Abstract: A method performed by an 8-TX UE for full power transmissions is provided. The method transmits an IE for reporting capability information. The method receives a PUSCH configuration for configuring the 8-TX UE with a CB PUSCH transmission, a full power mode 1, and one of a partial coherent codebook subset with two antenna groups, a partial coherent codebook subset with four antenna groups, and a non-coherent codebook subset. The method receives DCI including an SRI and an additional TPMI for indicating an 8-port SRS resource. The method then performs the CB PUSCH transmission using the full power mode 1. The IE includes a field indicating support for the full power mode 1 and a field indicating support for one of the partial coherent codebook subset with two antenna groups, the partial coherent codebook subset with four antenna groups, and the non-coherent codebook subset.

Abstract: A method for configuring a subsequent conditional primary secondary cell addition/change (S-CPAC) to a UE is provided. The method receives from a source cell an S-CPAC configuration that includes an RRC configuration for a primary secondary cell (PSCell) and a set of conditions for switching to the PSCell. The method receives a secondary key (SK)-counter list associated with the S-CPAC. The list includes one or more SK-counter entries arranged in an order. The method stores the S-CPAC configuration and the SK-counter list. After determining that one or more of the set of conditions are satisfied, the method selects a first SK-counter entry of the SK-counter list and configures the UE with the S-CPAC configuration to switch from another PSCell to the PSCell. In configuring the UE with the S-CPAC configuration, the first SK-counter entry is applied. The method then removes the first SK-counter entry from the SK-counter list.

Abstract: A photoelectric sensing device including a substrate, a first pixel structure, a second pixel structure and a first bus line. The first pixel structure is disposed on the substrate and includes a first photoelectric sensing component, wherein the first photoelectric sensing component has a first semiconductor layer. The second pixel structure is disposed on the substrate and includes a second photoelectric sensing component, wherein the second photoelectric sensing component has a second semiconductor layer. The first bus line is disposed on the substrate and located between the first semiconductor layer and the second semiconductor layer, wherein the first bus line is electrically connected to the first pixel structure and the second pixel structure.

Abstract: A user equipment (UE) and a method for beam indication in a multi-transmission and reception point (MTRP) are provided. The method includes: receiving, from a base station (BS), first downlink control information (DCI) including a first transmission configuration indication (TCI) field indicating a first TCI state, the first DCI being associated with a first value; receiving, from the BS, second DCI including a second TCI field indicating a second TCI state, the second DCI being associated with a second value; performing, based on the first TCI state, a first uplink (UL) transmission; and performing, based on the second TCI state, a second UL transmission. The first UL transmission is scheduled by third DCI associated with the first value, and the second UL transmission is scheduled by fourth DCI associated with the second value.

Abstract: A membrane keyboard and manufacturing method thereof, the manufacturing method comprises the following steps: forming a first positioning hole on an upper circuited layer, forming a second positioning hole and a plurality of hollow portions on a spacer layer, forming a third positioning hole on a lower circuited layer, wherein a minimum diameter of the second positioning hole is smaller than a minimum diameter of the first positioning hole and a minimum diameter of the third positioning hole; adhering the upper circuited layer, the spacer layer and the lower circuited layer, to form a restoring member positioning hole; placing the membrane circuit board in the restoring member assembly fixture and passing the restoring member positioning hole through a locating pillar of the restoring member assembly fixture, with an inner wall of the second positioning hole abutting the locating pillar.

Abstract: A computing circuit with a de-identified architecture, a data computing method, a data processing system, and a data de-identification method are provided. The computing circuit includes an arithmetic array and a de-identification circuit. The computing circuit may perform an accumulation operation on input data to generate accumulated data by the arithmetic array. The de-identification circuit has an analog offset error determined based on an analog physical unclonable function. The computing circuit may operate the accumulated data according to the analog offset error to generate de-identification data by the de-identification circuit. It can not only provide the analog offset error through the transistors in the de-identification circuit, but also be combined with obfuscated code settings to dynamically adjusting the degree of de-identification of data.

Abstract: A method for fabricating a semiconductor device includes the steps of first forming a first inter-metal dielectric (IMD) layer on a substrate and a metal interconnection in the first IMD layer, forming a magnetic tunneling junction (MTJ) and a top electrode on the metal interconnection, forming a spacer adjacent to the MTJ and the top electrode, forming a second IMD layer around the spacer, forming a cap layer on the top electrode, the spacer, and the second IMD layer, and then patterning the cap layer to form a protective cap on the top electrode and the spacer.

Abstract: A semiconductor package includes a semiconductor device, an encapsulating material, a redistribution structure, and an adhesive residue. The encapsulating material encapsulates a first part of a side surface of the semiconductor device. The redistribution structure is disposed over the semiconductor device and a first side of the encapsulating material. The adhesive residue is disposed over a second side of the encapsulating material opposite to the first side and surrounding the semiconductor device, wherein the adhesive residue encapsulates a second part of the side surface of the semiconductor device.

Abstract: A cell and tissue sheet forming package includes a container body, a membrane, a sliding door plate and a sealing film. The sliding door plate is disposed slidably on a top of the container body to cover or expose the membrane. The sliding door plate has a hole and a passive magnetic assembly. The cell injection equipment includes a carrier, an injection mechanism and a drive mechanism. The carrier carries the package, and the drive mechanism moves the carrier and the injection mechanism to have the injection mechanism to inject a solution, through the hole, into the package. A heating element of the carrier is introduced to heat the membrane and the solution to transform the solution into a colloid sheet on the membrane. Then, the positive magnetic assembly engages magnetically the passive magnetic assembly to slide the sliding door plate to expose the colloid sheet on the membrane.

