Abstract: The present invention discloses a composite structure of graphene and carbon nanotube and a method of manufacturing the same. The composite structure includes graphene platelets and carbon nanotubes, each carbon nanotube growing perpendicular to the planar surface of the graphene platelet. The method includes steps of graphene platelets preparation, chemical precipitation, chemical reduction and carbon nanotube growth. Metal particles are first formed on the graphene platelets through the steps of chemical precipitation and electrochemical reduction, and carbon nanotubes grow in the step of carbon nanotube growth through thermal treatment. Thus, the graphene platelets and the carbon nanotubes of the present invention form a three dimensional structure, and the carbon nanotubes are used as three dimensional spacers and configured between the graphene platelets, which are effectively separated and hard to aggregate or congregate together.

Abstract: Provided are a modified polyphenylene ether resin, a method of making the same and a resin composition. Particularly, the modified polyphenylene ether resin has a structure represented by the following formula (I), wherein R, Y, PPE, Z and c are as described in the specification. Also provided are a method of making the modified polyphenylene ether resin, a resin composition comprising the modified polyphenylene ether resin and an article made from the resin composition. Using the modified polyphenylene ether resin described above can achieve a better glass transition temperature, thermal resistance and lower (superior) thermal expansion and dielectric properties.

Abstract: A transparent antistatic film of the present application includes a substrate and a transparent graphene coating, the substrate at least includes a first surface, and the transparent graphene coating is disposed above the first surface of the substrate. The transparent graphene coating has a surface resistance less than 1012 ohm/sq and a visible transmittance greater than 70% at wavelength of 550 nm, and the transparent graphene coating includes a plurality of surface modified graphene nanosheets and a carrier resin, wherein the plurality of surface modified graphene nanosheets is uniformly dispersed in the carrier resin.

Abstract: A shoe structure having a lace capable for penetrating through itself mainly comprises a lace and a sole. The lace has a front end and a rear end. The lace includes at least one long weaving section weaved with one layer and at least two short weaving sections weaved with two layers for each. Each short weaving section has a gap. The lace has at least two gaps. The sole has a fastening portion arranged at each side thereof. It is characteristized in that a cover portion is formed by winding around the front end to penetrate through one gap of the lace, and a stop portion is formed by winding the front end with a loop to penetrate through the other gap, and then the front end and the rear end are fastened to the fastening portion of the sole.

Abstract: A container is in an integral form, and has a body, two handles, a handle combination structure, a folding combination structure, and two lids. The handles are connected with the body, and connecting portions between the handles and body are bendable. The handle combination structure is formed on the handles to selectively combine the handles. The folding combination structure is formed on the handles and the connecting plates to selectively combine the handles and the body. The lids are connected with the body, are respectively located in spaces which are respectively formed in the body and the handles, and connecting portions between the body and the lids are bendable.

Abstract: A container is in an integral form, and has a body, two handles, a handle combination structure, a folding combination structure, and two lids. The handles are connected with the body, and connecting portions between the handles and body are bendable. The handle combination structure is formed on the handles to selectively combine the handles. The folding combination structure is formed on the handles and the connecting plates to selectively combine the handles and the body. The lids are connected with the body, are respectively located in spaces which are respectively formed in the body and the handles, and connecting portions between the body and the lids are bendable.

Abstract: A light pipe structure of an image sensing device including a substrate, a dielectric layer, and a light-pipe material layer is provided. The substrate has a light sensing region therein. The dielectric layer is disposed on the substrate. The dielectric layer has a light pipe therein, and the light pipe is located above the light sensing region. The light-pipe material layer is disposed in the light pipe and has a recessed curved surface.

Abstract: Disclosed is a fluorenylidene-diphenol-containing polyphenylene oxide which is defined by the following structural formula wherein D, X, Y, Z and b are defined in the specification. The fluorenylidene-diphenol-modified polyphenylene oxide resin or its prepolymer may be used for producing resin products with better thermal resistance, dielectric property, flame retardancy and lower thermal expansion. Accordingly, the resin products, such as prepregs, laminates or printed circuit boards, are suitable for use in electronic products with high speed and high frequency signal transmission to further improve the reliability, thermal resistance, and dimensional stability of the electronic products.

