Patents by Inventor An Wen Wang

An Wen Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200103367
    Abstract: A liquid-sensing apparatus includes a substrate, partitions, and independent sensors. The partitions are disposed on the substrate for separating several housing spaces in order to respectively house a to-be-detected liquid, wherein each of the housing spaces has a bottom, a closed sidewall, and an open top, and thus the to-be-detected liquid may be dripped from the top of the housing space. The independent sensors are respectively formed at the bottom of different housing spaces, wherein the independent sensors respectively include different sensing material layers, and surfaces of the different sensing material layers have nanoholes.
    Type: Application
    Filed: November 21, 2018
    Publication date: April 2, 2020
    Applicant: Industrial Technology Research Institute
    Inventors: Jui-Chin Chen, Wen Wang, Pei-Jer Tzeng
  • Publication number: 20200098740
    Abstract: An ESD protection circuit, which protects a subject NMOS transistor coupled between an I/O pad and a ground, includes a first discharge device arranged between the I/O pad and the ground, having a trigger-on voltage that is lower than a breakdown voltage of the subject NMOS transistor; and a gate voltage control device, including a discharge NMOS transistor coupled to the ground and a gate of the subject NMOS transistor; a first PMOS transistor connected to the gate of the subject NMOS transistor and a connection node; and a first NMOS transistor connected to the connection node and the ground. The connection node is connected to the gate of the discharge NMOS transistor, and the gate of the first PMOS transistor and the gate of the first NMOS transistor are connected to each other.
    Type: Application
    Filed: September 20, 2018
    Publication date: March 26, 2020
    Applicant: Vanguard International Semiconductor Corporation
    Inventors: Shao-Chang HUANG, Li-Fan CHEN, Chih-Hsuan LIN, Yu-Kai WANG, Hung-Wei CHEN, Ching-Wen WANG, Ting-You LIN, Chun-Chih CHEN
  • Patent number: 10598374
    Abstract: A method of inducing swirl in pressurized air flowing through an air passageway of a fuel nozzle of a gas turbine engine includes inducing swirl in the pressurized air at an exit of the air passageway, by directing the pressurised air through helicoidal grooves formed at a downstream end of the air passageway. The swirling pressurized air exiting the air passageway is then directed into a mixing zone at a downstream end of the fuel nozzle.
    Type: Grant
    Filed: August 3, 2017
    Date of Patent: March 24, 2020
    Assignee: PRATT & WHITNEY CANADA CORP.
    Inventors: Yen-Wen Wang, Nigel Davenport
  • Publication number: 20200089098
    Abstract: A method for forming a photomask includes receiving a mask substrate including a protecting layer and a shielding layer formed thereon, removing portions of the shielding layer to form a patterned shielding layer, and providing a BSE detector to monitor the removing of the portions of the shielding layer. When a difference in BSE intensities obtained from the BSE detector is greater than approximately 30%, the removing of the portions of the shielding layer is stopped. The BSE intensity in following etching loops becomes stable.
    Type: Application
    Filed: September 18, 2018
    Publication date: March 19, 2020
    Inventors: HSUAN-WEN WANG, HAO-MING CHANG
  • Publication number: 20200085931
    Abstract: Cancer-testis antigens were simultaneously packaged with CpG adjuvant and incorporated into an E2 nanoparticle platform to increase cancer vaccine efficacy. Also described herein is a combination of checkpoint blockade therapy and the nanoparticle vaccine platform to deliver cancer antigens with adjuvant for treatment of tumors and prevention of future tumors. The nanoparticle vaccine platform includes a protein capsule to which are attached adjuvants in the internal hollow cavity and cancer epitopes to the surface. Whereas single-therapies only increase survival, the combined therapy can both increase survival time as well as prevent tumor development in pre-existing tumor conditions by increasing tumor antigen-specific responses (via the nanoparticle vaccines) while simultaneously blocking checkpoints to remove immune suppression (via immune checkpoint inhibition). Furthermore, tumor re-challenge studies show evidence of T cell memory which can prevent tumor development in some individuals.
    Type: Application
    Filed: September 13, 2019
    Publication date: March 19, 2020
    Inventors: Szu-Wen Wang, Nicholas Molino, Medea Neek, Edward L. Nelson, Jo Anne Tucker
  • Publication number: 20200086268
    Abstract: A gas purifying apparatus is used to receive chemical liquid mixing with a gas, and used to clean the gas. The gas purifying apparatus includes a plurality of liquid status detection sensors, a plurality of gas status detection sensors, a plurality of pumping motors, a gas driving motor and a controller. The liquid status detection sensors are disposed in a chemical liquid transmission path, and detect a plurality of liquid status information of the chemical liquid. The gas status detection sensors are disposed in a gas transmission path, and detect a plurality of gas status information of the gas. The controller performs an operation on the liquid status information and the gas status information to adjust a first setting value and a second setting value. The first setting value and the second setting value are respectively used to drive the pumping motors and the gas driving motor.
