adjusted to match a load impedance for the transmit driver circuit. Another example transmit driver circuit generally has an output impedance that is smaller than the load impedance for the transmit driver circuit, such that an output voltage swing at differential output nodes of the transmit driver circuit is greater than a voltage of a power supply rail. Another example transmit driver circuit generally includes a predriver circuit with a first inverter coupled to a first output of the predriver circuit and a second inverter coupled to a second output of the predriver circuit, the transistors in at least one of the first inverter or the second inverter having different strengths.

Abstract: Microelectronic modules are described. In an embodiment, a microelectronic module includes a module substrate, a chip mounted onto the module substrate, and a semiconductor-based integrated passive device between the chip and the module substrate. The semiconductor-based integrated passive device may include an upper RDL stack-up with thicker wiring layers than a lower BEOL stack-up. The semiconductor-based integrated passive device may be further solder bonded or hybrid bonded with the chip.

Abstract: The present disclosure discloses an electrical connector including a conductive casing, a wire-end casing arranged inside the conductive casing, and a wire-end plastic body arranged inside the wire-end casing; and a terminal module including an upper terminal set (71) and a lower terminal set (73) is arranged inside the wire-end plastic body; a molding piece is arranged inside the conductive casing; and a printed circuit board is provided at the bottom of the molding piece; a terminal module is arranged in the molding piece; the terminal module includes an upper terminal set (71), a lower terminal set (73) and a partition plate therebetween, and grounding arms are arranged on the partition plate.

Abstract: The present invention provides a signal connector, comprising a terminal module, sequentially including a first ground terminal, a first signal terminal, a second signal terminal and a second ground terminal arranged in parallel; and an insulating base, Including a plug opening, the terminal module is fixed at the connection opening, the insulating base includes an inner surface, and a protrusion is arranged on the inner surface between the first signal terminal and the second signal terminal, the protrusion is used to block at least a part of the first signal terminal and the second signal terminal, and the inner surface between the first signal terminal and the first ground terminal is flat.

Abstract: Disclosed is a connector with a barrier plate and an elastic arm. The connector can have a molding piece, a row of upper and lower terminals, and a metal partition board. The molding piece covers at least a portion of the metal partition board, which has an elastic arm emerging from a vertical wall of the molding piece and extending at an oblique angle. For example, when a wire-end connector is mated to a board-end connector, the housing of the former compresses the elastic arm and forms a ground connection with the elastic arm and the metal partition board in the board-end connector. Thus, the elastic arm can be utilized to form a ground loop with another connector.

Abstract: An electronic device includes a display module, a protection cover, a first light shielding layer, a light guide plate, a light source, a touch sensitive film, a first optical adhesive, a light shielding element, and a second light shielding layer. The first light shielding layer connects a bottom surface of the protection cover, and is configured to define a non-visible area of the electronic device. The light guide plate is located on the display module and overlaps the non-visible area. The light shielding element is located on the display module and overlaps the non-visible area. The second light shielding layer is located on the touch sensitive film and overlaps the light shielding element. The second light shielding layer is configured to absorb light transmitted in the touch sensitive film and the first optical adhesive in the non-visible area.

Abstract: Analog-to-digital converter circuitry includes comparator circuitry, capacitor analog-to-digital converter circuitry (CDA), and successive approximation register (SAR) circuitry. The comparator circuitry includes a non-inverting input and an inverting input to selectively receive a differential voltage signal, and an output. The CDAC circuitry includes a first capacitor network having a first plurality of capacitors. A first capacitor of the first plurality of capacitors includes a first terminal connected to the non-inverting input and a second terminal selectively connected to a first voltage potential and a second voltage potential. The first voltage potential is greater than the second voltage potential. The SAR circuitry is connected to the output and the first capacitor network, and connects, during a first period, the second terminal of the first capacitor to the second voltage potential.

Abstract: An electronic device includes a display module, a protection cover, a first light shielding layer, a light guide plate, a light source, a touch sensitive film, a first optical adhesive, a light shielding element, and a second light shielding layer. The first light shielding layer connects a bottom surface of the protection cover, and is configured to define a non-visible area of the electronic device. The light guide plate is located on the display module and overlaps the non-visible area. The light shielding element is located on the display module and overlaps the non-visible area. The second light shielding layer is located on the touch sensitive film and overlaps the light shielding element. The second light shielding layer is configured to absorb light transmitted in the touch sensitive film and the first optical adhesive in the non-visible area.

Abstract: A semiconductor structure includes a substrate, and an active device and a passive device over the substrate. The active device is disposed in a first region of the substrate, and the passive device is disposed in a second region of the substrate. The semiconductor structure further includes a shielding structure and a passivation layer. The shielding structure includes a barrier layer and a ceiling layer. The barrier layer is on the passive device and the active device, and the ceiling layer is on the barrier layer. The passivation layer is under the barrier layer and covers a top surface of the passive device. An air cavity is defined by sidewalls of the barrier layer, a bottom surface of the ceiling layer, and the substrate.

Abstract: A digital-to-analog converter (DAC)-based voltage-mode transmit driver architecture. One example transmit driver circuit generally includes an impedance control circuit coupled to a plurality of DAC driver slices. The impedance control circuit generally includes a tunable impedance configured to be adjusted to match a load impedance for the transmit driver circuit. Another example transmit driver circuit generally has an output impedance that is smaller than the load impedance for the transmit driver circuit, such that an output voltage swing at differential output nodes of the transmit driver circuit is greater than a voltage of a power supply rail. Another example transmit driver circuit generally includes a predriver circuit with a first inverter coupled to a first output of the predriver circuit and a second inverter coupled to a second output of the predriver circuit, the transistors in at least one of the first inverter or the second inverter having different strengths.

Abstract: A semiconductor structure includes a substrate, a passive device and an active device over the substrate. The active device is formed in the first region of the substrate, and the passive device is formed in the second region of the substrate. The semiconductor structure further includes a passivation layer that covers the top surface of the passive device. The passivation layer has an opening that exposes the active device.