Abstract: The present invention relates to resin composite materials, and more particularly, to low-dielectric resin composition and prepreg, resin film, resin coated copper, laminate and printed circuit board formed therefrom. The low-dielectric resin composition includes a phosphorus-containing flame retardant as shown in formula (I) and a resin with an active unsaturated bond. The low-dielectric resin composition may further be manufactured as a prepreg, a resin film, a resin coated copper, a laminate, or a printed circuit board, having a high glass transition temperature, low dielectric property, halogen-free flame retardancy and low percent of thermal expansion of laminate.

Abstract: A semiconductor transistor device includes an oxide semiconductor layer having an active surface, a source electrode, a drain electrode, a gate electrode and a control capacitor. The gate electrode, the source electrode and the drain electrode are directly in contact with the active surface. The gate electrode is disposed between the drain electrode and the source electrode. The gate electrode, the source electrode and the drain electrode are separated from each other. The control capacitor is electrically connected to the gate electrode through a connection.

Abstract: A location based community integration matchmaking system, method and computer readable recording media for optimizing sales is provided, including: obtaining user behavior pattern in an inquired area range based on stores information and user behavioral sequential information; calculating a location based community influence degree of each user in the inquired area range toward other location based users in a community based on the user behavior pattern, the community association and behavioral information, and calculating an interest domain influence degree of each user toward each interest domain; obtaining influence diffusing degree of each user toward each interest domain based on the location based community influence and the interest domain influence degree of each user; and finding a range with large influence degree in the inquired area range for performing advertisement setting, thereby achieving optimization analysis and visitor maximization of marketing channel of brick and mortar stores in the ar

Abstract: A high-efficiency buffer stocker is disclosed. The buffer stocker includes an overhead transport track for supporting overhead transport vehicles carrying wafer containers and at least one conveyor system or conveyor belt provided beneath the overhead transport track for receiving the wafer containers from the overhead transport vehicles on the overhead transport track. The buffer stocker is capable of absorbing the excessive flow of wafer containers between a processing tool and a stocker, for example, to facilitate the orderly and efficient flow of wafers between sequential process tools in a semiconductor fabrication facility, for example.

Abstract: The present disclosure relates to a filler composition for a semiconductor package. The filler composition comprises carbon and silica.

Abstract: An electronic device including a metal element and an antenna element is provided. The antenna element is disposed on a substrate and includes a radiation portion and a connection portion. A first end of the radiation portion has a feeding point for receiving a feeding signal, and a second end of the radiation portion is an open end. A first end of the connection portion is electrically connected to the first end of the radiation portion. A second end of the connecting portion has a first ground point to be electrically connected the metal element. An orthogonal projection of the metal element on the substrate and an orthogonal projection of the antenna element on the substrate are overlapped with each other. The radiation portion is electrically connected the metal element through a second ground point.

Abstract: A semiconductor structure includes: a first device; a second device contacted with the first device, wherein a chamber is formed between the first device and the second device; a first hole disposed in the second device and defined between a first end with a first circumference and a second end with a second circumference; a second hole disposed in the second device and aligned to the first hole; and a sealing object for sealing the second hole. The first end links with the chamber, and the first circumference is different from the second circumference, the second hole is defined between the second end and a third end with a third circumference, and the second circumference and the third circumference are smaller than the first circumference.

Abstract: An interface module coupled between a host device and a wireless device is disclosed. The interface module includes a connector, having a first part covered in a first case with a first depth and a second part covered in a second case with a second depth; and a control circuit coupled to the first part of the connector, for controlling data transmission between the host device and the wireless device; wherein the second case is made of a conductive material and which can be further covered by an absorptive material.

Abstract: A computer apparatus includes a first cover, a second cover, a motherboard, an expansion device and a detach assisting assembly. The second cover is detachably disposed on the first cove, and has an accommodation space and an opening. The motherboard is disposed between the first and second covers. The expansion device disposed in the accommodation space and connected to the motherboard is drawable from the accommodation space through the opening. The detach assisting assembly disposed in the accommodation space includes a slidable member and a rotatable member. The slidable member is slidable relative to the second cover for rotating the rotatable member to drive the first pressing part to press a side of the expansion device away from the opening, and thereby at least a part of the expansion device protrudes from the accommodation space through the opening.