Abstract: A wearable electronic device includes a device body, a wearable body, a circuit board, an antenna system and a conductive extension portion. The device body includes an upper casing and a lower casing. A feeding portion, a first grounding portion and a second grounding portion are disposed on a periphery of the circuit board. The second grounding portion is electrically connected to the upper casing. The antenna system is disposed on the inner surface of the lower casing. The feeding terminal of the antenna system is electrically connected to the feeding portion of the circuit board. The grounding terminal of the antenna system is electrically connected to the first grounding portion of the circuit board. An end of the conductive extension portion is electrically connected to the upper casing, the other end of the conductive extension portion is extended into the wearable body.

Abstract: A wireless communication device is provided. The wireless communication device comprises a circuit board and a loop antenna. The circuit board includes a wireless communication circuit. The wireless communication circuit includes a signal transmitting end and a ground terminal. The loop antenna includes a conductive loop, a feed portion, a first short-circuit portion and a second short-circuit portion. The feed portion is connected between the conductive loop and the signal transmitting end. The first short-circuit portion and the second short-circuit portion are connected between the conductive loop and the ground terminal, respectively.

Abstract: A power-up sequence protection circuit includes a first transistor, a second transistor, a third transistor, and a fourth transistor. First terminals of the first transistor, the second transistor, and the fourth transistor are coupled for receiving a program voltage. A control terminal of the third transistor is used for receiving a device voltage. A second terminal of the fourth transistor is used for outputting the program voltage when the fourth transistor is turned on. When the program voltage is unexpectedly powered up while the device voltage is not powered up, the first transistor is turned on, the second transistor is turned off, and the fourth transistor is turned off so as to block the program voltage outputted from the second terminal of the fourth transistor.

Abstract: An antenna is provided. The antenna includes: an antenna ground plane; a radiating unit parallel to the antenna ground plane, the radiating unit including: a common unit; a first branch extended from the common unit along a first direction; a second branch extended from the common unit along a second direction, wherein the first direction and the second direction are inverse; a third branch separated from the first branch and the second branch and extending outwardly from the common unit; a shorting unit located between a plane of radiating unit located and a plane of the antenna ground plane and connected to the common unit and the antenna ground plane; and a feeding unit located between a plane of the radiating unit and a plane of the antenna ground plane, wherein the feeding unit is separated from the shorting unit and connected to the third branch, and the shorting unit and the feeding unit are located on the same side.

Abstract: A method for making a support structure for a probing device includes a step of providing a substrate having first internal conductive lines, a carrier having second internal conductive lines and a thickness less than 2 mm for packaging an integrated circuit chip, solder balls, and photoresist support blocks made by lithography in a way that the solder balls and the photoresist support blocks are disposed between the substrate and the carrier, the photoresist support blocks separately arranged from each other, and at least one of the photoresist support blocks is disposed between two adjacent solder balls. The method further includes a step of electrically connecting the first internal conductive lines with the second internal conductive lines respectively by soldering the carrier and the substrate with the solder balls by reflow soldering.

Abstract: A method of manufacturing a space transformer includes providing a carrier substrate made for a chip package, forming an insulated layer disposed on the carrier substrate, and forming a conductive block. The carrier substrate is formed with elongated first and second wires. The first wire has an elongated contact which is longer than the width of the first wire. The insulated layer is formed with a hole corresponding in position to the elongated contact. The conductive block is formed with an elongated connecting column located in the hole and connected with the elongated contact, and a cylindrical contact pad exposed at the outside of the insulated layer, larger-sized than the elongated connecting column is connected with the elongated connecting column. As a result, the cylindrical contact pad has sufficient area and structural strength for contact with a probe needle.

Abstract: A positioner and a probe head of a probe card are provided. The positioner has a main opening, a first sub-opening, a second sub-opening, a third sub-opening, a fourth sub-opening, a first positioning portion, a second positioning portion, a first elastic portion and a second elastic portion. The first sub-opening, the second sub-opening, the third sub-opening, and the fourth sub-opening are sequentially arranged at the periphery of the main opening and are communicated to the main opening. A stiffness of the first positioning portion and a stiffness of the second positioning portion are higher than a stiffness of the first elastic portion and a stiffness of the second elastic portion.

Abstract: A monitoring system may include a display module, an input module, and a processing module. The display module may be operable to display a plurality of sub-windows. The input module may be operable to receive an input signal inputted by a user and generate a control signal according to the input signal. The processing module may be operable to receive the control signal to control any one of the sub-windows of the display module according to the control signal. When the coverage of any one of the sub-windows is modified by the user, the processing module will execute a first recursive function to detect whether the modified sub-window overlaps any one of the other sub-windows; if the modified sub-window overlaps any one of the other sub-windows, the processing module pushes the sub-window overlapping the modified sub-window to a residual space of the display module.

Abstract: The present invention relates to a phosphorus-containing polyphenylene oxide resin, its preparation method, a method for preparing the prepolymer of the phosphorus-containing polyphenylene oxide, a resin composition and an article thereof, wherein the phosphorus-containing polyphenylene oxide resin has a chemical structure represented by the following formula (I): wherein R? is R? is R?? is hydrogen, Through the use of the above phosphorus-containing polyphenylene oxide resin, an article made from the resin composition can has good flame retardance, good thermal resistance and a lower percent of thermal expansion while dielectric properties can be maintained, such that the present invention is suitable for use in products such as copper clad laminate and printed circuit board.

