Abstract: In one embodiment, a method includes establishing, by an identity agent installed on a device, a connection to a browser installed on the device and generating, by the identity agent, first device information, a public key, and a private key. The method also includes communicating, by the identity agent, the first device information and the public key to an authentication service and receiving, by the identity agent, a unique identifier from the authentication service. The method further includes generating, by the identity agent, a first signature of the first device information and communicating, by the identity agent, the first signature, the first device information, and the unique identifier to the browser.

Abstract: Embodiments provide a light-emitting device that includes a first electrode, a second electrode facing the first electrode, an interlayer between the first electrode and the second electrode and including an emission layer, and an amine-containing compound. A gradient of a giant surface potential of the amine-containing compound is equal to or less than about ?10 mV/nm, and the giant surface potential is evaluated from a surface potential measured with respect to a film formed by depositing the amine-containing compound.

Abstract: A package structure includes a carrier substrate and a die. The carrier substrate includes through carrier vias (TCV). The die is disposed over the carrier substrate. The die includes a semiconductor substrate and conductive posts disposed over the semiconductor substrate. The semiconductor substrate is located between the conductive posts and the carrier substrate.

Abstract: A system for evaluating a display device includes a display device including a display panel outputting pattern images for viewpoints and a lens array refracting the pattern images, and a luminance meter generating a luminance profile by capturing the pattern images. Each of the pattern images includes a pattern.

Abstract: A semiconductor package includes a first semiconductor chip, a dummy die on the first semiconductor chip, second semiconductor chips stacked on the dummy die, and a dummy plate on the second semiconductor chips. Each of the first semiconductor chip, the dummy die, and the second semiconductor chips includes through-electrodes. The dummy die and the second semiconductor chip closest to the dummy die are connected to each other by direct contact of bonding pads. Adjacent ones of the second semiconductor chips are connected to each other by direct contact of bonding pads. The first semiconductor chip, the dummy die, the second semiconductor chip, and the dummy plate have a first width, a second width, a third width, and a fourth width in a horizontal direction, respectively. The fourth width is greater than the second width and the third width.

Abstract: An insulation composition for a high-voltage cable according to an example of the present disclosure includes a base resin, a flame retardant, a cross-linking agent, and other additives. Here, the base resin includes 30 to 60 wt % of a polar ethylene-based copolymer, 20 to 50 wt % of ethylene-propylene rubber or ethylene alpha-olefin, and 10 to 20 wt % of maleic anhydride-modified ethylene-vinyl acetate.

Abstract: A semiconductor package includes a first redistribution substrate, a first semiconductor chip on the first redistribution substrate, a first mold layer at least partially covering the first redistribution substrate and the first semiconductor chip, a plurality of first conductive pillars at least partially penetrating the first mold layer and contacting the first redistribution substrate, a second redistribution substrate on the first mold layer, a second semiconductor chip on the second redistribution substrate, a second mold layer at least partially covering the second redistribution substrate and the second semiconductor chip, a plurality of second conductive pillars at least partially penetrating the second mold layer and contacting the second redistribution substrate, and a third redistribution substrate on the second mold layer. The first semiconductor chip includes a first through via. The second semiconductor chip includes a backside power delivery network layer.

Abstract: An interactive system combines an automated voice mechanism with a visual feedback mechanism. A first terminal device and a telecommunications server mutually transmit messages through a public switched telephone network. The first terminal device can send an input message to the telecommunications server and receive a voice feedback message from the telecommunications server. The telecommunications server can generate a processing message based on the input message and transmit the processing message to an information management server which based on the processing message's content, through an internet sends a forward message to an information distribution server which based on the forward message's content, sends a control message to a second terminal device. The second terminal device transmits a request message to a picture content management server according to the forward message to obtain a picture feedback message returned by the picture content management server.

Abstract: The positive electrode active material includes: a first phase containing a lithium manganese oxide with a rock salt structure; and a second phase containing a lithium metal oxide with a layered structure, in a mixed state. In the positive electrode active material, the content of manganese may account for about 50 mol % or more of the total content of metals contained in the positive electrode active material, excluding lithium, and niobium (Nb) which is additionally doped on the positive electrode active material may be further included in an amount of about 2,000 ppm to 9,500 ppm based on the total content of the positive electrode active material.

Abstract: In a method for handling out-of-sequence caller dialog, an intelligent voice interface is configured to lead callers through pathways of an algorithmic dialog that includes available voice prompts for requesting different types of caller information. The method may include, during a voice communication with a caller via a caller device, receiving from the caller device caller input data indicative of a voice input of the caller, without having first provided to the caller device any voice prompt that requests a first type of caller information, and determining, by processing the caller input data, that the voice input includes caller information of the first type. The method also includes after determining that the voice input includes the caller information of the first type, bypassing one or more voice prompts, of the available voice prompts, that request the first type of caller information.

