Abstract: A method for fabricating a three-dimensional memories is provided. A stack with multiple levels is formed, and each of the levels includes an isolation layer, a metal layer, and a semiconductor layer between the isolation layer and the metal layer. A first trench and a plurality of second trenches are formed along each parallel line in the stack of the levels. The isolation layers and the metal layers in the parallel lines are removed through the first trench and the second trenches, so as to expose the semiconductor layers in the parallel line. A plurality of memory cells are formed in the parallel lines of the levels. In each of the levels, each of the memory cells includes a transistor and a channel of the transistor is formed by the semiconductor layer in the parallel line.

Abstract: A surface light emitting element with high heat dissipation and uniform light emission includes a metal reflective layer, a first metal conductive layer, an omnidirectional reflecting current isolation layer, a first-type semiconductor current spreading layer, a light emitting diode layer, a second-type semiconductor current spreading layer and a second metal conductive layer. The metal reflective layer includes at least one surrounding wall structure. The omnidirectional reflecting current isolation layer is arranged on the metal reflective layer and entirely covers the two sides of the at least one surrounding wall structure to form at least one cylindrical channel. The light emitting diode layer is located in the at least one cylindrical channel.

Abstract: A physiological signal measuring method includes a training's thermal image providing step, a training step, a classification model generating step, a measurement's thermal image providing step, a mask-wearing classifying step, a block identifying step and a measurement result generating step. The measurement's thermal image providing step includes providing a measurement's thermal image, which is an infrared thermal video for measuring. The measurement result generating step includes generating a measurement result of at least one physiological parameter of the subject according to a plurality of signals of the forehead block, and the mask block or the nasal cavity block.

Abstract: A method of manufacturing a semiconductor device includes forming a photoresist layer over a substrate, exposing the photoresist layer to an EUV radiation, and developing the exposed photoresist layer. The photoresist layer has a composition including a metal complex including a metallic core and at least one ligand bonded to the metallic core. The at least one ligand includes an alkenyl group, an alkynyl group, or a combination thereof.

Abstract: A composite mounting type electrical connector includes an insulating shell, a plurality of terminals and a plurality of shielding members. The plurality of terminals are arranged in two rows parallel to each other, and a plurality of shielding members are arranged between the two rows of terminals and separated from each other by a predetermined distance to form insulation. The two rows of terminals are soldered to a circuit board by surface mounting technology and dual in line package process respectively. The ground terminals in the two columns of terminals are commonly connected to a shield spacer to form a common ground structure. The power terminals in the two columns of terminals are commonly connected to another shielding member to form a parallel connecting structure. The shielding members produce a shielding effect between two rows of terminals, which can prevent crosstalk therebetween.

Abstract: Various embodiments of the present disclosure are directed towards an integrated chip. The integrated chip includes a first pixel region and a second pixel region within a substrate. A first recess region is disposed along a back-side of the substrate within the first pixel region. The back-side of the substrate within the first pixel region is asymmetric about a center of the first pixel region in a cross-sectional view. A second recess region is disposed along the back-side of the substrate and within the second pixel region. The back-side of the substrate within the second pixel region is asymmetric about a center of the second pixel region in the cross-sectional view. The first recess region and the second recess region are substantially symmetric about a vertical line laterally between the first pixel region and the second pixel region.

Abstract: A method of fabricating a semiconductor structure includes selective use of a cladding layer during the fabrication process to provide critical dimension uniformity. The cladding layer can be formed before forming a recess in an active channel structure or can be formed after filling a recess in an active channel structure with dielectric material. These techniques can be used in semiconductor structures such as gate-all-around (GAA) transistor structures implemented in an integrated circuit.

Abstract: Methods and devices configured to determine, for a slot including a plurality of symbols allocated for downlink data, a downlink data block allocation scheme with a number of blocks of downlink data that remain constant or monotonically decrease starting at a designated symbol of the plurality of symbols allocated for downlink data; generate a voltage profile corresponding to the downlink data block allocation scheme, where the voltage profile includes a plurality of bias voltages; and apply a bias voltage selected from the plurality of bias voltages to a power amplifier in a transmission chain of the base station.

Abstract: An over-current protection device includes first and second electrode layers and a PTC material layer laminated therebetween. The PTC material layer includes a polymer matrix, a conductive filler, and a titanium-containing dielectric filler. The polymer matrix has a fluoropolymer. The titanium-containing dielectric filler has a compound represented by a general formula of MTiO3, wherein the M represents transition metal or alkaline earth metal. The total volume of the PTC material layer is calculated as 100%, and the titanium-containing dielectric filler accounts to for 5-15% by volume of the PTC material layer.

Abstract: In an embodiment, an interposer has a first side, a first integrated circuit device attached to the first side of the interposer with a first set of conductive connectors, each of the first set of conductive connectors having a first height, a first die package attached to the first side of the interposer with a second set of conductive connectors, the second set of conductive connectors including a first conductive connector and a second conductive connector, the first conductive connector having a second height, the second conductive connector having a third height, the third height being different than the second height, a first dummy conductive connector being between the first side of the interposer and the first die package, an underfill disposed beneath the first integrated circuit device and the first die package, and an encapsulant disposed around the first integrated circuit device and the first die package.