Abstract: An electronic coin system comprising at least one processor that, receives, by the at least one processor, input from a sender device, creates, by the at least one processor, a digital coin check accessible by at least one receiver device responsive to the input from the sender device, stores, in a digital coin payment file in at least one memory, the digital coin check as metadata, wherein the at least one processor and the at least one memory are communicably coupled, notifies, by the at least one processor, the at least one receiver device of the created digital coin check, tracks, by the at least one processor, activity of the digital coin check and allows access, by the at least one processor, to the digital coin check by the at least one receiver device.

Abstract: An apparatus for probing die electricity includes a substrate, a converting plate, a needle module and a reinforcement structure. The converting plate includes two opposite surfaces respectively having a plurality of first and second conductive elements. The needle module has a plurality of needles respectively and electrically connected to the plurality second conductive elements. The reinforcement structure is made from a polymer gel and disposed between the converting plate and the substrate.

Abstract: A melt gap measuring apparatus is adapted to measure the gap between the bottom of the heat insulating cover and the surface of the raw material melt inside a crucible. The melt gap measuring apparatus includes a first light-guiding probe having a first upper side and a first bottom side which are opposite to each other. The first upper side is exposed to an inner wall of the heat insulating cover, and the first bottom side protrudes from the bottom side of the heat insulating cover. An image capturing device is disposed above the heat insulating cover to capture the image of the first upper side. Moreover, a crystal growth apparatus and a method of measuring the melt gap are also provided.

Abstract: An alignment adjusting mechanism for a probe card includes a frame, a substrate and positioning screws. The frame has an opening, an inner periphery wall surrounding around the opening, and an outer periphery wall corresponding to the inner periphery wall. The substrate is disposed in the opening and supported by a support flange extending from the inner periphery wall toward a center of the opening. The frame is provided with a plurality of positioning threaded holes each extending from the outer periphery wall to the inner periphery wall in communication with the opening. Each positioning screw is threaded into one of the positioning threaded holes and has an end stopped at a lateral side of the substrate. By turning the positioning screws, the planimetric position of the substrate on an imaginary plane is adjustable.

Abstract: An assembling method for a vertical probe device includes steps of disposing a lower die on a jig by inserting supporting columns through jig holes of the lower die, fastening a positioning film on the supporting columns, installing probe needles and an upper die in a way that the positioning film is located between the upper and lower dies without contacting the upper die, unfastening the positioning film, and removing the jig so that the upper and lower dies, positioning film and probe needles constitute the device. A maintaining method for the device includes steps of inserting the supporting columns through the jig holes, fastening the positioning film to the jig, and removing the upper die. The probe needles and upper die are easily removed and installed and the probe needles are reliable. The vertical probe device is applicable for accommodating electronic components on the top thereof.

Abstract: A position adjustable probing device adapted for being mounted to a circuit board includes a frame, a probe head, a space transformer module and an elevation adjusting structure. The frame has a first surface, a second surface opposite to the first surface, and a first opening penetrating through the first and second surfaces. The probe head is coupled to the frame. The space transformer module is disposed in the first opening. The elevation adjusting structure is provided at the frame and has a plurality of spacers for adjusting a position of the frame relative to a reference surface in a vertical direction.

Abstract: The halogen-free resin composition comprises (A) 100 parts by weight of cyanate ester resin; (B) 5 to 50 parts by weight of styrene-maleic anhydride; (C) 5 to 100 parts by weight of polyphenylene oxide resin; (D) 5 to 100 parts by weight of maleimide; (E) 10 to 150 parts by weight of phosphazene; and (F) 10 to 1000 parts by weight of inorganic filler. By using specific components at specific proportions, the halogen-free resin composition of the invention offers the features of low dielectric constant, low dissipation factor, high heat resistance and high flame retardancy, and can be made into prepreg or resin film, and thereby used in copper clad laminate or printed circuit board.

Abstract: A resin composition includes (A) an epoxy resin; (B) a benzoxazine (BZ) resin; (C) a styrene maleic anhydride (SMA) copolymer; and (D) a polyester. The resin composition includes specific ingredients of a polyester and is characterized by specific proportions thereof so as to achieve a low delta Tg value of copper clad laminates manufactured in accordance with the resin composition and attain a low dielectric constant, a low dielectric dissipation factor, high heat resistance, and high fire retardation of the copper clad laminates and printed circuit boards manufactured in accordance with the resin composition.

Abstract: The probe card includes a substrate, at least two IC boards, and a plurality of probe pads. The IC boards are located on the substrate, and a predetermined distance is formed between the IC boards. Each of the IC boards has a plurality of lead connection points. The probe pads are plated on the IC boards, and are respectively connected to the lead connection points to cover the lead connection points. A probe area is surrounded by the probe pads on each of the IC boards. The probe pads are used to abut against plural probes.

Abstract: A display panel driving device is provided. The display panel driving device includes a host and a driving chip. The driving chip includes a store unit, a driving module and a transmitting interface unit. The host controls the transmitting interface unit to switch sources of image data received by the driving module according to content of the image data, so as to determine whether the driving module receives the image data from the store unit or not.

Abstract: The halogen-free resin composition comprises (A) 100 parts by weight of cyanate ester resin; (B) 5 to 50 parts by weight of styrene-maleic anhydride; (C) 5 to 100 parts by weight of polyphenylene oxide resin; (D) 10 to 150 parts by weight of phosphazene; and (E) 10 to 1000 parts by weight of inorganic filler. By using specific components at specific proportions, the halogen-free resin composition offers the features of low dielectric constant, low dissipation factor, high heat resistance and high flame retardancy, and can be made into prepreg or resin film, and thereby used in copper clad laminate or printed circuit board.