Abstract: A semiconductor package with a die pad having a recessed portion is proposed, wherein a lead frame is used, having a die pad formed with at least a through hole, and a plurality of leads. A chip is mounted on the die pad and covers the through hole, with a bottom surface of the chip being partly exposed out the through hole. The through hole is formed at its peripheral edge with a recessed portion that dents from a top surface of the die pad and is associated with the through hole. During a molding process, the recessed portion is entirely filled with an encapsulating compound used for encapsulating the chip and die pad. This prevents forming of voids between the chip and die pad, and assures packaged products to be free of die crack or popcorn effect, thereby significantly improving yield and reliability of the packaged products.

Abstract: A method for polychrome plastic material injection molding in accordance with the present invention, in which, a molding board is provided with a plurality of cores, and the cores are each provided with a plurality of cavities. The cores rotated for exchanging the positions of the cavities and together with the rotation of the molding board, whereby permitting the injection of three different colored plastic materials into the cores respectively in turn, and then forming a triple colored plastic object.

Abstract: A DC to AC inverter includes a bridge type switch circuit, a transformer, an integrated circuit, a pulse width modulator, a wave generator and a control-drive circuit. The switch circuit is connected to a direct current power source and has two alternating current ends with one of the alternating current ends connecting with an energy storage inductor in series and then connecting with an input end of the transformer and the other input end of the transformer being connected to the other alternating current end. The current waves at both of the alternating current ends are detected and the waves are integrated and sent to a feedback end of the pulse width modulator. The wave generator produces half period of sine waves for a reference potential end and low frequency (50 Hz or 60 Hz) square waves for the control-drive circuit operating the pulse width modulator and the square waves and sending control signals to the switch circuit.

Abstract: A microfluidics switch with moving planes has a first substrate with some holes and a second substrate with some micro-channels. Herein, the relative planes of both substrates are covered by a hydrophobic material. Therefore, while the substrates are neighboring and relatively moving, the overlap relation between the holes and the micro-channels are varied and a switch function is provided. Further, by using the hydrophobic material, while the distance between substrates is smaller than the height of drop of each liquid inputted into the holes, the fluids can not fluid between the planes and then different micro-channels are isolated from each other.

Abstract: A high speed cable connector (1) includes a cover (10), a base (80) and a cable assembly (30) mounted between the cover and the base. The cable assembly includes a cable (42) consisting of a plurality of lines (44). Each line has a signal pair (47, 48) and a ground conductor (492). The signal pair includes a pair of upper and lower signal conductors (472, 482). The ground conductors are soldered to shielding plates (50). The shielding plates are soldered to top and bottom faces of a rear end of a printed circuit board (PCB) (62). The upper and lower signal conductors of each signal pair are soldered to the top and bottom faces of the rear end of the PCB, respectively, and located between two neighboring shielding plates, whereby cross-talk and interference between two neighboring signal pairs can be effectively suppressed and reduced. The PCB has a front end electrically connecting with contacts (662) for electrically engaging with a complementary connector.

Abstract: A DC to AC inverter includes a bridge type switch circuit, a transformer, an integrated circuit, a pulse width modulator, a wave generator and a control-drive circuit. The switch circuit is connected to a direct current power source and has two alternating current ends with one of the alternating current ends connecting with an energy storage inductor in series and then connecting with an input end of the transformer and the other input end of the transformer being connected to the other alternating current end. The current waves at both of the alternating current ends are detected and the waves are integrated and sent to a feedback end of the pulse width modulator. The wave generator produces half period of sine waves for a reference potential end and low frequency (50 Hz or 60 Hz) square waves for the control-drive circuit operating the pulse width modulator and the square waves and sending control signals to the switch circuit.

Abstract: An organic electroluminescent panel having a silver alloy is disclosed, which has a substrate; a plurality of the first electrodes; a plurality of the second electrodes; a plurality of conducting lines containing a silver alloy; a plurality of isolating walls; and a plurality of organic electroluminescent media. The first electrodes are arranged in parallel on the substrate. The organic electroluminescent media are disposed on the first electrodes. The second electrodes are disposed on the organic electroluminescent media. The conducting lines containing the silver alloy connect to the first electrodes or the second electrodes. The silver alloy contained in the conducting lines has 80 to 99.8 mol % of silver; 0.1 to 10 mol % of copper; and 0.1 to 10 mol % of at least one transition metal selected from the group consisting of palladium (Pd), magnesium (Mg), gold (Au), platinum (Pt), and the combinations thereof.

Abstract: A shock-absorbing structure includes an elastic helical body, and an elastic helical curved tube. The elastic helical body is formed with a plurality of loops and a plurality of buffer spaces each defined between any two adjacent loops. The elastic helical curved tube is formed with a plurality of curved convex portions each inserted into a respective buffer space and urged between any two adjacent loops. Thus, the buffer spaces of the elastic helical body provide a cushioning effect. In addition, the elastic helical body and the elastic helical curved tube produce an elastic restoring force, so as to damp and reduce the stress applied on the shoe sole, thereby providing a shock-absorbing effect.

Abstract: An oxygen-removing pre-process for copper interconnect grown by electrochemical displacement deposition is to remove the oxygen in the reaction solution before displacement and deposition a copper film/conducting wire such that the copper film/conducting wire is grown and has a lower electric resistance.