    Type: Application
    Filed: April 12, 2019
    Publication date: March 19, 2020
    Inventors: Chih-Hui Su, Tien-Hua Li, Chih-Hsiung Chang, Sheng-Wen Wang, Ming-Chin Tsai
  • Patent number: 10593815
    Abstract: A device and method for fabricating a photovoltaic device includes forming a double layer transparent conductive oxide on a transparent substrate. The double layer transparent conductive oxide includes forming a doped electrode layer on the substrate, and forming a buffer layer on the doped electrode layer. The buffer layer includes an undoped or p-type doped intrinsic form of a same material as the doped electrode layer. A light-absorbing semiconductor structure includes a p-type semiconductor layer on the buffer layer, an intrinsic layer and an n-type semiconductor layer.
    Type: Grant
    Filed: February 12, 2018
    Date of Patent: March 17, 2020
    Assignees: INTERNATIONAL BUSINESS MACHINES CORPORATION, BAY ZU PRECISION CO., LTD
    Inventors: Shun-Ming Chen, Chien-Chih Huang, Joel P. Desouza, Augustin J. Hong, Jeehwan Kim, Chien-Yeh Ku, Devendra K. Sadana, Chuan-Wen Wang
  • Publication number: 20200071485
    Abstract: This invention relates to the field of plastic waste decomposition. More specifically, the invention comprises products obtained from the decomposition of plastic waste.
    Type: Application
    Filed: November 8, 2019
    Publication date: March 5, 2020
    Inventors: Jia Yun YAO, Yu Wen WANG, Tapaswy MUPPANENI, Ruja SHRESTHA, Jennifer LE ROY, Garret D. FIGULY
  • Patent number: 10580788
    Abstract: Embodiments of methods for forming three-dimensional (3D) memory devices are disclosed. In an example, a peripheral device is formed on a first substrate. A first interconnect layer is formed above the peripheral device on the first substrate. A dielectric stack including a plurality of dielectric/sacrificial layer pairs and a plurality of memory strings each extending vertically through the dielectric stack is formed on a second substrate. A second interconnect layer is formed above the memory strings on the second substrate. The first substrate and the second substrate are bonded, so that the first interconnect layer is below and in contact with the second interconnect layer. The second substrate is thinned after the bonding. A memory stack is formed below the thinned second substrate and including a plurality of conductor/dielectric layer pairs by replacing, with a plurality of conductor layers, sacrificial layers in the dielectric/sacrificial layer pairs.
    Type: Grant
    Filed: September 21, 2018
    Date of Patent: March 3, 2020
    Assignee: Yangtze Memory Technologies, Co., Ltd.
    Inventors: Jifeng Zhu, Jun Chen, Zhenyu Lu, Qian Tao, Si Ping Hu, Jia Wen Wang, Yang Fu
  • Patent number: 10570947
    Abstract: A flipper screw includes a lower cover with a screw and a lower cover with nut, and it is used for fixing the web by replacing the anti-slip screw. The upper cover and the lower cover are provided with plural snap portion, which can be snapped in the rib around the screw hole, so as to avoid the web accidentally being released from the flipper.
    Type: Grant
    Filed: November 15, 2018
    Date of Patent: February 25, 2020
    Inventor: Ching-Wen Wang
  • Publication number: 20200058514
    Abstract: A method comprises following steps. A first mandrel is formed over a target layer over a substrate, wherein the first mandrel comprises a mandrel island and a first mandrel strip, the mandrel island comprises a first sidewall and a second sidewall perpendicular to the first sidewall, and the first mandrel strip extends from the first sidewall of the mandrel island. A first spacer is formed along the first and second sidewalls of the mandrel island and a sidewall of the first mandrel strip. The first mandrel is removed from the target layer. The target layer is patterned when the first spacer remains over the target layer.
    Type: Application
    Filed: January 4, 2019
    Publication date: February 20, 2020
    Inventors: Yu-Wen Wang, Kuo-Chyuan Tzeng
  • Publication number: 20200054574
    Abstract: For applications in drug delivery, “smart” materials have been designed to respond to conditions within microenvironments of tissues or cells. The present invention features stimuli-responsive cross-linked hydrogels that respond to specific metabolites of disease. For example, protein-polymer materials of the present invention are configured to release their drug cargo upon encountering the higher lactate concentrations within tumor microenvironments.
    Type: Application
    Filed: July 23, 2019
    Publication date: February 20, 2020
    Inventors: Szu-Wen Wang, Tae Il Kim, Kenneth J. Shea, Krista Fruehauf, Edward L. Nelson
  • Patent number: 10557011
    Abstract: This invention relates to the field of contaminated plastic waste decomposition. More specifically, the invention comprises methods and systems to decompose contaminated plastic waste and transform it into value-added products.
    Type: Grant
    Filed: May 24, 2019
    Date of Patent: February 11, 2020
    Assignee: BioCellection Inc.