Abstract: A magnetic tunnel junction device includes a pillar structure including, from bottom to top, a bottom electrode and a magnetic tunnel junction structure, a top electrode overlying the magnetic tunnel junction structure, and a dielectric metal oxide layer extending from a sidewall of the pillar structure to a sidewall of the top electrode. The magnetic tunnel junction structure contains a reference magnetization layer including a first ferromagnetic material, a tunnel barrier layer, and a free magnetization layer including a second ferromagnetic material. The top electrode includes a metallic material containing a nonmagnetic metal element. The dielectric metal oxide layer may be formed by performing an oxidation process that oxidizes a residual metal film after a focused ion beam etch process, and eliminates conductive paths from surfaces of the pillar structure.

Abstract: The disclosure provides a time-lapse photographic device. The time-lapse photographic device includes a camera module, a drive module, an environment detection module, and a control unit. The drive module is connected to the camera module to drive the camera module to rotate. The environment detection module is configured to detect an external environment of the time-lapse photographic device to generate an environment detection signal. The control unit is electrically connected to the camera module, the drive module, and the environment detection module. The control unit generates, according to a shooting stop parameter, a plurality of intermittent drive signals to control the drive module, and controls the camera module to shoot at intervals of the drive signals. The control unit adjusts operation of at least one of the camera module and the drive module according to the environment detection signal.

Abstract: A projection apparatus including a projection device, a reflecting component, and an image capturing device is provided. The projection device is adapted to project an image light beam to form a projection image. The reflecting component is disposed on the projection device and has a reflecting surface. The image capturing device is disposed on the projection device and has an image capturing end. The image capturing end faces the reflecting surface. The reflecting surface is adapted to reflect the projection image to the image capturing end.

Abstract: A management circuit is coupled to multiple processor cores for performing current suppression. The management circuit includes a detection circuit and a throttle signal generator. The detection circuit is operative to receive an activity signal from each processor core, and estimate a total current consumed by the plurality of processor cores based on activity signals. The activity signal indicates a current index proportional to current consumption of the processor core in a given time period. The throttle signal generator is operative to assert or de-assert throttle signals to the processor cores, one processor core at a time, based on one or more metrics calculated from the total current.

Abstract: Memory devices and methods of forming the memory devices are disclosed herein. The memory devices include a resistive memory array including a first resistive memory cell, a staircase contact structure adjacent the resistive memory array, and an inter-metal dielectric layer over the staircase contact structure. The memory devices further include a first diode and a second diode over the inter-metal dielectric layer. The memory devices further include a first conductive via electrically coupling the first diode to a first resistor of the first resistive memory cell and a second conductive via electrically coupling the second diode to a second resistor of the first resistive memory cell.

Abstract: A method of displaying a rear-view image and a mobile device using the method are provided. The method includes: receiving the rear-view image; displaying a virtual dashboard through a display; and displaying the rear-view image on a default area of the virtual dashboard in response to receiving a signal associated with a direction indicator light, wherein the default area corresponds to the direction indicator light.

Abstract: A package structure including a first die, a second die, an encapsulant, a dam structure, a light-transmitting sheet, a conductive connector, a circuit layer, and a conductive terminal is provided. The first die includes a first active surface. The first active surface has a sensing area. The second die is arranged such that a second back surface thereof faces the first die. The encapsulant covers the second die. The encapsulant has a first encapsulating surface and a second encapsulating surface. The dam structure is located on the first encapsulating surface and exposes the sensing area. The light-transmitting sheet is located on the dam structure. The conductive connector penetrates the encapsulant. The circuit layer is located on the second encapsulating surface. The first die is electrically connected to the second die through the conductive connector and the circuit layer. The conductive terminal is disposed on the circuit layer.

Abstract: A power supply unit supplies power to a load, and the power supply unit includes a power factor corrector, a DC conversion module, and an isolated conversion module. The power factor corrector is plugged into a first main circuit board and converts an AC power into a DC power. The DC conversion module is plugged into the first main circuit board and converts the DC power into a main power. The isolated conversion module includes a bus capacitor, the bus capacitor is coupled to the DC conversion module through a first power copper bar, and coupled to the power factor corrector through a second power copper bar. The first power copper bar and the second power copper bar are arranged on a side opposite to the first main circuit board, and are arranged in parallel with the first main circuit board.

Abstract: The present disclosure proposes a service plan automatic generation system and operation method thereof. The operation method includes a method for generating standardized items based on a service record, which includes the following steps: analyzing multiple instances to generate multiple feature tags, generating multiple word frequency vectors corresponding to the feature tags according to the instances, and performing an aggregation procedure for a plurality of times. Each time performing the aggregation procedure includes: executing a clustering algorithm to divide multiple instances into multiple groups, analyzing multiple variable parts and an identical part of multiple feature vectors in each group, outputting the variable parts as feature tag sets, and using the identical part as an index of the group, when a stop condition is detected, the index generated by the aggregation procedure in the last time is outputted as a standardized item.

Abstract: A display element of an optical stack assembly in an augmented reality (AR) near-eye display device may be protected against ultraviolet (UV) and/or infrared (IR) exposure through one or more protective coatings on various surfaces of the elements of the optical stack assembly. A photochromic coating on one of the surfaces of the elements of the optical stack assembly may also be used instead of or in addition to the protective coatings.