Abstract: A multiple field plate transistor includes an active region, with a source, drain, and gate. A first spacer layer is between the source and the gate and a second spacer layer between the drain and the gate. A first field plate on the first spacer layer and a second field plate on the second spacer layer are connected to the gate. A third field plate connected to the source is on a third spacer layer, which is on the gate and the first and second field plates and spacer layers. The transistor exhibits a blocking voltage of at least 600 Volts while supporting current of at least 2 or 3 Amps with on resistance of no more than 5.0 or 5.3 m?-cm2, respectively, and at least 900 Volts while supporting current of at least 2 or 3 Amps with on resistance of no more than 6.6 or 7.0 m?-cm2, respectively.

Abstract: A printed circuit board includes a motherboard and a daughterboard. The motherboard includes at least one first signal pad and defines at least one via under the at least one first signal pad. The daughterboard includes at least one second signal pad and defines at least one via under the at least one second signal pad. The at least one first signal pad and the at least one second signal pad are sucked into the respective vias on the motherboard and the daughterboard according to siphon principle to allow each of the first signal pads and the second signal pads to form uneven top surfaces, the uneven top surfaces of the at least one first signal pads and the at least one second signal pads are connected to each other for electronically connecting the daughterboard to the motherboard.

Abstract: A device for holding disk-shaped articles and a method thereof are provided. The device comprises a rotatable chuck body and at least two groups of clamping elements arranged at the edge of the chuck body. Each of the clamping elements is mounted to a pivot with the chuck body respectively by means of the rotation of the clamping element with respect to the chuck body. A radial compression spring is connected between the bottom of the clamping element and the chuck body to provide a clamping force for the clamping element. The clamping elements in the same group are provided with magnets with the same polarity, while the clamping elements in different groups are provided with magnets with the opposite polarity. Two sets of electromagnets are arranged on the chuck body and spaced apart evenly.

Abstract: A receiver and a receiving method for use in a LINC OFDM system are provided. The receiver receives a signal from a transmitter of the combinerless LINC OFDM system, generates a CP removed signal by removing a CP from the signal, generates a DFT signal by applying a DFT operation to the CP removed signal, generates a plurality of equalized symbols according to the DFT signal, generates a plurality of soft bits from the equalized symbols, generates a plurality of candidates regarding a transmitted bit sequence based on the soft bits by a list-Viterbi decoding algorithm, and decides an estimated transmitted bit sequence corresponding to the transmitted bit sequence from the candidates. The receiving method is able to perform the operations of the receiver.

Abstract: A semiconductor memory device includes a substrate having thereon a memory array region and a periphery circuit region. A first dielectric layer covers the memory array region and the periphery circuit region on the substrate. A second dielectric layer covers the memory array region and the periphery circuit region on the first dielectric layer. At least a capacitor structure is provided in the memory array region. The capacitor structure includes an electrode material layer embedded in the second dielectric layer. The semiconductor memory device further includes a contact structure comprising the electrode material layer.

Abstract: An electrical connector includes a metal body and an insulation body received in the metal body and having therein first terminals and second terminals. Each first and second terminal has a connecting segment extending outward and a bent formed on a distal end of the connecting segment.

Abstract: Embodiments of mechanisms for cleaning a surface of a semiconductor wafer for a hybrid bonding are provided. The method for cleaning a surface of a semiconductor wafer for a hybrid bonding includes providing a semiconductor wafer, and the semiconductor wafer has a conductive pad embedded in an insulating layer. The method also includes performing a plasma process to a surface of the semiconductor wafer, and metal oxide is formed on a surface of the conductive structure. The method further includes performing a cleaning process using a cleaning solution to perform a reduction reaction with the metal oxide, such that metal-hydrogen bonds are formed on the surface of the conductive structure. The method further includes transferring the semiconductor wafer to a bonding chamber under vacuum for hybrid bonding. Embodiments of mechanisms for a hybrid bonding and a integrated system are also provided.

Abstract: An electrically actuated device comprises an active region disposed between a first electrode and a second electrode, a substantially nonrandom distribution of dopant initiators at an interface between the active region and the first electrode, and a substantially nonrandom distribution of dopants in a portion of the active region adjacent to the interface.

Abstract: A converter power unit comprises: a heat sink; n power switch modules on the heat sink; a first group of laminated bus bars comprising a first and a second bus bar; a capacitor group comprising m capacitor; a second group of laminated bus bars comprising a third and a fourth bus bar, the first bus bar is connected with the third bus bar, the second bus bar is connected with the fourth bus bar; providing that vertical projection areas projected by an area occupied by the n power switch modules and projected by the capacitor group on a first plane perpendicular to an axial direction of the capacitor group are defined as a first and a second projection areas respectively, the first and the second projection area have an overlapped area. The present application can reduce the stray inductances in the commutating loop of the converter.