    Inventors: Jia Yun Yao, Yu Wen Wang, Tapaswy Muppaneni, Ruja Shrestha, Jennifer Le Roy, Garret D. Figuly
  • Patent number: 10554156
    Abstract: A motor driving circuit, an application device, and a motor braking method are provided. The driving circuit includes an inverter, a braking unit, and a MCU. The inverter is configured to drive a motor. The braking unit includes a sampling circuit, a discharge circuit, and a switch group. The MCU is connected to the sampling circuit, the discharge circuit, and the switch group, and is configured to control the sampling circuit to detect a voltage across the inverter and obtain a detected value when receiving the emergency signal, compare the detected value to a preset voltage or a preset voltage range, and transmit a control signal to activate the discharge circuit when the detected value is greater than the preset voltage or exceeds the preset voltage range.
    Type: Grant
    Filed: August 31, 2017
    Date of Patent: February 4, 2020
    Assignee: JOHNSON ELECTRIC INTERNATIONAL AG
    Inventors: You Qing Xiang, Shi Wen Wang, Wu Feng Qiu, Ying Chao Li, Yun Chen, Lian Zhong Zhang, Jun Zhang
  • Publication number: 20200032932
    Abstract: A flexible liquid level sensing device includes a sensing module having a circuit board and a plurality of sensing elements. The coupled assembly includes a plurality of joining pipes connected in series. Each joining pipe includes a sleeve portion and a rotary head. The rotary head of one joining pipe is inserted into and rotatably coupled to the sleeve portion of an adjacent joining pipe. The coupled assembly forms an accommodating space for receiving the sensing module.
    Type: Application
    Filed: July 27, 2018
    Publication date: January 30, 2020
    Inventors: Chih-Wen WANG, Ting-Kuo WU, Wen-Bo ZHENG
  • Publication number: 20200034521
    Abstract: A system is described for authenticating a user on a client device using the user's mobile device and utilizing the audio channel. An authentication server receives a request from the client to initiate a session for the user, creates the session, and sends a session token back to the client along with a request for authentication. The client broadcasts an audio transmission containing the token to the mobile device over an audio channel using data-over-sound transmission. The mobile device receives the transmission via a microphone, obtains the token and the server identity from the transmission, and sends user credentials that are stored on the mobile device along with the token identifying the session directly to the authentication server. The server verifies the received credentials, confirms the token, and logs the user into the session.
    Type: Application
    Filed: July 24, 2018
    Publication date: January 30, 2020
    Inventors: Shengbo Teng, Wen Wang, Bin Guo, Wenping Fan, Tony Lu, Daniel James Beveridge
  • Publication number: 20200027892
    Abstract: Embodiments of methods for forming three-dimensional (3D) memory devices are disclosed. In an example, a peripheral device is formed on a first substrate. A first interconnect layer is formed above the peripheral device on the first substrate. A dielectric stack including a plurality of dielectric/sacrificial layer pairs and a plurality of memory strings each extending vertically through the dielectric stack is formed on a second substrate. A second interconnect layer is formed above the memory strings on the second substrate. The first substrate and the second substrate are bonded, so that the first interconnect layer is below and in contact with the second interconnect layer. The second substrate is thinned after the bonding. A memory stack is formed below the thinned second substrate and including a plurality of conductor/dielectric layer pairs by replacing, with a plurality of conductor layers, sacrificial layers in the dielectric/sacrificial layer pairs.
    Type: Application
    Filed: September 21, 2018
    Publication date: January 23, 2020
    Inventors: Jifeng Zhu, Jun Chen, Zhenyu Lu, Qian Tao, Si Ping Hu, Jia Wen Wang, Yang Fu
  • Publication number: 20200020383
    Abstract: A semiconductor memory device includes: a local write bit (LWB) line; a local write bit_bar (LWB_bar) line; a global write bit (GWB) line; a global write bit_bar (GWBL_bar) line; a column of segments, each segment including bit cells; each of the bit cells including a latch circuit and first and second pass gates connecting the corresponding LWB and LWB_bar lines to the latch circuit; and a distributed write driving arrangement. The distributed write driving arrangement includes: a global write driver including a first inverter connected between the GWB line and the LWB line, and a second inverter connected between the GWB_bar line and the LWB_bar line; and a local write driver included at an interior of each segment, each local write driver including a third inverter connected between the GWB line and the LWB line; and a fourth inverter connected between the GWB_bar line and the LWB_bar line.
    Type: Application
    Filed: July 3, 2019
    Publication date: January 16, 2020
    Inventors: Hidehiro FUJIWARA, Hung-Jen LIAO, Li-Wen WANG, Jonathan Tsung-Yung CHANG, Yen-Huei CHEN
  • Patent number: D871392
    Type: Grant
    Filed: September 11, 2018
    Date of Patent: December 31, 2019
    Assignee: ASUSTeK COMPUTER INC.
    Inventors: Zuo-Wen Wang, Tong-Shen Hsiung, Ming-Chih Huang, Meng-Chu Huang, Sin-Fei Lai, Fu-Yu Tsai, Szu-Tang Chiu, Chih-Kuang Lin, Chen-Chun Shiang, Wai Tong Chan
  • Patent number: D876430
    Type: Grant
    Filed: April 19, 2018
    Date of Patent: February 25, 2020
    Assignee: COMPAL ELECTRONICS, INC.
    Inventors: Shu-Hung Lin, Wang-Hung Yeh, Hsin-Chieh Fang, Chun-Wen Wang