Abstract: A shock-absorbing structure includes an elastic helical body, and an elastic helical curved tube. The elastic helical body is formed with a plurality of loops and a plurality of buffer spaces each defined between any two adjacent loops. The elastic helical curved tube is formed with a plurality of curved convex portions each inserted into a respective buffer space and urged between any two adjacent loops. Thus, the buffer spaces of the elastic helical body provide a cushioning effect. In addition, the elastic helical body and the elastic helical curved tube produce an elastic restoring force, so as to damp and reduce the stress applied on the shoe sole, thereby providing a shock-absorbing effect.

Abstract: A tension-type buffering device includes a flexible plastic member and a stiff plastic member which is connected to the flexible plastic member by way of gluing, plastic injection, or fusion. The wave-shaped strips of the stiff plastic member are alternatively connected to the flexible plastic member and a plurality of semi-circular compression spaces are defined between the wave-shaped strips and the tension strips of the flexible plastic member. The compression spaces are squeezed when the wave-shaped strips are compressed and go back to their original size after the force of compression is released. The device can be used as a shoe sole, a knee protector or a mattress.

Abstract: A web-shaped structure includes a first plastic member provided with a plurality of combination strips, and a second plastic member provided with a plurality of combination strips each combined with each of the combination strips of the first plastic member in a corrugated and intersecting manner, so that the first plastic member and the second plastic member intersect each other and are combined integrally, thereby forming the web-shaped structure which may be used to make a product, such as the cellular phone bag, the hand bag, the basket or the like, so that the product has a corrugated and web-shaped spatial effect, thereby enhancing the aesthetic quality of the product.

Abstract: The present invention relates to a method for forming a plastic article having two colors and a molding device of the method. The method for forming a plastic article having two colors uses two male dies whose positions are changed in a reciprocal manner to mate with a female die, so that two plastic materials having two different colors are in turn formed on the two male dies by a plastic injection molding process, thereby forming a plastic article having two colors.

Abstract: An apparatus for dynamically adjusting power consumption of a CPU in a computer system is described. A current flowing through the limiting resistor is detected and whether or not this current is larger than a predetermined current is determined. A warning signal is issued when the current is larger than this predetermined signal. The warning signal triggers the software framework and the hardware framework of the apparatus to issue an asynchronous operation frequency reduction instruction to the CPU of the computer system.

Abstract: A high speed cable connector (1) includes a cover (10), a base (80) and a cable assembly (30) mounted between the cover and the base. The cable assembly includes a cable (42) consisting of a plurality of lines (44). Each line has a signal pair (47, 48) and a ground conductor (492). The signal pair includes a pair of upper and lower signal conductors (472, 482). The ground conductors are soldered to shielding plates (50). The shielding plates are soldered to top and bottom faces of a rear end of a printed circuit board (PCB) (62). The upper and lower signal conductors of each signal pair are soldered to the top and bottom faces of the rear end of the PCB, respectively, and located between two neighboring shielding plates, whereby cross-talk and interference between two neighboring signal pairs can be effectively suppressed and reduced. The PCB has a front end electrically connecting with contacts (662) for electrically engaging with a complementary connector.

Abstract: A method and an apparatus for transporting substrates in all organic light emitting diode (OLED) process is disclosed, which has a transferring chamber provided for transporting substrates between processing modules and the atmosphere condition therein is able to be adjusted to be the same as the processing module by an atmosphere conditioner unit. According to the present invention, the substrates are not contaminated by moisture and the process operation and the factory layout are more flexible. Moreover, the OLED yield is improved.

Abstract: A short-prevented lead frame and a method for fabricating a semiconductor package with the lead frame are proposed, wherein each lead of the lead frame is formed with a thickness-reduced portion at a peripheral position of the lead frame, allowing thickness-reduced portions of adjacent leads to be arranged in a stagger manner. This stagger arrangement significantly increases pitches between the neighboring thickness-reduced portions of leads. Therefore, during a singulation process as to cut through the leads, lead bridging and short-circuiting between adjacent leads caused by cut-side burrs can be prevented from occurrence, whereby singulation quality and product yield and reliability are effectively improved.

Abstract: A semiconductor package with a die pad having a recessed portion is proposed, wherein a lead frame is used, having a die pad formed with at least a through hole, and a plurality of leads. A chip is mounted on the die pad and covers the through hole, with a bottom surface of the chip being partly exposed out the through hole. The through hole is formed at its peripheral edge with a recessed portion that dents from a top surface of the die pad and is associated with the through hole. During a molding process, the recessed portion is entirely filled with an encapsulating compound used for encapsulating the chip and die pad. This prevents forming of voids between the chip and die pad, and assures packaged products to be free of die crack or popcorn effect, thereby significantly improving yield and reliability of the packaged products.

Abstract: The present invention relates to a fast diffusion recipe for making silicon by NO complexes, which can quicken impurities diffusion by NO complexes, thus reducing effectiveness for a given period of time and cost of production. When it is used to make CMOS well, processing period would be more rapidly. Because of the produced interface depth is affected by ventilation at stage of heat treatment, and obtaining deeper depth by N2O compared with using traditional N2, it is thus clear that this recipe features application and use value.

Abstract: An illuminating device includes a casing having a movable module movably received therein. A first spring is biased between a first end of the movable module and an inside of the close end of the casing. An illuminating member is connected to a second end of the movable module and located in the open end of the casing. A circuit board is connected to the illuminating member and a second spring is biased between the circuit board and a plurality of batteries. A switch device is connected to the batteries and has a button extending from the first end of the movable module. When pushing the second end of the movable module, the button is compressed by the inside of the casing to turn on the illuminating member.