Abstract: Embodiments include semiconductor packages and method of forming the semiconductor packages. A semiconductor package includes a plurality of conductive layers over a package substrate. The conductive layers include a first conductive layer and first-level interconnects (FLIs) in the package substrate. The semiconductor package also includes a solder resist that surrounds the FLIs, where the solder resist has a top surface that is substantially coplanar to top surfaces of the FLIs, a bridge coupled directly to the first conductive layer with solder balls, where the first conductive layer is coupled to the FLIs, and a dielectric over the conductive layers, the bridge, and the solder resist of the package substrate. The bridge may be an embedded multi-die interconnect bridge (EMIB). The first conductive layer may include first conductive pads and second conductive pads. The FLIs may include first conductive vias, second conductive vias, diffusion layers, and third conductive pads.

Abstract: Methods, systems, and devices related to related to digital wireless communication, and more specifically, to techniques related to the multi-link operation. In one exemplary aspect, a method for wireless communication includes transmitting a multi-link capability information from a network node indicating the network node is capable of operation on multi-link. In another exemplary aspect, the method includes receiving a multi-link capability indication message and using multi-link association request and response message exchanges to establish or update an association between a station and a network node for operation over one or more wireless links.

Abstract: The present disclosure provides a user equipment and a method for performing data transmission. The method includes receiving at least one of downlink control information (DCI) or higher layer signaling from a base station; determining a transmission format of the data transmission based on at least one of the DCI or the higher layer signaling; and performing the data transmission based on the determined transmission format. The present disclosure also provides a base station and a method for performing data transmission.

Abstract: A medical system may utilize a modular and extensible sensing device to derive a two-dimensional (2D) or three-dimensional (3D) human model for a patient in real-time based on images of the patient captured by a sensor such as a digital camera. The 2D or 3D human model may be visually presented on one or more devices of the medical system and used to facilitate a healthcare service provided to the patient. In examples, the 2D or 3D human model may be used to improve the speed, accuracy and consistency of patient positioning for a medical procedure. In examples, the 2D or 3D human model may be used to enable unified analysis of the patient's medical conditions by linking different scan images of the patient through the 2D or 3D human model. In examples, the 2D or 3D human model may be used to facilitate surgical navigation, patient monitoring, process automation, and/or the like.

Abstract: Provided is a large high-speed rotary equipment gap stacking assembly apparatus and assembly method based on digital twin, and relates to the technical field of engine assembly measurement. The disclosure solves the problem of unbalanced rotation of the rotary parts caused by large assembly error during multi-stage rotary parts are stacked in a gap way. The disclosure includes the assembly apparatus entity and the assembly method; the assembly apparatus entity is configured to establish data communication with the upper computer through data acquisition apparatus, and upper computer is configured to establish a virtual assembly model; the virtual assembly model and optimal coaxiality of the multi-stage rotary parts in gap stacking can be obtained according to the assembly method, and the assembly process can be controlled by using the virtual assembly model and the optimal coaxiality. The disclosure is suitable for controlling the assembly process of the rotary parts.

Abstract: A display including a pixel circuit is provided. The pixel circuit includes a driving transistor, a writing transistor connected in series between a data line and the second node or the third node, an initialization module, and a compensation transistor connected in series between the first node and the second node or the third node. In the driving transistor, a gate is connected to the first node, a first electrode is connected to the second node, and a second electrode is connected to the third node. A gate of the writing transistor is connected to a scanning signal. The initialization module is connected to the first, second, and/or third nodes to perform resetting. The compensation transistor remains a turned-on state in only one continuous time period in each frame, and the initialization module and the writing transistor turn on in a time-sharing manner in the continuous time period.

Abstract: A multi-layer display module includes a first display panel, a second display panel, a driving device, and an image composition control unit. The second display panel is located beside the first display panel and overlaps the first display panel. The first display panel and the second display panel have an interval therebetween. The driving device is configured to simultaneously provide image signals to the first display panel and the second display panel. An object image displayed in the first display panel is a first object image. An object image displayed in the second display panel is a second object image. The image composition control unit is configured to increase a size of the first object image displayed on the first display panel or decrease a size of the second object image displayed on the second display panel according to information of a relative position of an outside viewer.

Abstract: A memory device includes a substrate, word line layers, insulating layers, and memory cells. The word line layers are stacked above the substrate. The insulating layers are stacked above the substrate respectively alternating with the word line layers. The memory cells are distributed along a stacking direction of the word line layers and the insulating layers perpendicularly to a major surface of the substrate. Each memory cell includes a source line electrode and a bit line electrode, a first oxide semiconductor layer, and a second oxide semiconductor layer. The first oxide semiconductor layer is peripherally surrounded by one of the word line layers, the source line electrode, and the bit line electrode. The second oxide semiconductor layer is disposed between the one of the word line layers and the first oxide semiconductor layer.

