Abstract: A method of overlay measurement of a semiconductor structure includes a number of operations. A semiconductor structure with a pre-layer and a current layer over the pre-layer is provided, wherein the pre-layer includes a first overlay mark with a first grating group and a second grating group, and the current layer includes a second overlay mark. A semiconductor process is performed on the semiconductor structure. A detection beam is irradiated to the first overlay mark. A first intensity distribution of the first grating group and a second intensity distribution of the second grating group with respect to the reference point of the first overlay mark are received.

Abstract: The present application relates to a resin composition or a use thereof. In the present application, it is possible to provide a resin composition or a cured body thereof that exhibits low adhesion force to a predetermined adherend while exhibiting high thermal conductivity. Also, in the present application, the low adhesion force can be achieved without using an adhesion force adjusting component such as a plasticizer or in a state where the use ratio thereof is minimized. The present application can also provide a product comprising the curable composition or the cured body thereof.

Abstract: The present disclosure provides a light-emitting device, and a display apparatus. The light-emitting device includes a luminescent layer including a first sublayer, a second sublayer and a third sublayer, and the second sublayer is disposed between the first sublayer and the third sublayer; the second sublayer includes host materials and guest materials; under the action of external energy, excitons are compounded in the second sublayer; the first sublayer and the third sublayer both include the host materials; a concentration of the excitons in the second sublayer is greater than a concentration of the excitons in the first sublayer, and the concentration of the excitons in the second sublayer is greater than a concentration of the excitons in the third sublayer.

Abstract: An antenna and an electronic device are provided. The antenna includes a first radiation layer and a first reference electrode layer within a housing, which includes: first and second cover plates opposite to each other, and a connection side plate therebetween; the first and second cover plates and the connection side plate are connected to form an accommodation space; the first radiation layer is on a side of the first cover plate close to the second cover plate; the first reference electrode layer is on a side of the second cover plate close to the first cover plate; the first radiation layer includes at least one radiation unit, each includes a radiation portion and at least one feed line electrically connected thereto; orthographic projections of the radiation portion and the feed line on the first cover plate at least partially overlaps with that of the first reference electrode layer.

Abstract: It discloses a compound shown in general formula (1) or a pharmaceutically acceptable salt thereof and a method for preparation of the compound; the compound is a xanthine oxidase inhibitor with xanthine oxidase inhibiting activity; the compound has an excellent xanthine oxidase inhibitory activity and has potential application value in anti-gout drugs, anti-hyperuricemia drugs, etc.

Abstract: The present disclosure provides a display panel, comprising a display region, a binding region, and a bending region located between the display region and the binding region. A maximum bending angle of the bending region is less than 180°. The bending region includes a bending start point close to the display region, a distance between the bending start point and an apex of the bending region is less than a bending radius of the bending region in a first direction, and the first direction is a direction from the display region to the bending region. The present disclosure further provides a display module and a display device.

Abstract: A battery cell includes a casing configured to accommodate an electrode assembly, and a pressure relief mechanism disposed on the casing. The pressure relief mechanism includes a pressure relief passage, and a first pressure relief element and a second pressure relief element that are disposed on the pressure relief passage and close the pressure relief passage separately. In a venting direction of the pressure relief passage, the second pressure relief element is disposed upstream of the first pressure relief element and communicated with an internal space of the casing. The second pressure relief element has a rigidity of greater than or equal to 25 N/mm.

Abstract: A slide rail mechanism includes a first slide rail assembly, a second slide rail assembly, a third slide rail assembly and a locking member. An opening movement of a second rail of the first slide rail assembly with respect to a first rail of the first slide rail assembly drives the locking member from a first predetermined position to a second predetermined position, and an opening movement of a second rail of the second slide rail assembly with respect to a first rail of the second slide rail assembly drives the locking member from the second predetermined position to a third predetermined position. The locking member at the third predetermined position blocks the third working member for preventing an opening movement of a second rail of the third slide rail assembly with respect to a first rail of the third slide rail assembly.

Abstract: A heat dissipation module is provided. The heat dissipation module includes a substrate, a heat dissipation unit, and an overflow prevention unit. The overflow prevention unit is disposed on a surface of the substrate. The overflow prevention unit is in a sheet shape and has a plurality of mesh holes.

Abstract: A method of forming a high-? dielectric cap layer on a semiconductor structure formed on a substrate includes depositing the high-? dielectric cap layer on the semiconductor structure, depositing a sacrificial silicon cap layer on the high-? dielectric cap layer, performing a post cap anneal process to harden and densify the as-deposited high-? dielectric cap layer, and removing the sacrificial silicon cap layer.

