Abstract: A method of switching a plurality of switches for supplying a pulsed current to one or more than one light-emitting diodes involves: switching a current from a direct current (DC) voltage to an inductance component, for example an inductor or a flyback transformer, for charging the inductance component; switching a current from the inductance component to the light-emitting diodes for transferring energy from the inductance component to the light-emitting diodes; switching a current from the inductance component to the direct current (DC) voltage for transferring energy from the inductance means back to the direct current (DC) voltage; controlling the switchings to regulate the current in the inductance component for supplying the pulsed current to the light-emitting diodes is disclosed.

Abstract: A switching amplifying method or a switching amplifier for obtaining a linearly amplified replica of an input signal, is highly efficient, and does not have the disadvantage of “dead time” problem related to the class D amplifiers. Another aspect of the present invention provides a switching amplifier that is completely off when there is no input signal. Yet another aspect of the present invention further comprises an act of comparing an input signal with an output feedback signal for detection and correction of overall system signal processes therefore does not require a power supply regulator and is substantially immune to power supply and load perturbations.

Abstract: A riser card module includes a frame body, a carrier plate connected to the frame body for abutment against first surfaces of positioning plates of fixing brackets of expansion cards, a riser card disposed on the frame body and having a plurality of expansion slots for insertion therein of the expansion cards, respectively, and a limiting unit rotatable relative to the carrier plate about an axial direction which is perpendicular to a longitudinal direction of the carrier plate for abutment against second surfaces of the positioning plates of the fixing brackets of the expansion cards so as to restrict movement of the expansion cards relative to the riser card.

Abstract: A circuit board, a chip package structure and a fabrication method of the circuit board are provided. By applying the fabrication method, a plurality of conductive channels can be formed in a single through hole of the circuit substrate. Unlike the conductive channels respectively formed in the through holes according to the related art, the conductive channels of the proposed circuit board can be formed in a single through hole. As such, it is conducive to the expansion of available layout area of the circuit board, the increase in layout flexibility, and the improvement of layout density of the circuit board.

Abstract: A casing includes a casing module and a support module. The casing module includes two side plates spaced apart from each other, a top-plate unit disposed between and perpendicular to the side plates, and a bottom plate spaced apart from and parallel to the top-plate unit. The side plates, the top-plate unit and the bottom plate define a first accommodating space for receiving a first electronic device. The support module is disposed between the top-plate unit and the bottom plate, and is removably caught in the top-plate unit to divide the first accommodating space into two second accommodating spaces for receiving two second electronic devices that differ in size from the first electronic device.

Abstract: A semiconductor package includes a substrate, a die, and a package body. The substrate includes: (a) a core including a resin reinforced with fibers; (b) a plurality of openings extending through the core; (c) a dielectric layer; and (d) a single conductive layer disposed between the dielectric layer and the core. Portions of a lower surface of the single conductive layer cover the plurality of openings to form a plurality of first contact pads for electrical connection external to the semiconductor package. Exposed portions of an upper surface of the single conductive layer form a plurality of second contact pads. The die is electrically connected to the plurality of second contact pads, and the package body encapsulates the die.

Abstract: A communication switching method is provided. The method is implemented by a communication switching system. The system includes mobile phones, landline phones, and a RFID server. Each mobile phone includes a RFID tag. Each landline phone includes a RFID reader. The RFID server includes a database. The method includes: putting the call on hold through the IP-PBX; transmitting the mobile phone number of a called mobile phone to the RFID server; searching the database to determine whether the mobile phone number is registered; transmitting the landline phone number corresponding to the mobile phone number to the RFID reader when the mobile phone number is registered; determining whether the landline phone corresponding to the landline phone number is busy; and switching the call to the landline phone corresponding to the landline phone number through the IP-PBX when the landline phone corresponding to the landline phone number is idle.

Abstract: A fan holder for holding a fan is disclosed. The fan holder includes a frame for containing the fan, at least one hook for hooking the fan when the fan is contained inside the frame, at least one resilient arm connected to the frame for resiliently contacting the fan base when the frame is installed inside a fan base, and at least one resilient clip connected to at least one lateral side of the frame for wedging inside a slot formed between the fan base and a casing when the frame is installed inside the fan base.

Abstract: A switching amplifying method or a switching amplifier for obtaining a linearly amplified replica of an input signal, is highly efficient, and does not have the disadvantage of “dead time” problem related to class D amplifiers. Another aspect of the present invention provides a switching amplifier that is completely off when there is no input signal. Yet another aspect of the present invention further comprises an act of comparing an input signal with an output feedback signal for detection and correction of overall system signal processes therefore does not require a power supply regulator and is substantially immune to power supply and load perturbations.

Abstract: A switching amplifying method or a switching amplifier for obtaining one or more than one linearly amplified replicas of an input signal, is highly efficient, and does not have the disadvantage of “dead time” problem related to the class D amplifiers. Another aspect of the present invention provides a switching amplifier that is completely off when there is no input signal. Yet another aspect of the present invention provides a switching amplifier for obtaining a plurality of different linearly amplified replicas of the input signal, and adds more slave outputs easily and economically.

