Patents by Inventor An-Yu Hsieh

An-Yu Hsieh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • High performance liquid chromatography with UV-visible detection
    Patent number: 10317379
    Abstract: Apparatus and methods for high performance liquid chromatography. The apparatus includes a preparation loop comprising two linear stepping pumps, a sample loop comprising a sample injector, a chromatography column, and a detector device. The detector device can include a flash lamp, a flow cell, and a light sensor comprising an entrance slit, a grating; and a charge-coupled device array.
    Type: Grant
    Filed: November 23, 2014
    Date of Patent: June 11, 2019
    Assignee: Academia Sinica
    Inventors: Chung-Hsuan Chen, Chen-Yu Hsieh, Jung-Lee Lin
  • Phosphorus-containing polyphenylene oxide resin, its preparation method, method for preparing prepolymer of phosphorus-containing polyphenylene oxide, resin composition and its application
    Patent number: 10280260
    Abstract: The present invention relates to a phosphorus-containing polyphenylene oxide resin, its preparation method, a method for preparing the prepolymer of the phosphorus-containing polyphenylene oxide, a resin composition and an article thereof, wherein the phosphorus-containing polyphenylene oxide resin has a chemical structure represented by the following formula (I): wherein R? is R? is R?? is hydrogen, Through the use of the above phosphorus-containing polyphenylene oxide resin, an article made from the resin composition can has good flame retardance, good thermal resistance and a lower percent of thermal expansion while dielectric properties can be maintained, such that the present invention is suitable for use in products such as copper clad laminate and printed circuit board.
    Type: Grant
    Filed: August 1, 2016
    Date of Patent: May 7, 2019
    Assignee: ELITE MATERIAL CO., LTD.
    Inventors: Chen-Yu Hsieh, Tse-An Lee, Hui-Ting Shih
  • GRAPHENE DISPERSION PASTES, METHODS OF PREPARING AND USING THE SAME
    Publication number: 20190119116
    Abstract: A graphene dispersion paste has a viscosity in a range from 50,000 to 350,000 cps and a scraper fineness less than 20 ?m, and includes graphene sheets, a solvent and a first polymer, wherein the graphene sheets have a bulk density in a range from 0.005 to 0.05 g/cm3, a thickness in a range from 0.68 to 10 nm, and a plane lateral dimension in a range from 1 to 100 ?m. The present application further provides methods of preparing and using the graphene dispersion paste.
    Type: Application
    Filed: January 11, 2018
    Publication date: April 25, 2019
    Inventors: Mark Y. WU, Cheng-Yu HSIEH, Fang-Ru SHEN, Geng Wei LIN, Jing-Ru CHEN
  • METHOD FOR FORMING FEATURES OF SEMICONDUCTOR STRUCTURE HAVING REDUCED END-TO-END SPACING
    Publication number: 20190103281
    Abstract: A method includes forming a mask layer over a target layer. A first etching process is performed on the mask layer to form a first opening and a second opening in the mask layer. A second etching process is performed on the mask layer to reduce an end-to-end spacing between the first opening and the second opening. The first etching process and the second etching process have different anisotropy properties. A pattern of the mask layer is transferred to the target layer.
    Type: Application
    Filed: July 6, 2018
    Publication date: April 4, 2019
    Inventors: Xi-Zong Chen, Yun-Yu Hsieh, Cha-Hsin Chao, Li-Te Hsu
  • Contact Structure for Semiconductor Device
    Publication number: 20190088542
    Abstract: A method of forming a semiconductor device includes forming a source/drain region on a substrate and forming a first interlayer dielectric (ILD) layer over the source/drain region. The method further includes forming a first conductive region within the first ILD layer, selectively removing a portion of the first conductive region to form a concave top surface of the first conductive region. The method also includes forming a second ILD layer over the first ILD layer and forming a second conductive region within the second ILD layer and on the concave top surface. The concave top surface provides a large contact area, and hence reduced contact resistance between the first and second conductive regions.
