Patents by Inventor An-Te Tseng

An-Te Tseng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8054369
    Abstract: An image capturing device includes a base formed with a first receiving space defined by a bottom wall and a first surrounding wall, and a second receiving space defined by a top side of the first surrounding wall and a second surrounding wall. A lens module is mounted on the base for generating an optical image of an object. An auto-focusing module is disposed in the second receiving space for auto-focusing the optical image based on an external voltage. A sensing module is mounted in the first receiving space and on the bottom wall of the base, is disposed under the auto-focusing module, and is spaced apart from the lens module at a predetermined distance for sensing the optical image focused by the auto-focusing module so as to generate an electrical output corresponding to the optical image.
    Type: Grant
    Filed: July 29, 2009
    Date of Patent: November 8, 2011
    Assignees: Silitek Electronic (Guangzhou) Co., Ltd., Lite-On Technology Corp.
    Inventors: Cheng-Te Tseng, Tzu-Kan Chen, Meng-Hsin Kuo, Chia-Hsi Tsai
  • Patent number: 8035693
    Abstract: A micro-optical image stabilizer is disclosed. The optical image stabilizer includes a substrate, a carrier movably disposed on the substrate for carrying an image sensor, an anchor fixed on the substrate, a conducting pad fixed on the anchor for coupling an image processing circuit, a flexible suspension disposed between the conducting pad and the carrier, a conducting line disposed on the flexible suspension coupled to the conducting pad and protruding over the carrier for coupling the image sensor, and a micro actuator disposed between the substrate and the carrier for adjusting the position of the carrier according to control signals from an actuator control circuit.
    Type: Grant
    Filed: July 20, 2007
    Date of Patent: October 11, 2011
    Assignee: Lite-On Technology Corporation
    Inventors: Jin-Chern Chiou, Yung-Jiun Lin, Tzu-Kan Chen, Cheng-Te Tseng, Chia-Hsi Tsai
  • Publication number: 20110227782
    Abstract: A method for detecting a vehicle type, a vehicle speed and width of a detecting area by a vehicle radar sensor is disclosed. A radio wave is transmitted to a tracked vehicle. Subsequently, the reflective radio wave from the vehicle is received. The Doppler frequency versus time distribution is generated from the reflective radio wave. Because the reflective radio wave is influenced by the Doppler Effect, a parallelogram or a shape close to a parallelogram of a consecutive motion diagram is shown in the Doppler frequency versus time distribution of the vehicle. According to the consecutive motion diagram, certain information, such as the length and speed of the tracked vehicle and the width of the detecting area, can be acquired.
    Type: Application
    Filed: July 15, 2010
    Publication date: September 22, 2011
    Inventor: Ming-Te TSENG
  • Patent number: 7911703
    Abstract: The present invention provides a manufacturing method for a wafer lens module including the steps of providing a plastic material with high thermal resistance, wherein the high temperature plastic material can be used at a reflow temperature above 250?; and forming the high temperature plastic material into a wafer lens module integrally. The method can form an integrated wafer lens module and simplify the manufacturing procedures. Furthermore, a wafer lens unit formed by stacking another wafer lens module on the wafer lens module manufactured by the method can have improved optical image quality.
    Type: Grant
    Filed: August 25, 2009
    Date of Patent: March 22, 2011
    Assignees: Silitek Electronic (Guangzhou) Co., Ltd., Lite-On Technology Corporation
    Inventors: Chia-Hsi Tsai, Cheng-Te Tseng, Tzu-Kan Chen, Meng-Hsin Kuo
  • Patent number: 7860612
    Abstract: A control system for controlling actions performed by a machine includes a sensor module for sensing environmental condition around the machine, an estimation unit for estimating the environmental condition detected by the sensor, a motor for controlling movement of the machine, a control unit for calculating a magnitude of motion according to the estimated environmental condition, the magnitude of motion used for controlling the movement of the machine, and a motor drive circuit for driving the motor to move the machine using the calculated magnitude of motion.
