Abstract: A halogen-free resin composition includes 100 parts by weight of epoxy resin; 10 to 100 parts by weight of benzoxazine resin; 10 to 100 parts by weight of styrene-maleic anhydride copolymer; and 10 to 90 parts by weight of dicyclopentadiene phenol novolac resin. The halogen-free resin composition features specific ingredients and proportions thereof to attain low dielectric constant (Dk), low dielectric dissipation factor, high heat resistance and high non-flammability and produce prepregs or resin film, and is thus applicable to copper clad laminates and printed circuit boards.

Abstract: An exemplary embodiment of the present disclosure provides a dual-feed dual-polarization high directivity array antenna system. The dual-feed dual-polarization high directivity array antenna system comprises a substrate, a first array radiating group, a second array radiating group, a third array radiating group, a first feed network, and a second feed network. The first feed network is electrically connected to the first and second array radiating groups for inputting a first signal to the first and second array radiating groups. The second feed network is electrically connected to the second and third array radiating groups for inputting a second signal to the second and third array radiating groups. The feed directions of the first and second feed networks are perpendicular to each other. Accordingly, the array antenna system can provide orthogonal feed signals. The array antenna system also has the advantages of high isolation, dual polarization and high gain.

Abstract: An apparatus for probing die electricity includes a substrate, a converting plate, a needle module and a reinforcement structure. The converting plate includes two opposite surfaces respectively having a plurality of first and second conductive elements. The needle module has a plurality of needles respectively and electrically connected to the plurality second conductive elements. The reinforcement structure is made from a polymer gel and disposed between the converting plate and the substrate.

Abstract: A positioner and a probe head of a probe card are provided. The positioner has a main opening, a first sub-opening, a second sub-opening, a third sub-opening, a fourth sub-opening, a first positioning portion, a second positioning portion, a first elastic portion and a second elastic portion. The first sub-opening, the second sub-opening, the third sub-opening, and the fourth sub-opening are sequentially arranged at the periphery of the main opening and are communicated to the main opening. A stiffness of the first positioning portion and a stiffness of the second positioning portion are higher than a stiffness of the first elastic portion and a stiffness of the second elastic portion.

Abstract: A method of forming an apparatus for probing die electricity, which determines a reinforcement structure according to features of a converting plate, and combines the converting plate, reinforcement structure and a substrate for forming the apparatus for probing die electricity. In an embodiment, the apparatus for probing die electricity further comprises a substrate, a converting plate, a needle module and a reinforcement structure. The converting plate comprises two opposite surfaces respectively having a plurality of first and second conductive elements. The needle module comprises a plurality of needles respectively and electrically connected to the plurality second conductive elements. The reinforcement structure is disposed between the converting plate and the substrate.

Abstract: A vertical probe device includes a lower die having engaging holes and needle holes, a positioning film having limiting holes and needle holes, probe needles inserted through the needle holes, and supporters having at least an upper stopping surface and at least a lower stopping surface for moveably limiting the positioning film therebetween. Each supporter has a head, a neck passing through the limiting hole and having a length longer than the thickness of the positioning film, a body, and a tail inserted into the engaging hole, which are connected in order, and at least one of the upper and lower stopping surfaces. The supporters can prevent the positioning film from being lifted and flipped over and enables the positioning film to move so that the probe needles are reliable.

Abstract: An assembling method for a vertical probe device includes steps of disposing a lower die on a jig by inserting supporting columns through jig holes of the lower die, fastening a positioning film on the supporting columns, installing probe needles and an upper die in a way that the positioning film is located between the upper and lower dies without contacting the upper die, unfastening the positioning film, and removing the jig so that the upper and lower dies, positioning film and probe needles constitute the device. A maintaining method for the device includes steps of inserting the supporting columns through the jig holes, fastening the positioning film to the jig, and removing the upper die. The probe needles and upper die are easily removed and installed and the probe needles are reliable. The vertical probe device is applicable for accommodating electronic components on the top thereof.

Abstract: A halogen-free resin composition includes (A) 100 parts by weight of naphthalene epoxy resin; (B) 10 to 100 parts by weight of styrene maleic anhydride copolymer; and (C) 30 to 70 parts by weight of DOPO-containing bisphenol F novolac resin. The halogen-free resin composition includes specific ingredients, and is characterized by specific proportions thereof, to thereby attain a low dielectric constant, a low dielectric dissipation factor, high heat resistance, and high flame retardation, and thus is suitable for producing a prepreg or a resin film to thereby be applicable to copper clad laminates and printed circuit boards.

Abstract: A method for making a support structure for a probing device includes a step of providing a substrate having first internal conductive lines, a carrier having second internal conductive lines and a thickness less than 2 mm for packaging an integrated circuit chip, solder balls, and photoresist support blocks made by lithography in a way that the solder balls and the photoresist support blocks are disposed between the substrate and the carrier, the photoresist support blocks separately arranged from each other, and at least one of the photoresist support blocks is disposed between two adjacent solder balls. The method further includes a step of electrically connecting the first internal conductive lines with the second internal conductive lines respectively by soldering the carrier and the substrate with the solder balls by reflow soldering.

Abstract: A display panel driving device and a driving method thereof are provided. The display panel driving device includes a host and a driving chip, in which the driving chip includes a store unit and a driving module. The host switches sources of image data received by the driving module according to content of the image data, so as to determine whether the driving module receives the image data from the store unit or not.