Abstract: A three-dimensional resistive random access memory structure includes a base layer, a first layer, a second layer, a third layer and a fourth layer. The first layer includes two first conductive layers and a first via. One of the two first conductive layers is electrically connected between the base layer and the first via. The second layer includes three second conductive layers and two second vias. Two first resistive elements are formed between one of the two second vias and two of the three second conductive layers. The third layer includes three third conductive layers and two third vias. Two second resistive elements are formed between one of the two third vias and two of the three third conductive layers. The fourth layer includes a fourth conductive layer. The fourth conductive layer is electrically connected to the two third vias.

Abstract: An electronic device with light-indicating function is provided. The electronic device includes a substrate, a first light source, a second light source, and a light guiding element. The substrate includes a first surface and a second surface, wherein the first surface is opposite to the second surface. The first light source is disposed on the first surface of the substrate, wherein the first light source faces the first direction, and the first light source provides a first light beam. The second light source is disposed on the first surface of the substrate, wherein the second light source faces the second direction, the second light source provides a second light beam, and the first direction is not parallel to the second direction. The light guiding element includes a first section and a second section.

Abstract: A method for fabricating a semiconductor device includes first providing a substrate having a high-voltage (HV) region, a medium-voltage (MV) region, and a low-voltage (LV) region, forming a HV device on the HV region, and forming a LV device on the LV region. Preferably, the HV device includes a first base on the substrate, a first gate dielectric layer on the first base, and a first gate electrode on the first gate dielectric layer. The LV device includes a fin-shaped structure on the substrate, and a second gate electrode on the fin-shaped structure, in which a top surface of the first gate dielectric layer is even with a top surface of the fin-shaped structure.

Abstract: A semiconductor structure includes a first conductive line, a first conductive segment, a second conductive segment, and a third conductive segment. The first conductive segment is electrically coupled to the first conductive line. The second conductive segment is electrically coupled the first conductive segment. The second conductive segment is disposed between the first conductive segment and the third conductive segment. A top surface of the first conductive segment is aligned with a top surface of the second conductive segment in a same layer.

Abstract: A fabricating method of a non-woven film, for electronic components, includes the following steps. Providing a polyetherimide substrate and an aerogel dispersion, in which the aerogel dispersion includes an aerogel, and the aerogel has a moisture content between 0.7% and 0.9% and a porosity between 85% and 95%. Dipping the polyetherimine substrate in the aerogel dispersion, such that the aerogel dispersion covers the polyetherimine substrate. Performing a thermal compression process on the polyetherimide substrate, such that the aerogel and the polyetherimide substrate are composited with each other. Performing an ultrasonic oscillating process on the polyetherimine substrate, such that the aerogel not being composited with the polyetherimine substrate is removed.

Abstract: The present invention provides an optical imaging lens. The optical imaging lens comprises five lens elements positioned in an order from an object side to an image side. Through controlling the convex or concave shape of the surfaces of the lens elements and satisfying inequalities, the optical imaging lens may be provided with smaller volume and great field of view.

Abstract: A semiconductor structure can include a first substrate having a frontside and a backside opposite the frontside. The semiconductor structure can include devices on the frontside. The semiconductor structure can include first interconnect structures on the frontside and coupled to the devices. The semiconductor structure can include a heat distribution layer on the frontside and electrically isolated from the first interconnect structures, where the heat distribution layer includes a thermally conductive material. The semiconductor structure can include a second substrate coupled to the first substrate on the frontside. The semiconductor structure can include second interconnect structures on the backside and coupled to the devices.

Abstract: Cleaning tools for cleaning the pull cable of an ingot puller apparatus and methods for cleaning the pull cable are disclosed. The cleaning tool includes a chamber for receiving the pull cable. Pressurized fluid is discharged through one or more nozzles to detach debris from the pull cable. The fluid and debris are collected in an exhaust plenum of the cleaning tool and are expelled through an exhaust tube. The cleaning tool includes one or more guides that guide the cleaning tool in an upper segment of the ingot puller apparatus.

Abstract: Optical devices and methods of manufacture are presented in which a mirror structure is utilized to transmit and receive optical signals to and from an optical device. In embodiments the mirror structure receives optical signals from outside of an optical device and directs the optical signals through at least one mirror to an optical component of the optical device.

Abstract: The present invention relates to a cell differentiation medium composition, a high secretion insulin-producing cells and a preparation method thereof. The high secretion insulin-producing cells obtained by using the cell differentiation medium composition to induce stem cell differentiated under specific conditions can secrete a large amount of insulin in a short time, and when the high-secreting insulin-producing cells are transplanted into the human body, they are not easy to be swallowed by macrophages, which can improve the survival rate of the insulin-producing cells and prolong the time of insulin secretion thereby.

Abstract: An electronic device and a method for updating a firmware are disclosed. The method includes: receiving a firmware updating file through a communication interface, where the firmware updating file includes boot data; detecting a first field of the firmware updating file to determine whether the firmware updating file supports a first format; in response to the firmware updating file supporting the first format, detecting a second field of the firmware updating file to obtain an identifier; and transmitting the boot data to a firmware component corresponding to the identifier through the communication interface to update the firmware component.