Abstract: Provided is a semiconductor package cutting system including a cutting device for partial-cutting at least a portion of a strip including a plurality of semiconductor packages, an inspection device mounted at a side of the cutting device to supply a first strip to be cut to the cutting device and to receive and inspect a second strip cut by the cutting device, and a storage device mounted at a side of the inspection device to supply the first strip stored therein, to the inspection device and to receive and store the second strip inspected by the inspection device, wherein the inspection device includes an inspection table for placing the second strip thereon and moving the second strip along a first direction.

Abstract: A neural network-based image processing method and device according to embodiments of the present invention can: perform preprocessing for an input image; obtain a feature map from the pre-processed image by means of a neural network comprising a plurality of neural network layers; perform quantization for the obtained feature map; and perform video conversion with respect to the quantized feature map.

Abstract: A semiconductor process device includes a housing including a chamber where a substrate is processed, a viewport in a side wall of the housing, an adapter configured to receive reflected light in which light generated from plasma generated inside the chamber is reflected at a target position on a surface of a structure provided on an upper surface of the substrate, a polarization beam splitter configured to separate the reflected light received from the adapter into P-polarized light and S-polarized light, a spectroscope configured to analyze spectra of the P-polarized light and the S-polarized light, and a control unit configured to monitor a thickness of the structure based on luminous intensity over time at one or more wavelengths of each of the P-polarized light and the S-polarized light, based on results of analyzing the spectra.

Abstract: A SL wireless transmit/receive unit (WTRU), configured in mode 1, with SL transmissions on unlicensed spectrum, may receive a SL grant from a gNodeB (gNB) and determine whether the SL grant falls within a COT initiated by another WTRU, based on COT structure information received from SCI transmissions of other WTRUs. If the SL grant falls within the COT initiated by another WTRU, the WTRU may perform a first LBT type to try to share the COT. If the SL grant does not fall within the COT initiated by another WTRU, the WTRU may perform a second LBT type to try to initiate its own COT. If LBT fails for the grant, the WTRU may report a failed LBT to the gNB in UCI.

Abstract: A method includes forming a metal layer over a dielectric layer; forming hard masks over the metal layer; etching the metal layer using the hard masks as etch mask to form metal features; selectively forming dielectric liners on opposite sidewalls of each of the metal features, while leaving surfaces of the hard masks and the dielectric layer exposed by the dielectric liners; and forming an inter-metal dielectric layer laterally surrounding the metal features.

Abstract: Provided is a wearable electronic device including: a housing forming at least a part of an exterior of the wearable electronic device; a nozzle extending from a part of the housing, wherein the nozzle includes a first hole at a first position and a second hole at a second position; an acoustic path inside the nozzle; a grill inside the nozzle, wherein the grill includes a first latch passing through the first hole such that a part thereof protrudes in a first direction and a second latch passing through the second hole such that a part thereof protrudes in a second direction; and an ear tip at least partially surrounding an outer surface of the nozzle, wherein the ear tip includes a first groove detachably coupled to a part of the first latch and a second groove detachably coupled to a part of the second latch.

Abstract: A method of forming a semiconductor device includes: forming a via in a first dielectric layer disposed over a substrate; forming a second dielectric layer over the first dielectric layer; forming an opening in the second dielectric layer, where the opening exposes an upper surface of the via; selectively forming a capping layer over the upper surface of the via, where the capping layer has a curved upper surface that extends above a first upper surface of the first dielectric layer distal from the substrate; after forming the capping layer, forming a barrier layer in the opening over the capping layer and along sidewalls of the second dielectric layer exposed by the opening; and filling the opening by forming an electrically conductive material over the barrier layer.

Abstract: An apparatus configured to process, based on signaling received from a target device with which a source device is engaging in an embedded subscriber identity module (eSIM) transfer process to transfer an eSIM profile to the target device, a first message comprising a target embedded identity document (EID) of the target device, generate, for transmission to the target device, a second message comprising a source EID of the source device and prepare, for transmission to the target device, the eSIM profile, a third message comprising the eSIM profile and an indication of a first state of the eSIM profile on the source device, wherein the eSIM profile includes an Integrated Circuit Card Identification Number (ICCID).

Abstract: The disclosure describes a novel method and apparatus for testing different types of TSVs in a single die or different types of TSV connections in a stack of die. The testing is facilitated by test circuitry associated with each type of TSV. The test circuitry includes a scan cell adapted for testing TSVs.

Abstract: A wearable two-way communication audio device includes a first microphone that provides a first microphone signal, a second microphone that provides a second microphone signal, and one or more processors. The one or more processors are configured to use the second microphone signal to estimate an ambient noise level and adjust an equalization filter based on the estimated ambient noise level. The first microphone signal and the second microphone signal may be processed via a first beamformer to provide a first beamformed signal and the first beamformed signal may be filtered with the equalization filter to provide a noise estimate signal. The one or more processors may also use the noise estimate signal to generate a voice output signal for transmission to a far end recipient.