Abstract: A method for culturing microtissue is provided. The method includes steps of: (a) forming a pattern microarray on a hydrophobic film; (b) adhering the hydrophobic film to a carrier; (c) disposing a plurality of cells on the hydrophobic film for culturing depending on the pattern microarray, and forming a plurality of hair follicle microtissues.

Abstract: A discontinuous current regulator circuit is composed of a switched-mode power converter circuit, a sensing circuit and a current mode controller circuit. The current mode controller circuit, based on the signal from the sensing circuit, controls the switched-mode power converter circuit to supply a regulated discontinuous current to a light-emitting diode or light-emitting diode arrangement comprising a plurality of light-emitting diodes. The present invention provides a discontinuous current regulator circuit for driving white light-emitting diodes able to provide higher perceived brightness levels and with longer lifetime than existing light-emitting diode drivers.

Abstract: A package carrier includes: (a) a dielectric layer defining a plurality of openings; (b) patterned electrically conductive layer, embedded in the dielectric layer and disposed adjacent to a first surface of the dielectric layer; a plurality of electrically conductive posts, disposed in respective ones of the openings, wherein the openings extend between a second surface of the dielectric layer to the patterned electrically conductive layer, the electrically conductive posts a connected to the patterned electrically conductive layer, and an end of each of the electrically conductive posts has a curved profile and is faced away from the patterned electrically conductive layer; and (d) a patterned solder resist layer, disposed adjacent to the first surface of the dielectric layer and exposing portions of the patterned electrically conductive layer corresponding to contact pads. A semiconductor package includes the package carrier, a chip, and an encapsulant covering the chip and the package carrier.

Abstract: A circuit board, a chip package structure and a fabrication method of the circuit board are provided. By applying the fabrication method, a plurality of conductive channels can be formed in a single through hole of the circuit substrate. Unlike the conductive channels respectively formed in the through holes according to the related art, the conductive channels of the proposed circuit board can be formed in a single through hole. As such, it is conducive to the expansion of available layout area of the circuit board, the increase in layout flexibility, and the improvement of layout density of the circuit board.

Abstract: A food container includes a bowl body, a first cover, a first tear portion, and an eating utensil. The bowl body has a first opening, is made of a first heat-insulating material, and is used for accommodating contents. The first cover is made of a second heat-insulating material, and covers the bowl body, in which the first cover is connected to the bowl body, and includes a sealing portion for placing an additive into the bowl body. The first tear portion is located at a connection position between the bowl body and the first cover, and the first tear portion is torn to separate the bowl body from the first cover. The eating utensil is located at the first cover.

Abstract: A semiconductor package includes a substrate, a die, and a package body. The substrate includes: (a) a core including a resin reinforced with fibers; (b) a plurality of openings extending through the core; (c) a dielectric layer; and (d) a single conductive layer disposed between the dielectric layer and the core. Portions of a lower surface of the single conductive layer cover the plurality of openings to form a plurality of first contact pads for electrical connection external to the semiconductor package. Exposed portions of an upper surface of the single conductive layer form a plurality of second contact pads. The die is electrically connected to the plurality of second contact pads, and the package body encapsulates the die.

Abstract: A dual-purpose food container includes a first bowl body, a second bowl body, and a tear portion. The first bowl body has a first opening, is made of a first heat-insulating material, and is used for accommodating contents. The second bowl body has a second opening and is made of a second heat-insulating material, in which the second opening faces the first opening such that the second bowl body covers the first bowl body and the second bowl body is connected to the first bowl body. The tear portion is located at a connection position between the first bowl body and the second bowl body, and the tear portion is torn to separate the first bowl body from the second bowl body, so that the first bowl body and the second bowl body are respectively used to serve food and soup, thereby achieving a dual purpose.

Abstract: A method for producing a cell pattern is provided, comprising the step of forming a hydrophobic film on a substrate, patterning the hydrophobic film by a laser beam, transferring the hydrophobic film from the substrate to a medium, and culturing cells on the medium to form a cell pattern.

Abstract: The invention provides a method for transferring cells to carriers, including: (a) providing a hydrophobic cell culture container or a cell culture container coated with a hydrophobic material on a bottom thereof; (b) adding carriers which are more hydrophilic than the hydrophobic cell culture container or hydrophobic materials and a culture medium containing cells into the hydrophobic cell culture container or the cell culture container coated with the hydrophobic material on the bottom thereof; and (c) culturing the cells, wherein the cells attach to the carriers and grow.

Abstract: A surveillance camera device with a light source is composed of a camera, a control unit which is connected to the camera, a light-source control unit which is connected to the control unit, and a light source. The control unit directly gets the illumination of images captured by the camera or its related parameters, to determine whether illumination of the environment of image captured is sufficient. When the illumination of the environment of image captured is changed, the control unit will send lighting control signal to the light-source control unit to activate or deactivate the light source, or adjust the light output intensity of the light source automatically, such that the illumination of the environment of the images captured can be accurately determined to provide the correct light fill-in for shooting clear images.