Abstract: Provided herein is a method for improving growth, stress tolerance and productivity of a plant. Also provided herein is a method for increasing seed quality of a plant. Specifically, the disclosure provides a method for improving growth, stress tolerance and productivity of a plant, comprising: providing a transgenic plant, which includes a reduced expression on an MYBS2 gene as relative to its wild-type counterpart; and a method for increasing seed quality of a plant, comprising: providing a seed from a transgenic plant, which overexpresses a full-length MYBS2 gene or a mutant MYBS2 gene as relative to its wild-type counterpart.

Abstract: A system or a method includes defining missions based on factors associated with the missions or environmental data associated with the system, assigning the missions to the fleet of robots based on capabilities of the robots, generating a schedule of the missions and the robots, and managing the fleet of robots using feedback.

Abstract: A system or a method includes defining missions based on factors associated with the missions or environmental data associated with the system, assigning the missions to the fleet of robots based on capabilities of the robots, generating a schedule of the missions and the robots, and managing the fleet of robots using feedback.

Abstract: A system or a method includes defining missions based on factors associated with the missions or environmental data associated with the system, assigning the missions to the fleet of robots based on capabilities of the robots, generating a schedule of the missions and the robots, and managing the fleet of robots using feedback.

Abstract: A system or a method includes defining missions based on factors associated with the missions or environmental data associated with the system, assigning the missions to the fleet of robots based on capabilities of the robots, generating a schedule of the missions and the robots, and managing the fleet of robots using feedback.

Abstract: A system or a method includes defining missions based on factors associated with the missions or environmental data associated with the system, assigning the missions to the fleet of robots based on capabilities of the robots, generating a schedule of the missions and the robots, and managing the fleet of robots using feedback.

Abstract: A single ended receiver includes a current mode logic circuit, a differential to single amplifier, and a voltage detector. The current mode logic circuit is configured to receive an input signal and a reference voltage value and is configured to output a first output signal. The differential to single amplifier is coupled to the current mode logic circuit and is configured to receive the first output signal and to output a second output signal. The voltage detector is coupled to the differential to single amplifier and is configured to output a control signal to the differential to single amplifier according to the reference voltage value. The differential to single amplifier is further configured to adjust a voltage value of the differential to single amplifier internal signal according to the control signal, so that a duty cycle of the second output signal is adjusted.

Abstract: The present invention provides a touch device, including a cover plate, a circuit board, a bracket, and a noise reduction layer group. The circuit board is fixed below the cover plate. The circuit board is provided with a trigger zone located on a bottom surface, and includes an elastic sheet located in the trigger zone. The bracket is disposed below the circuit board. The noise reduction layer group is disposed between the bracket and the elastic sheet.

Abstract: An antenna structure includes a first radiation element, a second radiation element, a third radiation element, a fourth radiation element, a fifth radiation element, and a dielectric substrate. The first radiation element has a positive feeding point. The second radiation element is coupled to the first radiation element. The third radiation element has a negative feeding point. The fourth radiation element is coupled to the third radiation element. The fifth radiation element is floating. The dielectric substrate has a first surface and a second surface which are opposite to each other. The first radiation element and the third radiation element are both disposed on the first surface of the dielectric substrate. The second radiation element, the fourth radiation element, and the fifth radiation element are all disposed on the second surface of the dielectric substrate.

Abstract: An antenna structure includes a first radiation element, a second radiation element, a third radiation element, a fourth radiation element, a fifth radiation element, and a dielectric substrate. The first radiation element has a positive feeding point. The second radiation element is coupled to the first radiation element. The third radiation element has a negative feeding point. The fourth radiation element is coupled to the third radiation element. The fifth radiation element is floating. The dielectric substrate has a first surface and a second surface which are opposite to each other. The first radiation element and the third radiation element are both disposed on the first surface of the dielectric substrate. The second radiation element, the fourth radiation element, and the fifth radiation element are all disposed on the second surface of the dielectric substrate.

Abstract: A wafer-grade LED detection device and a wafer-grade LED detection method are provided. The wafer-grade LED detection device includes a light-generating module for providing a first light beam that passes through an LED wafer to be converted into a second light beam, a light-filtering module adjacent to the LED wafer for receiving the second light beam that passes through the light-filtering module to be converted into a third light beam, and a light-detecting module adjacent to the light-filtering module for receiving and detecting the third light beam. A wavelength range of the second light beam is restricted by the light-filtering module, so that a wavelength range of the third light beam is smaller than the wavelength range of the second light beam. When the third light beam is received by the light-detecting module, the light-detecting module can detect the third light beam for obtaining relevant information.

Abstract: The invention provides a touch device and an input module. The touch device includes a cover plate, a circuit board, a restoration element, a bracket, at least one conductive pad, and a buffer layer. The circuit board is disposed on one side of the cover plate and has a first surface facing the cover plate, a second surface opposite to the first surface, and at least one conductive switch disposed on the second surface. The bracket is disposed on the second surface of the circuit board. The restoration element is disposed on the second surface, and the conductive pad is disposed on the bracket and located between the bracket and the circuit board. The conductive pad and the restoration element are separately disposed, and the conductive pad corresponds to the conductive switch. The buffer layer is disposed between the second surface and the restoration element.

