Abstract: A board card module including a case, a main board, and an expansion card is provided. The case has an accommodating space. The main board is fixed to the case and located in the accommodating space. The main board has a connecting port. The expansion card is detachably pivoted to the case and located in the accommodating space. The expansion card has a terminal set and the expansion card is rotatable relative to the case to insert the terminal set into or separate the terminal set from the connecting port.

Abstract: An apparatus for producing an inorganic powder and an apparatus for producing and classifying an inorganic powder are provided, wherein the apparatus for producing an inorganic powder includes an insulating tube, at least one pair of annular RF electrodes, and a gas supply apparatus. The pair of annular RF electrodes surrounds the outer circumference of the insulating tube to generate a first electric field region outside the insulating tube and generate a second electric field region having a plasma torch in the insulating tube after being turned on. The gas supply apparatus supplies a reaction mist and an inert gas into the insulating tube to thermally degrade and oxidize the reaction mist into an inorganic powder via the plasma torch.

Abstract: An internet of things (IOT) system includes an IOT server and multiple IOT devices and a voice-controlled device connected to the IOT server and the multiple IOT devices. The voice-controlled device receives a voice-controlled message of environmental sound information through a voice control interface, and broadcasts the voice-controlled message to neighboring IOT devices to drive a corresponding IOT device according to the voice-controlled message. When failing to recognize the voice-controlled message, the voice control interface uploads the voice-controlled message to a cloud server for query through the IOT server, and broadcasts a result of the query returned from the cloud server. A way of chain broadcasting is employed by the voice-controlled device to drive selected IOT device or receive returned information so as to enhance operational convenience in using IOT devices.

Abstract: Disclosed herein is a process for preparing 5-(chloromethyl)furfural which includes the steps of: subjecting a cellulosic biomass to a pretreatment so as to obtain a pretreated cellulosic biomass, the pretreatment including a dilute acid treatment and a steam explosion treatment conducted after the dilute acid treatment; mixing the pretreated cellulosic biomass with hydrochloric acid so as to obtain a mixture; reacting the pretreated cellulosic biomass with the hydrochloric acid in the mixture so as to produce a reaction product containing 5-(chloromethyl) furfural; and extracting 5-(chloromethyl)furfural from the reaction product with an organic solvent.

Abstract: An internet of things (IOT) system includes an IOT server and multiple IOT devices and a voice-controlled device connected to the IOT server and the multiple IOT devices. The voice-controlled device receives a voice-controlled message of environmental sound information through a voice control interface, and broadcasts the voice-controlled message to neighboring IOT devices to drive a corresponding IOT device according to the voice-controlled message. When failing to recognize the voice-controlled message, the voice control interface uploads the voice-controlled message to a cloud server for query through the IOT server, and broadcasts a result of the query returned from the cloud server. A way of chain broadcasting is employed by the voice-controlled device to drive selected IOT device or receive returned information so as to enhance operational convenience in using IOT devices.

Abstract: A flexible substrate embedded with wires includes a flexible substrate constituted by a polymer material, and a continuous wire pattern containing a plurality of pores embedded in the flexible substrate, wherein the polymer material fills the pores. A method for fabricating a flexible substrate embedded with wires providing a carrier; forming a continuous wire pattern on the carrier, the continuous wire pattern containing a plurality of pores; covering a polymer material over the continuous wire pattern and the carrier and to fill into the pores; and separating the polymer material and the carrier to form a flexible substrate embedded with the continuous wire pattern” where the only change is the addition of wires.

Abstract: A high-brightness light-emitting diode with surface microstructure and preparation and screening methods thereof are provided. The ratio of total roughened surface area of light transmission surface of a light emitting diode to vertically projected area is greater than 1.5, and the peak density of light transmission surface is not less than 0.3/um2. The higher the ratio of total roughened surface area of an epitaxial wafer to vertically projected area and the higher the number of peak over the critical height within a unit area, the more beneficial to improve light extraction efficiency of the epitaxial wafer. As a result, light extraction efficiency of the epitaxial wafer is greatly improved.

Abstract: A coating device is provided, and includes a coater and an electrical field generator. The coater contains a slurry or ink and has an outlet. The slurry or ink is coated on a substrate through the outlet. The substrate is disposed adjacent to the outlet, and loads the slurry or ink from the outlet of the coater to form a wet film. The electrical field generator is disposed under the substrate and provides the electrical field, and thus the wet film stacks tightly on the substrate due to the attraction of the electrical field.

Abstract: A solar cell module includes a substrate; an absorber layer formed over the substrate; a porous alumina passivation layer formed on an upper surface of the absorber layer; a buffer layer conformably formed over the passivation layer; and a transparent conducting oxide layer conformably formed over the buffer layer.

Abstract: A radio frequency (RF) identification tag including a substrate, a planar antenna, an RF chip, a plurality of signal conductors and a plurality of ground conductors is provided. The RF chip receives an RF signal from the planar antenna to generate an identification code. The signal conductors are coupled to the planar antenna. The ground conductors, interlaced on two opposite sides of the signal conductors, and the signal conductors are adjacent to each other and disposed on the substrate to form a coplanar waveguide structure which includes an impedance match portion and a transmission portion. The impedance match portion has an input end coupled to the signal conductors and a ground plane coupled to the ground conductors. The RF chip is disposed between the input end and the ground plane. The transmission portion is connected between the impedance match portion and the planar antenna.