Abstract: A space transformer includes a carrier substrate made for a chip package, an insulated layer disposed on the carrier substrate, and a conductive block. The carrier substrate is provided with elongated first and second wires. The first wire has an elongated contact which is longer than the width of the first wire. The insulated layer has a hole corresponding in position to the elongated contact. The conductive block has an elongated connecting column located in the hole and connected with the elongated contact, and a cylindrical contact pad exposed at the outside of the insulated layer, larger-sized than the elongated connecting column and connected with the elongated connecting column. As a result, the cylindrical contact pad has sufficient area and structural strength for contact with a probe needle. The method for manufacturing the space transformer is also disclosed.

Abstract: A stand-alone multi-band antenna includes an antenna ground plate, a shielding metal wall, a first radiating unit, and a signal feed-in source. The first radiating unit connected to at least one side of the antenna ground plate and located above the antenna ground plate is an antenna structure generating the fringing-field. The first radiating unit provides a first operating band and a second operating band. The shielding metal wall is connected to a plurality of the adjacent sides of the antenna ground plate, and the height thereof is larger than or equal to that of the first radiating unit, therefore limiting the fringing-field of the first radiating unit within the stand-alone multi-band antenna. The signal feed-in source has a signal feed-in point and a ground point. The signal feed-in point is electrically connected to the first radiating unit, and the ground point is electrically connected to the shielding metal wall.

Abstract: An alignment adjusting mechanism for a probe card includes a frame, a substrate and positioning screws. The frame has an opening, an inner periphery wall surrounding around the opening, and an outer periphery wall corresponding to the inner periphery wall. The substrate is disposed in the opening and supported by a support flange extending from the inner periphery wall toward a center of the opening. The frame is provided with a plurality of positioning threaded holes each extending from the outer periphery wall to the inner periphery wall in communication with the opening. Each positioning screw is threaded into one of the positioning threaded holes and has an end stopped at a lateral side of the substrate. By turning the positioning screws, the planimetric position of the substrate on an imaginary plane is adjustable.

Abstract: A position adjustable probing device adapted for being mounted to a circuit board includes a frame, a probe head, a space transformer module and an elevation adjusting structure. The frame has a first surface, a second surface opposite to the first surface, and a first opening penetrating through the first and second surfaces. The probe head is coupled to the frame. The space transformer module is disposed in the first opening. The elevation adjusting structure is provided at the frame and has a plurality of spacers for adjusting a position of the frame relative to a reference surface in a vertical direction.

Abstract: A hybrid multi-antenna system includes a system circuit board, an antenna substrate, at least a dipole antenna, and at least a monopole-slot antenna. The system board has at least a system ground plate, and the system ground plate is served as a reflector of the hybrid multi-antenna system. The antenna substrate and the system ground plate have a first distance therebetween. The dipole antenna having a first signal feed-in source and the monopole-slot antenna having a second signal feed-in source respectively provide a first and second operating band, and they are on a surface of the antenna substrate. The monopole-slot antenna is located nearby the dipole antenna. The monopole-slot antenna and the dipole antenna have a second distance therebetween. The first and second signal feed-in sources are vertical to each other, and have the phase difference of 90°.

Abstract: An inspection system is provided, which applies a forward or reverse voltage on a light-emitting device and measures a current thereof respectively before and after temperature rise, and determines whether the device fails according to the fact whether a current difference before and after the temperature rise is larger than a failure current determination value. Alternatively, the inspection system adopts a current applying device to apply a forward and reverse current on a light-emitting device and measures a voltage difference thereof respectively before and after temperature rise, and determines whether the device fails according to the fact whether a difference of the voltage differences before and after the temperature rise is larger than a failure voltage determination value. Alternatively, the inspection system adopts a predetermined inspecting step and a rapid inspecting step respectively to determine whether a light-emitting device fails.

Abstract: A resin composition includes (A) an epoxy resin; (B) a benzoxazine (BZ) resin; (C) a styrene maleic anhydride (SMA) copolymer; and (D) a polyester. The resin composition includes specific ingredients of a polyester and is characterized by specific proportions thereof so as to achieve a low delta Tg value of copper clad laminates manufactured in accordance with the resin composition and attain a low dielectric constant, a low dielectric dissipation factor, high heat resistance, and high fire retardation of the copper clad laminates and printed circuit boards manufactured in accordance with the resin composition.

Abstract: A probe card for being abutted against a plurality of probes is provided. The probe card includes a substrate, at least two IC boards, and a plurality of probe pads. The IC boards are located on the substrate, and a predetermined distance is formed between the IC boards. Each of the IC boards has a plurality of lead connection points. The probe pads are plated on the IC boards, and are respectively connected to the lead connection points to cover the lead connection points. A probe area is surrounded by the probe pads on each of the IC boards. The probe pads are used to abut against the probes. In addition, a method of manufacturing the probe card is provided.

Abstract: A mobile communication device has a ground plane and an antenna. The antenna is disposed on a dielectric substrate and includes a radiating metal portion, a coupling metal portion, and a shorting metal portion. One edge of the radiating metal portion faces the ground plane and has a distance between the edge and the ground plane. The coupling metal portion is electrically connected to a source via a connecting metal strip. One end of the shorting metal portion is electrically connected to the radiating metal portion, and the other end of the shorting metal portion is electrically connected to the ground plane.

Abstract: A halogen-free resin composition includes 100 parts by weight of epoxy resin; 10 to 100 parts by weight of benzoxazine resin; 10 to 100 parts by weight of styrene-maleic anhydride copolymer; and 10 to 90 parts by weight of dicyclopentadiene phenol novolac resin. The halogen-free resin composition features specific ingredients and proportions thereof to attain low dielectric constant (Dk), low dielectric dissipation factor, high heat resistance and high non-flammability and produce prepregs or resin film, and is thus applicable to copper clad laminates and printed circuit boards.