Abstract: A power converter integrated circuit may comprise a switch network comprising a plurality of switches; a first set of coupling nodes for coupling the switch network to a first flying capacitor; a second set of coupling nodes for coupling the switch network to a second flying capacitor; an output node for coupling the switch network to an output capacitor; and a third set of one or more coupling nodes for coupling the switch network to an inductor, wherein the power converter integrated circuit is operable in a first forward mode as a switched capacitor converter and in a second forward mode as an inductive converter, wherein in the first forward mode the switch network is operable to couple the first flying capacitor in series with the output capacitor in a first phase of operation, and to couple the first flying capacitor and the output capacitor in parallel in a second phase of operation; and in the second forward mode the switch network is operable to couple the first flying capacitor in series with the in

Abstract: A semiconductor structure and a method for forming the same are provided. The semiconductor structure includes a gate structure formed over a fin structure, and a gate spacer layer formed on a sidewall surface of the gate structure. The semiconductor structure includes a source/drain (S/D) epitaxial layer formed adjacent to the gate structure, and a dielectric spacer layer formed on the S/D epitaxial layer. The semiconductor structure includes a contact plug barrier formed over the S/D epitaxial layer, and a contact plug surrounding by the contact plug barrier, wherein the contact plug is separated from the gate spacer layer by the dielectric spacer layer and the contact plug barrier.

Abstract: The present invention relates to a refrigerant composition, including difluoromethane (HFC-32), pentafluoroethane (HFC-125), and trifluoroiodomethane (CF3I) for use in a heat exchange system, including air conditioning and refrigeration applications and in particular aspects to the use of such compositions as a replacement of the refrigerant R-410A for heating and cooling applications and to retrofitting heat exchange systems, including systems designed for use with R-410A.

Abstract: Provided in the present disclosure is a data read or write method, including: determining read or write data according to a data read or write request; when a cache miss occurs for the read or write data and a data memory provided in the cache does not have an idle storage address, traversing starting from an initial storage address of the data memory; when a storage address having an unread flag is found in the traversing, writing the read or write data to the storage address having the unread flag; and when the storage address having the unread flag is not found in the traversing, writing the read or write data to a previous storage address of the initial storage address. Further provided in the present disclosure are a data read or write apparatus and device, and a computer-readable storage medium, which all have the above beneficial effects.

Abstract: A large-span corridor structure composed of arc-shaped cantilever trusses and stay cable supporting structures is provided, comprising cantilever trusses with arc-shaped facades, orthogonal connecting trusses at a corridor, connecting trusses at cantilever portions, corridor truss structures, and stay cable supporting structures; the cantilever trusses with arc-shaped facades are composed of two sets of ultra-long cantilever trusses with arc-shaped facades and triquetrous planes which are supported by ground and symmetrical, and each are set of ultra-long cantilever trusses with arc-shaped facades and triquetrous planes are formed of several ultra-long cantilever trusses with arc-shaped facades and triquetrous planes arranged in parallel at a certain distance.

Abstract: The application provides a backlight module, a display screen, a rearview mirror and a vehicle, and relates to the field of display technology, and the backlight module may greatly reduce a risk of separation between a reflection unit and a light-guide plate.

Abstract: The various implementations described herein include methods and devices for identifying a language in audio content. In one aspect, a method includes obtaining audio content and generating a speaker embedding from the audio content. The method further includes determining, via a language identification model, a language of the audio content based on the speaker embedding.

Abstract: An anode active material for a lithium secondary battery includes a silicon-based active material that includes a core particle and a carbon coating formed over or on the core particle. The anode active material satisfies specific relation within a specific range. A lithium secondary battery includes an anode including the anode active material, and a cathode facing the anode.

Abstract: This application provides a conductive slurry, a current collector, a secondary battery, a battery module, a battery pack, and an electric apparatus. The conductive slurry in this application includes the following raw material components: an aqueous binder including an aqueous polymer having polycarboxyl functionality, a conductive agent, a dispersant, and a curing agent, where the curing agent is used for cross-linking reaction with the aqueous polymer having polycarboxyl functionality. The conductive slurry in embodiments of this application has relatively good conductivity and adhesion performance as well as relatively good water resistance, which can improve stability of the secondary battery during operation and prolong its cycle life.

Abstract: A display module, a method for manufacturing the same, and a display device. The display module includes: a first bonding region of a circuit board is provided with a first row of circuit board pads and a second row of circuit board pads, and each row of circuit board pads comprises multiple circuit board pads arranged at intervals in a first direction; a second bonding region of the display substrate is provided with a plurality of substrate pads arranged in the first direction, an orthographic projection of the display substrate onto the circuit board does not overlap the first bonding region, and the second bonding region is close to the first bonding region. The circuit board pads are bonded to the substrate pads via suspended wires. The second row of circuit board pads comprises first circuit board pads and second circuit board pads.