    Type: Application
    Filed: September 24, 2018
    Publication date: March 21, 2019
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Yun-Yu Hsieh, Jeng Chang Her, Cha-Hsin Chao, Yi-Wei Chiu, Li-Te Hsu, Ying Ting Hsia
  • VINYLBENZYL IMIDE RESIN, METHOD OF PREPARING VINYLBENZYL IMIDE RESIN, VINYLBENZYL IMIDE PREPOLYMER, RESIN COMPOSITION AND ARTICLE MADE THEREFROM
    Publication number: 20190077914
    Abstract: Disclosed is a vinylbenzyl imide resin useful in conjunction with other components to prepare a resin composition for making such as a prepreg, a resin film, a resin film with copper foil, a laminate or a printed circuit board, having improved one or more properties including resin flow, resin filling property, flame retardancy, glass transition temperature, thermal resistance, dielectric constant, dissipation factor and interlayer bonding strength. Also disclosed is a method of preparing the vinylbenzyl imide resin, its prepolymer, a resin composition comprising the vinylbenzyl imide resin and/or its polymer and an article made therefrom.
    Type: Application
    Filed: November 30, 2017
    Publication date: March 14, 2019
    Inventor: Chen-Yu HSIEH
  • METHOD FOR FABRICATING AN IMAGE SENSOR
    Publication number: 20190081092
    Abstract: A method for fabricating an image sensor is disclosed. A substrate having a frontside surface and a backside surface is provided. A plurality of photoelectric transducer elements is disposed on the frontside surface. A dielectric isolation structure extends into the substrate from the frontside surface so as to isolate the plurality of photoelectric transducer elements from one another. The dielectric isolation structure is recess etched from the backside surface so as to form a recessed trench region in the backside surface. A grid material layer is deposited on the backside surface. The recessed trench region is completely filled with the grid material layer. The grid material layer is subjected to a lithographic process and an etching process so as to form a grid structure on the backside surface.
    Type: Application
    Filed: November 15, 2018
    Publication date: March 14, 2019
    Inventor: Cheng-Yu Hsieh
  • MOBILE DEVICE AND ANTENNA THEREFOR
    Publication number: 20190051971
    Abstract: A mobile device includes a housing including a metal case and an antenna mounted inside the housing. The antenna includes a first radiation portion disposed on a first surface of a substrate, a second radiation portion disposed on an opposing surface of the substrate, and a ground element, wherein the second radiation portion includes a first grounding point and a second grounding point that are each electrically connected to the metal case via the ground element.
    Type: Application
    Filed: December 6, 2017
    Publication date: February 14, 2019
    Inventors: Cheng-Yu Hsieh, Kun-Sheng Chang, Ching-Chi Lin
  • Light Emitting Diode and Fabrication Method Thereof
    Publication number: 20190027652
    Abstract: A light-emitting diode includes: a light emitting epitaxial structure including a first-type semiconductor layer, an active layer and a second-type semiconductor layer, and having a first surface as a light emitting surface, and an opposing second surface; a conducting layer formed over the second surface and including a physical plating layer and a chemical plating layer, wherein the physical plating layer is adjacent to the light emitting epitaxial structure and has cracks, and the chemical plating layer fills the cracks in the physical plating layer; and a submount coupled to the light emitting epitaxial laminated layer through the conducting layer.
    Type: Application
    Filed: September 20, 2018
    Publication date: January 24, 2019
    Applicant: XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD.
    Inventors: Chao JIN, Chuang Yu HSIEH, Chen Kang HSIEH, Duxiang WANG, Chaoyu WU, Chih Pang MA
  • RESIN COMPOSITION AND ARTICLES MADE THEREFROM
    Publication number: 20190016874
    Abstract: Disclosed is a resin composition which comprises a compound with at least two DOPO groups or a combination thereof as the flame retardant and an aliphatic long-chain maleimide compound. The resin composition is useful for the preparation of various articles, such as a prepreg, a resin film, a resin film with copper foil, a laminate or a printed circuit board, achieving at least one, more or all properties improved of laminate formability, reliability of multiple laminations, chemical resistance, thermal resistance, dielectric constant, dissipation factor, interlayer bonding strength, storage modulus and so on.