    Type: Grant
    Filed: June 25, 2010
    Date of Patent: December 28, 2010
    Assignee: Qisda Corporation
    Inventors: Yen-Ju Huang, Wei-Nan William Tseng, Cheng-Te Tseng, Hung-Yi Chen
  • Publication number: 20100320367
    Abstract: A method for making camera modules includes the steps of: a) providing a wafer including an array of sensor chips; b) mounting a plurality of lens assemblies on the sensor chips, respectively, thereby defining a plurality of intersecting spacing grooves among the lens assemblies; c) forming a substrate layer by filling in the spacing grooves with a resin material; and d) cutting the wafer and the substrate layer along intersecting cutting lines each extending along one of the spacing grooves and each intervening the lens assemblies, the substrate layer being divided into a plurality of barrels respectively surrounding the lens assemblies. A camera module made by the method is also disclosed.
    Type: Application
    Filed: August 11, 2010
    Publication date: December 23, 2010
    Applicants: SILITEK ELECTRONIC (GUANGZHOU) CO., LTD., LITE-ON TECHNOLOGY CORP.
    Inventors: CHIA-HSI TSAI, CHENG-TE TSENG, TZU-KAN CHEN, YI-TING LIN
  • Patent number: 7855390
    Abstract: A package structure of a light emitting diode for a backlight comprises a long-wavelength LED die and a short-wavelength LED die. The lights emitted from the two LED dies are mixed with the light emitted from excited fluorescent powders for serving as the backlight of a liquid crystal display. A partition plate is disposed between the two LED dies for separating them from each other. The effective light output of the package structure is increased because each of the two LED dies cannot absorb the light from the other.
    Type: Grant
    Filed: May 9, 2008
    Date of Patent: December 21, 2010
    Assignee: Advanced Optoelectronic Technology, Inc.
    Inventors: Jian Shihn Tsang, Wen Liang Tseng, Yao Te Tseng, Shih Hsiung Chang
  • Publication number: 20100265671
    Abstract: The package structure of the PCB comprises a substrate and a frame. The frame is located at the top of the substrate, and the substrate and the frame define a receiving space. The electronic components are mounted on the substrate and distributed in the receiving space. Because of the protection of the frame, the electronic components are effectively protected from the collision of installation in the process or use in the process. The substrate can be a flexible circuit board or a rigid-flex PCB and the electronic components are directly embedded in the substrate. Therefore the thickness of the package structure is reduced.
    Type: Application
    Filed: August 7, 2009
    Publication date: October 21, 2010
    Applicants: SILITEK ELECTRONIC (GUANGZHOU) CO., LTD., LITE-ON TECHNOLOGY CORPORATION
    Inventors: CHIA-HSI TSAI, CHENG-TE TSENG, TZU-KAN CHEN, YI-TING LIN
  • Publication number: 20100262284
    Abstract: A control system for controlling actions performed by a machine includes a sensor module for sensing environmental condition around the machine, an estimation unit for estimating the environmental condition detected by the sensor, a motor for controlling movement of the machine, a control unit for calculating a magnitude of motion according to the estimated environmental condition, the magnitude of motion used for controlling the movement of the machine, and a motor drive circuit for driving the motor to move the machine using the calculated magnitude of motion.
    Type: Application
    Filed: June 25, 2010
    Publication date: October 14, 2010
    Inventors: Yen-Ju Huang, Wei-Nan William Tseng, Cheng-Te Tseng, Hung-Yi Chen
  • Publication number: 20100252842
    Abstract: A package structure of a light emitting diode for a backlight comprises a long-wavelength LED die and a short-wavelength LED die. The lights emitted from the two LED dies are mixed with the light emitted from excited fluorescent powders for serving as the backlight of a liquid crystal display. A partition plate is disposed between the two LED dies for separating them from each other. The effective light output of the package structure is increased because each of the two LED dies cannot absorb the light from the other.