Abstract: A suspension roasting system includes a feeding bin, a Venturi dryer, a first cyclone preheater, a second cyclone preheater, a pre-oxidation suspension roasting furnace, a thermal separation cyclone cylinder, a suspension and reduction roasting furnace, a collecting bin, a grinding machine, a magnetic ore separator and a draught fan.

Abstract: An LED display screen, comprising: an LED array, consisting of multiple LED light-emitting units and used for emitting a light; an optical diffusion film, provided at a light exit side of the LED array; a matrix shading frame, comprising multiple hollow shading gratings, the hollow shading gratings corresponding one-to-one to the LED light-emitting units; and a substrate, used for supporting the LED array and the matrix shading frame, where the light emitted by the LED light-emitting units, after running through the hollow shading gratings, is diffused to a viewer side via the optical diffusion film, and the LED light-emitting units emit the light towards the hollow shading gratings.

Abstract: Provided are compound represented by Formula 1, an organic electric element including a first electrode, a second electrode, and an organic material layer formed between the first electrode and the second electrode, and electronic device thereof, and by including the compound represented by Formula 1 in the organic material layer, the driving voltage of the organic electric element can be lowered, and the luminous efficiency and life time of the organic electric element can be improved.

Abstract: The present disclosure provides a pellet. In an embodiment, the pellet includes a body having a first end and an opposing second end. The body is composed of a polymeric material. The body has a length and a diameter (body diameter). A channel having a diameter (channel diameter), extends through the body from the first end to the second end. The pellet has a channel diameter-to-body diameter ratio from 0.05 to 0.45. The present disclosure also provides a process for soaking the pellet in a liquid additive and forming a loaded pellet with the additive in the pellet body.

Abstract: Methods, systems, and devices for wireless communications are described. A first user equipment (UE) may perform a channel access procedure to gain access to a bandwidth part in a shared spectrum for sidelink communications with a second UE. The first UE may transmit a signal to the second UE using one or more sub-bands of the bandwidth part, and the signal may include one or more sidelink synchronization signal blocks (S-SSBs) multiplexed with frequency resources associated with a physical sidelink shared channel (PSSCH). The one or more S-SSBs may be transmitted using a set of symbol periods of a transmission time interval (TTI) (e.g., a slot) that are preceded by a least four initial symbol periods of the TTI. In some examples, the first UE may transmit a sidelink control information (SCI) message indicating which of the one or more sub-bands include the one or more S-SSBs.

Abstract: In an implementation, a software application on a computing device directs the device to extract audio data from a media file comprising the audio data and video data, generate a trim proposal based on analysis of speech in the audio data, and display a visualization of the trim proposal. A user may supply input comprising a selection of at least a portion of the visualization of the trim proposal, in response to which the device trims the media file.

Abstract: A UE may receive multiple signals causing a Quasi co-location TypeD (QCL-TypeD) collision. To determine which of the multiple signals to select, the UE may use a certain option based on a type transmission scheme associated with each of the multiple signals. The options may include one of a priority rule for signal reception, a scheduling restriction, or a priority rule for QCL-TypeD selection.

Abstract: A method includes converting ˜9 nm soft-magnet Al—CoPt into a hard-magnet L10-CoPt, acid etching the hard-magnet L10-CoPt, and annealing the acid etched hard-magnet L10-CoPt to generate a L10-CoPt/Pt catalyst.

Abstract: A sealing quality detection device for gas extraction boreholes includes a detection host, a detection pipe, a sealing element, and a three-way pipe. A plurality of air inlets and a plurality of exhaust ports are formed above the detection host, a negative pressure injector is arranged in the detection host, a quick joint and a control switch are also arranged on the detection host, the quick joint is used to be connected with an underground wind pipe, the underground wind pipe is connected to an underground compressed air tube, and the control switch is used for starting and switching off the negative pressure injector in the detection host. A sealing quality evaluating method for gas extraction boreholes is provided.

Abstract: A micro LED display device includes a circuit substrate, an epitaxial structure layer, a metal conductive layer, a light conversion layer and a light-shielding structure. The epitaxial structure layer includes a first surface, a second surface, and a plurality of micro LED units separated from each other. The micro LED units are electrically connected to the circuit substrate. The metal conductive layer is disposed on the second surface and directly contacts the epitaxial structure layer, and has a plurality of light conversion region each corresponds to one of the micro LED units. The light conversion layer is disposed in a part of the light conversion regions. The light-shielding structure does not cover the light conversion regions. In the direction perpendicular to a bonding surface of the circuit substrate, the thickness of the metal conductive layer is greater than that of the epitaxial structure layer.