Abstract: A communication device and a power control method thereof are provided. The power control method, performed by a communication device, includes: determining a power range of a transmit power of an uplink signal; determining a gain switch range based on the power range; when the transmit power of the uplink signal is within the gain switch range, determining a first gain mode for amplifying the uplink signal; and when the transmit power of the uplink signal is out of the gain switch range, determining a second gain mode for amplifying the uplink signal.

Abstract: A method for localizing a needle to a nerve, the method comprising: using the needle to electrically stimulate the nerve, with a known current intensity, so as to evoke a nerve response; detecting the nerve response; analyzing the detected nerve response so as to identify at least one attribute of the same; and confirming that the needle is in the immediate proximity of the nerve based upon known current intensity and at least one identified attribute of the detected nerve response.

Abstract: Provided is a polishing slurry composition, including a non-ionic surfactant represented by the following formula (1) R—(OCH2CH2)x—OH??formula (1) wherein x is an integer from 1 to 50, and R is selected from a group consisting of a C3-C50 alkyl group, a C6-C55 benzylalkyl group and a C6-C55 phenylalkyl group.

Abstract: The present invention relates to a method for treating a block copolymer solution, wherein the method comprises: providing a solution comprising a block copolymer in a non aqueous solvent; and, treating the solution to remove metals using an ion exchange resin. The invention also relates to a method of forming patterns using the treated block copolymer.

Abstract: A method of forming of an image sensor device includes a substrate having a pixel region and a periphery region. A plurality of first trenches is etched in the periphery region. Each of the first trenches has a depth D1. A mask layer is formed over the substrate. The mask layer has a plurality of openings in the pixel region. A spacer is formed in an interior surface of each opening. A plurality of second trenches is etched through each opening having the spacer in the pixel region. Each of the second trenches has a depth D2. The depth D1 is larger than the depth D2.

Abstract: A standby battery box for an electric cylinder is electrically connected to a control box for driving the electric cylinder and includes a charge-discharge device and a rechargeable battery. The charge-discharge device includes a protection unit, a power conversion unit, a voltage detection unit, a control unit, a discharge unit, a display unit, and a switch unit. The rechargeable battery is electrically connected to the charge-discharge device. When a startup switch of the switch unit is pressed, the charge-discharge device delivers the electricity of the rechargeable battery into the control box. When a shutoff switch of the switch unit is pressed, the charge-discharge device does not supply power, thereby protecting the standby battery box from being exhausted.

Abstract: A method and apparatus for power-efficiency management in a virtualized cluster system. The virtualized cluster system includes a front-end physical host and at least one back-end physical host, and each of the at least one back-end physical host comprises at least one virtual machine and a virtual machine manager. Flow characteristics of the virtualized cluster system are detected at a regular time cycle, then a power-efficiency management policy is generated for each of the at least one back-end physical host based on the detected flow characteristics, and finally the power-efficiency management policies are performed. The method can detect the real-time flow characteristics of the virtualized cluster system and make the power-efficiency management policies thereupon to control the power consumption of the system and perform admission control on the whole flow, thereby realizing optimal power saving while meeting the quality of service requirements.

Abstract: The present invention discloses a tape substrate for chip on film structure of a liquid crystal panel. The tape substrate is provided with plural package units of chip on film structures arranged along its longitudinal direction, and the package unit has a driver chip, input leads and output leads. The longitudinal direction of the driver chip is parallel to the longitudinal direction of the tape substrate, and the input leads and the output leads are located at the two opposite sides of the driver chip. Each package unit is set up with a short side and a long side, and the input leads are formed at the short side, while the output leads are formed at the long side. In the package units adjacent to each other, the short side of one package unit joins the long side of a next package unit. This invention further discloses a liquid crystal panel having the tape substrate.

Abstract: Methods for making composite anodes, such as macroporous composite anodes, are disclosed. Embodiments of the methods may include forming a tape from a slurry including a substrate metal precursor, an anode active material, a pore-forming agent, a binder, and a solvent. A laminated structure may be prepared from the tape and sintered to produce a porous structure, such as a macroporous structure. The macroporous structure may be heated to reduce a substrate metal precursor and/or anode active material. Macroporous composite anodes formed by some embodiments of the disclosed methods comprise a porous metal and an anode active material, wherein the anode active material is both externally and internally incorporated throughout and on the surface of the macroporous structure.