    Type: Application
    Filed: November 3, 2017
    Publication date: January 17, 2019
    Inventor: Chen-Yu HSIEH
  • METHOD OF STICTION PREVENTION BY PATTERNED ANTI-STICTION LAYER
    Publication number: 20190002273
    Abstract: The present disclosure relates to a MEMS apparatus with a patterned anti-stiction layer, and an associated method of formation. The MEMS apparatus has a handle substrate defining a first bonding face and a MEMS substrate having a MEMS device and defining a second bonding face. The handle substrate is bonded to the MEMS substrate through a bonding interface with the first bonding face toward the second bonding face. An anti-stiction layer is arranged between the first and the second bonding faces without residing over the bonding interface.
    Type: Application
    Filed: August 1, 2017
    Publication date: January 3, 2019
    Inventors: Kuei-Sung Chang, Fei-Lung Lai, Shang-Ying Tsai, Cheng Yu Hsieh
  • VINYL-MODIFIED MALEIMIDE, COMPOSITION AND ARTICLE MADE THEREBY
    Publication number: 20180362715
    Abstract: The present invention discloses vinyl-modified maleimide, a resin composition using the same and a preparation thereof. The vinyl-modified maleimide has better solvent selectivity and solvent compatibility. The obtained preparation can satisfy the properties of no crack between multilayer boards and high frequency and low dielectric properties maintained after moisture absorption.
    Type: Application
    Filed: December 12, 2017
    Publication date: December 20, 2018
    Inventor: Chen-Yu HSIEH
  • IMAGE SENSOR AND FABRICATION METHOD THEREOF
    Publication number: 20180358392
    Abstract: An image sensor is disclosed. The image sensor includes a substrate having a frontside surface and a backside surface. A plurality of photoelectric transducer elements is disposed on the frontside surface. A dielectric isolation structure extends into the substrate from the frontside surface so as to isolate the plurality of photoelectric transducer elements from one another. A grid structure is disposed on the backside surface. The grid structure has an embedded portion extending into the substrate from the backside surface. The embedded portion of the grid structure is aligned with and in direct contact with the dielectric isolation structure.
    Type: Application
    Filed: June 7, 2017
    Publication date: December 13, 2018
    Inventor: Cheng-Yu Hsieh
  • METHOD AND APPARATUS FOR NETWORK SCHEDULING
    Publication number: 20180352544
    Abstract: Aspects of the disclosure provide a control apparatus that includes transceiver circuitry and processing circuitry. The transceiver circuitry is configured to transmit/receive signals from a plurality of terminal devices using a shared channel. The processing circuitry is configured to determine distances to the plurality of terminal devices, allocate resource elements in the shared channel according to the distances, and communicate, via the transceiver circuitry, with the plurality of terminal devices according to the allocation of the resource elements in the shared channel.
    Type: Application
    Filed: May 28, 2018
    Publication date: December 6, 2018
    Applicant: MEDIATEK INC.
    Inventors: James Wang, Hsin-Ying Lee, Shih-Chieh Yen, Ming-Yu Hsieh, Pei-Kai Liao
  • Trial frame and method for measuring key parameter thereof
    Patent number: 10130252
    Abstract: A trial frame includes a trial frame body and at least one measurement subject having a visual invariant geometric characteristic. The trial frame body has at least one key parameter. The measurement subject is disposed on the trial frame body and collaborates with a measurement method. A two-dimensional image of the measurement subject is recorded by an image capturing device when the trial frame body fits to a user, and the key parameter is deduced from the two-dimensional image of the measurement subject.