    Type: Application
    Filed: June 14, 2010
    Publication date: October 7, 2010
    Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY INC.
    Inventors: JIAN SHIHN TSANG, WEN LIANG TSENG, YAO TE TSENG, SHIH HSIUNG CHAN
  • Patent number: 7803261
    Abstract: The present invention discloses a method to deposit particles on a charge storage apparatus with charge patterns and a forming method for charge patterns. The forming method for charge patterns includes providing the charge storage apparatus having an electrically conducting substrate and a charge storage media layer. The charge storage apparatus is disposed in a vacuum or an anhydrous environment. An electrode and the electrically conducting substrate are utilized to conduct a first voltage and a second voltage respectively to form an electric field. Charges are then stored into the charge storage media layer of the charge storage apparatus through the electric field and the charge patterns are then formed. Accordingly, particles are deposited on the charge pattern-defined areas.
    Type: Grant
    Filed: December 19, 2007
    Date of Patent: September 28, 2010
    Assignee: National Tsing Hua University
    Inventors: Shangjr Gwo, Hsien-Te Tseng
  • Patent number: 7795066
    Abstract: A method for making lens modules includes the steps of: a) providing a wafer including an array of sensor chips; b) mounting a plurality of lens assemblies on the sensor chips, respectively, thereby defining a plurality of intersecting spacing grooves among the lens assemblies; c) forming substrate layer by filling in the spacing grooves with a resin material; and d) cutting the wafer and the substrate layer along intersecting cutting lines each extending along one of the spacing grooves and each intervening the lens assemblies, the substrate layer being divided into a plurality of barrels respectively surrounding the lens assemblies. A lens module made by the method is also disclosed.
    Type: Grant
    Filed: November 13, 2008
    Date of Patent: September 14, 2010
    Assignees: Silitek Electronic (Guangzhou) Co., Ltd., Lite-On Technology
    Inventors: Chia-Hsi Tsai, Cheng-Te Tseng, Tzu-Kan Chen, Yi-Ting Lin
  • Patent number: 7787199
    Abstract: A camera module includes a lens barrel, a lens, a sensing element, and an electromagnetic shield. The lens barrel defines a receiving space. The lens is mounted in the receiving space. The sensing element is covered by the lens barrel, is disposed below the lens, and is spaced apart from the lens. The sensing element includes a top face, a bottom face, a side face extending between the top and bottom faces, a plurality of first conductors mounted on the bottom face, at least one second conductor mounted on one of the top, bottom, and side faces, and a grounding element having one end connected to one of the first conductors and the other end connected to the second conductor. The electromagnetic shield is coupled to the lens barrel and includes a grounding portion electrically connected to the second conductor.
    Type: Grant
    Filed: June 16, 2008
    Date of Patent: August 31, 2010
    Assignees: Silitek Electronic (Guangzhou) Co., Ltd., Lite-On Technology Corp.
    Inventors: Chia-Hsi Tsai, Tzu-Kan Chen, Meng-Hsin Kuo, Cheng-Te Tseng, Yi-Ting Lin
  • Patent number: 7783382
    Abstract: A control system for controlling actions performed by a machine includes a sensor module for sensing environmental condition around the machine, an estimation unit for estimating the environmental condition detected by the sensor, a motor for controlling movement of the machine, a control unit for calculating a magnitude of motion according to the estimated environmental condition, the magnitude of motion used for controlling the movement of the machine, and a motor drive circuit for driving the motor to move the machine using the calculated magnitude of motion.
    Type: Grant
    Filed: February 24, 2006
    Date of Patent: August 24, 2010
    Assignee: Qisda Corporation
    Inventors: Yen-Ju Huang, Wei-Nan William Tseng, Cheng-Te Tseng, Hung-Yi Chen
  • Patent number: 7768724
    Abstract: A method for making a camera module includes the steps of: (a) providing a mold with a mold cavity; (b) mounting at least a sensing element and a lens within the mold cavity in such a manner that the sensing element and the lens are spaced apart from each other; and (c) forming a camera barrel by injecting a molding material into the mold cavity and by molding the molding material over the sensing element and the lens.