Abstract: A flexible substrate embedded with wires is provided. The flexible substrate embedded with wires includes a flexible substrate constituted by a polymer material, and a continuous wire pattern containing a plurality of pores embedded in the flexible substrate, wherein the polymer material fills the pores. A method for fabricating a flexible substrate embedded with wires is also provided.

Abstract: A method for producing terephthalic acid comprises the steps of: subjecting methyl acrylate to contact with aluminum chloride so as to form a complex; adding isoprene to the complex to result in a Diels-Alder reaction which is kept at a temperature no higher than 50° C. by cooling so as to obtain a cyclic adduct product; subjecting the cyclic adduct product to separation so as to obtain a cyclic para-precursor; and subjecting the cyclic para-precursor to a chemical reaction so as to obtain terephthalic acid.

Abstract: A method for providing thermotolerance of a plant and the genetic engineering applications thereof are disclosed. DNA fragment containing a gene encoding EXPORTIN1A is transferred into a plant cell to provide or enhance thermotolerance of the plant. The method can be applied in genetic engineering to select transgenic plant.

Abstract: A charcopyrite-based thin film solar cell device and a method of fabricating the same is described. The solar cell includes a stacked absorber film over a substrate. The stacked absorber film includes at least two sets of absorber materials and each set includes at least three layers. At least one of the three layers includes elemental selenium and at least one of the layers includes a metal selected from the group consisting of copper, indium or gallium. The at least one selenium layer is in contact with the at least one metal layer. The at least two sets form an absorber film including multi-layer embedded selenium.

Abstract: A method for forming nanometer scale dot-shaped materials is provided. The method includes providing a sub-micrometer scale material and a metallo-organic compound. The sub-micrometer scale material and the metallo-organic compound are mixed in a solvent. Then, the metallo-organic compound is decomposed by thermal decomposition process and reduced to form a plurality of nanometer scale dot-shaped materials on the sub-micrometer scale material, wherein the sub-micrometer scale material and the nanometer-scale dot-shaped materials are heterologous materials. Then, the plurality of nanometer scale dot-shaped materials is melted, such that a plurality of the adjacent sub-micrometer scale materials is connected to each other to form a continuous interface between the sub-micrometer scale materials.

Abstract: A nano-metal solution, nano-metal complex grains, and a manufacturing method of a metal film are provided. The nano-metal solution includes metal grains having an amount of 0.1˜30 wt %, metallic-organic self-decomposition molecules having an amount of 0.1˜50 wt % and having formula 1, and a solvent having an amount of 20˜99.8 wt %: wherein M represents a metal ion. The metallic-organic self-decomposition molecules and the metal grains are evenly mixed in the solvent, and the metallic-organic self-decomposition molecules are adsorbed on surfaces of the metal grains.

Abstract: A semiconductor light emitting device includes a substrate and a first epitaxial structure over the substrate. The first epitaxial structure includes a first doped layer, a first light emitting layer, and a second doped layer. A first electrode is coupled to the first doped layer. A second electrode is coupled to the second doped layer facing the same direction as the first electrode. A second epitaxial structure includes a third doped layer, a second light emitting layer, and a fourth doped layer. A third electrode is coupled to the third doped layer facing the same direction as the first electrode. A fourth electrode is coupled to the fourth doped layer facing the same direction as the first electrode. An adhesive layer is between the first epitaxial structure and the second epitaxial structure.

Abstract: A light emitting diode array includes a first light emitting diode having a first electrode and a second light emitting diode having a second electrode. The first and second light emitting diodes are separated. A first polymer layer is positioned between the light emitting diodes. An interconnect located at least partially on the first polymer layer connects the first electrode to the second electrode. A permanent substrate is coupled to the light emitting diodes. The permanent substrate is coupled to the side of the light emitting diodes opposite the interconnect. A second polymer layer at least partially encapsulates the side of the light emitting diodes with the interconnect.

Abstract: A semiconductor light emitting device includes a substrate and a first epitaxial structure over the substrate. The first epitaxial structure includes a first doped layer, a first light emitting layer, and a second doped layer. The first doped layer includes a first dopant type and the second doped layer includes a second dopant type. A second epitaxial structure includes a third doped layer, a second light emitting layer, and a fourth doped layer. An adhesive layer is between the first epitaxial structure and the second epitaxial structure. One or more posts are located in the adhesive layer. An electrode pattern is located on an upper surface of the second epitaxial structure, wherein the posts are located under electrodes in the electrode pattern.

Abstract: A light-emitting diode (LED) device includes at least one LED unit, each including a substrate; an electrical coupling layer deposited above the substrate; a parallel-connected epitaxial structure deposited above the electrical coupling layer; and an intermediate layer deposited between the electrical coupling layer and the parallel-connected epitaxial structure. In another embodiment, the parallel-connected epitaxial structure is deposited above a conductive layer; the electrical coupling layer is deposited above the parallel-connected epitaxial structure; and the intermediate layer is deposited between the parallel-connected epitaxial structure and the electrical coupling layer.