Abstract: An LED wafer, an LED wafer detection device and an LED wafer detection method are provided. The LED wafer includes a wafer base, a plurality of LED chips, a plurality of positive test circuit layers, a plurality negative test circuit layers, a plurality of positive test contacts, and a plurality of negative test contacts. Each LED chip has a positive contact and a negative contact respectively electrically connected to the corresponding positive test circuit layer and the corresponding negative test circuit layer. The positive test contacts are respectively electrically connected to the positive test circuit layers, and the negative test contacts are respectively electrically connected to the negative test circuit layers. Whereby, when inputting an electric current into the positive test contacts, and then outputting the electric current from the negative test contacts, each LED chip is excited to generate a light source.

Abstract: The present invention provides a touch control device, including a cover plate, a circuit board, an elastic sheet body and a bracket. The circuit board is fixedly arranged below the cover plate. The circuit board is provided with a triggering region located on a bottom surface. The elastic sheet body is arranged under the circuit board and corresponds to the triggering region. The bracket is disposed below the circuit board. The bracket is provided with a first side and a second side which are opposite and a middle region located on the second side and further comprises two cantilevers which are located at both sides of the middle region of the second side and extend towards opposite directions. The elastic sheet body is in contact with the middle region. The end of each cantilever is provided with an abutting-joint structure and is in contact with the circuit board by the abutting-joint structure.

Abstract: A chip carrying structure having chip-suction function is provided. The chip carrying structure includes a non-circuit substrate and a plurality of micro heaters. The non-circuit substrate has a plurality of openings and a plurality of air extraction channels respectively communicated with the openings. The micro heaters are disposed on the non-circuit substrate and carried by the non-circuit substrate. Each of the openings of the non-circuit substrate contacts and suctions one of a plurality of chips, and no adhesive layer is disposed between the non-circuit substrate and the chip. When air is exhausted from the air extraction channels, the openings of the non-circuit substrate can be used to respectively suck the chips, so that the chips can be attached to the non-circuit substrate, and the micro heater can heat a solder ball that is contacted by the chip.

Abstract: An LED wafer, an LED wafer detection device and an LED wafer detection method are provided. The LED wafer includes a wafer base, a plurality of LED chips, a plurality of positive test circuit layers, a plurality negative test circuit layers, a plurality of positive test contacts, and a plurality of negative test contacts. Each LED chip has a positive contact and a negative contact respectively electrically connected to the corresponding positive test circuit layer and the corresponding negative test circuit layer. The positive test contacts are respectively electrically connected to the positive test circuit layers, and the negative test contacts are respectively electrically connected to the negative test circuit layers. Whereby, when inputting an electric current into the positive test contacts, and then outputting the electric current from the negative test contacts, each LED chip is excited to generate a light source.

Abstract: An LED wafer, an LED wafer detection device and an LED wafer detection method are provided. The LED wafer includes a wafer base, a plurality of LED chips, a plurality of positive test circuit layers, a plurality negative test circuit layers, a plurality of positive test contacts, and a plurality of negative test contacts. Each LED chip has a positive contact and a negative contact respectively electrically connected to the corresponding positive test circuit layer and the corresponding negative test circuit layer. The positive test contacts are respectively electrically connected to the positive test circuit layers, and the negative test contacts are respectively electrically connected to the negative test circuit layers. Whereby, when inputting an electric current into the negative test contacts, and then outputting the electric current from the positive test contacts, each LED chip is excited to generate a light source.

Abstract: A wafer-grade LED detection device and a wafer-grade LED detection method are provided. The wafer-grade LED detection device includes a light-generating module for providing a first light beam that passes through an LED wafer to be converted into a second light beam, a light-filtering module adjacent to the LED wafer for receiving the second light beam that passes through the light-filtering module to be converted into a third light beam, and a light-detecting module adjacent to the light-filtering module for receiving and detecting the third light beam. A wavelength range of the second light beam is restricted by the light-filtering module, so that a wavelength range of the third light beam is smaller than the wavelength range of the second light beam. When the third light beam is received by the light-detecting module, the light-detecting module can detect the third light beam for obtaining relevant information.

Abstract: A capacitor is provided. The capacitor includes a first electrode layer and a second electrode layer; and a first dielectric layer and a second dielectric layer, wherein the first dielectric layer and the second dielectric layer are disposed between the first electrode layer and the second electrode layer. The first dielectric layer includes a first dielectric powder and a first organic resin, and the second dielectric layer includes a second dielectric powder and a second organic resin. In particular, the weight ratio of the first dielectric powder to the first organic resin is greater than the weight ratio of the second dielectric powder to the second organic resin.