    Type: Grant
    Filed: May 14, 2008
    Date of Patent: August 3, 2010
    Assignee: Lite-On Technology Corp.
    Inventors: Chia-Hsi Tsai, Tzu-Kan Chen, Meng-Hsin Kuo, Cheng-Te Tseng
  • Publication number: 20100161204
    Abstract: The invention provides a method for identification of traffic lane boundary. Firstly the microwave signal is received, and the noise reduction is treated for the microwave signal. Then the frequency domain information is employed to calculate the legal set of closed interval, in order to form the frequency span information. Finally, the probability density function model is employed to calculate the frequency span information in order to identify the traffic lane boundary.
    Type: Application
    Filed: December 23, 2008
    Publication date: June 24, 2010
    Applicant: National Chiao Tung University
    Inventors: Yow-Jen Jou, Hsun-Jung Cho, Yu-Kuang Chen, Heng Huang, Chia-Chun Hsu, Rih-Jin Li, Chien-Lun Lan, Ming-Te Tseng
  • Publication number: 20100123814
    Abstract: An image capturing device includes a base formed with a first receiving space defined by a bottom wall and a first surrounding wall, and a second receiving space defined by a top side of the first surrounding wall and a second surrounding wall. A lens module is mounted on the base for generating an optical image of an object. An auto-focusing module is disposed in the second receiving space for auto-focusing the optical image based on an external voltage. A sensing module is mounted in the first receiving space and on the bottom wall of the base, is disposed under the auto-focusing module, and is spaced apart from the lens module at a predetermined distance for sensing the optical image focused by the auto-focusing module so as to generate an electrical output corresponding to the optical image.
    Type: Application
    Filed: July 29, 2009
    Publication date: May 20, 2010
    Inventors: Cheng-Te Tseng, Tzu-Kan Chen, Meng-Hsin Kuo, Chia-Hsi Tsai
  • Publication number: 20100073781
    Abstract: The present invention provides a manufacturing method for a wafer lens module including the steps of providing a plastic material with high thermal resistance, wherein the high temperature plastic material can be used at a reflow temperature above 250° C.; and forming the high temperature plastic material into a wafer lens module integrally. The method can form an integrated wafer lens module and simplify the manufacturing procedures. Furthermore, a wafer lens unit formed by stacking another wafer lens module on the wafer lens module manufactured by the method can have improved optical image quality.
    Type: Application
    Filed: August 25, 2009
    Publication date: March 25, 2010
    Inventors: Chia-Hsi Tsai, Cheng-Te Tseng, Tzu-Kan Chen, Meng-Hsin Kuo
  • Publication number: 20100046607
    Abstract: The invention discloses an image processing apparatus and an image processing method. A server can transmit a first image and a second image. In an embodiment, the apparatus includes a receiving/transmitting unit, a processing unit and a display unit. The receiving/transmitting unit can communicate with the server to receive the first image and the second image. The processing unit is coupled to the receiving/transmitting unit and the display unit. The processing unit is for selectively recompressing the first image at a first compression ratio and then controlling the display unit to display the first image. In addition, the processing unit transmits the selected first compression ratio to the server such that the server compresses the second image at the first compression ratio and transmits it to the receiving/transmitting unit.
    Type: Application
    Filed: August 14, 2009
    Publication date: February 25, 2010
    Inventors: Cheng-Te Tseng, Tson-Yee Lin, Chang-Hung Lee
  • Patent number: D649543
    Type: Grant
    Filed: December 22, 2010
    Date of Patent: November 29, 2011
    Assignee: Compal Electronics, Inc.
    Inventors: Huai-Te Tseng, Hong-Tien Wang, Yung-Hsiang Chen, You-Chi Liu, Shi Kuan Chen