    Type: Grant
    Filed: September 9, 2014
    Date of Patent: November 20, 2018
    Assignee: NATIONAL CHIAO TUNG UNIVERSITY
    Inventors: Jen-Hui Chuang, Yi-Yu Hsieh, Yen-Shuo Lin
  • Disc brake caliper of bicycle
    Patent number: 10124855
    Abstract: A disc brake caliper of a bicycle includes a main body, a first bolt, an intermediate member, a second bolt, and a tubing connector. The main body has an oil passage and a first tapped hole communicating with the oil passage. The first bolt is screwed into the first tapped hole, with a first exposed section exposed out of the main body. The intermediate member fits around the first exposed section through a first perforation, and has a second tapped hole, which extends in a direction different from that of the first perforation. The intermediate member can be rotated relative to the first exposed section. The second bolt is screwed in the second tapped hole, with a second exposed section exposed out of the intermediate member. The tubing connector fits around the second exposed section through a second perforation, and can be rotated relative to the second exposed section.
    Type: Grant
    Filed: November 14, 2016
    Date of Patent: November 13, 2018
    Assignee: LEE CHI ENTERPRISES COMPANY LTD.
    Inventor: Tsung-Yu Hsieh
  • ENCODED TEXT DATA MANAGEMENT
    Publication number: 20180322102
    Abstract: Disclosed aspects relate to encoded text data management using a set of encoded text data types. A first set of bits which indicates a first encoded text data type may be identified. A second set of bits which indicates a first quantitative size of a third set of bits for a first set of text data of the first encoded text data type may be identified. Using both the first set of bits and the second set of bits, an encoded data management operation may be executed with respect to the third set of bits for the first set of text data of the first encoded text data type.
    Type: Application
    Filed: April 13, 2018
    Publication date: November 8, 2018
    Inventors: Wendy Ping Wen Wang, Hsiao-Yung Chen, Hsiang-Wen Chen, Wen-Ping Chi, Hsin Yu Hsieh
  • FINFET DEVICE WITH A REDUCED WIDTH
    Publication number: 20180315837
    Abstract: A method includes forming a fin structure on a substrate, forming a dummy gate structure wrapped around the fin structure, depositing an Interlayer Dielectric (ILD) layer over the fin structure, removing the dummy gate structure to expose a portion of the fin structure, and performing an etching process on the portion of the fin structure to reduce a width of the portion of the fin structure.
    Type: Application
    Filed: April 28, 2017
    Publication date: November 1, 2018
    Inventors: Ka-Hing Fung, Chen-Yu Hsieh, Che-Yuan Hsu, Ming-Yuan Wu, Hsu-Chieh Cheng
  • Modified polyphenylene ether resin, method of making the same and resin composition
    Patent number: 10093774
    Abstract: Provided are a modified polyphenylene ether resin, a method of making the same and a resin composition. Particularly, the modified polyphenylene ether resin has a structure represented by the following formula (I), wherein R, Y, PPE, Z and c are as described in the specification. Also provided are a method of making the modified polyphenylene ether resin, a resin composition comprising the modified polyphenylene ether resin and an article made from the resin composition. Using the modified polyphenylene ether resin described above can achieve a better glass transition temperature, thermal resistance and lower (superior) thermal expansion and dielectric properties.
    Type: Grant
    Filed: August 11, 2016
    Date of Patent: October 9, 2018
    Assignee: ELITE ELECTRONICS MATERIAL (KUNSHAN) CO., LTD.
    Inventors: Chen Yu Hsieh, Yan Zhang
  • Contact structure for semiconductor device
    Patent number: 10083863
    Abstract: A method of forming a semiconductor device includes forming a source/drain region on a substrate and forming a first interlayer dielectric (ILD) layer over the source/drain region. The method further includes forming a first conductive region within the first ILD layer, selectively removing a portion of the first conductive region to form a concave top surface of the first conductive region. The method also includes forming a second ILD layer over the first ILD layer and forming a second conductive region within the second ILD layer and on the concave top surface. The concave top surface provides a large contact area, and hence reduced contact resistance between the first and second conductive regions.
    Type: Grant
    Filed: August 23, 2017
    Date of Patent: September 25, 2018
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Yun-Yu Hsieh, Jeng Chang Her, Cha-Hsin Chao, Yi-Wei Chiu, Li-Te Hsu, Ying Ting Hsia