Abstract: A current carrying system for use in transporting electrical current between a plurality of electrical devices is provided. The current carrying system includes a busbar having a first axial end, a second axial end, an electrically conductive shaft extending from the first axial end to the second axial end, and at least one cooling feature defined in at least a portion of the electrically conductive shaft. The current carrying system also includes a casing that defines a busbar channel configured to receive the busbar such that the casing at least partially circumscribes the busbar. The current carrying system also includes an air vent defined by the at least one cooling feature and the casing, wherein the air vent is in flow communication with ambient air, and the cooling feature is configured to facilitate a flow of air from the ambient air through the air vent.

Abstract: Electrical equipment that includes a cabinet comprising a plurality of walls is provided. The cabinet is disposed around a plurality of electric components such as conductors. Further, the electrical equipment also includes at least one barrier. The barrier is disposed in the cabinet and spaced apart from the conductor by a spacing distance to define a channel within the cabinet for air to flow between the barrier and the conductor. The barrier is placed such that a portion of the barrier is coupled to one of the plurality of walls of the electric cabinets.

Abstract: A current carrying system for use in transporting electrical current between a plurality of electrical devices is provided. The current carrying system includes a busbar having a first axial end, a second axial end, an electrically conductive shaft extending from the first axial end to the second axial end, and at least one cooling feature defined in at least a portion of the electrically conductive shaft. The current carrying system also includes a casing that defines a busbar channel configured to receive the busbar such that the casing at least partially circumscribes the busbar. The current carrying system also includes an air vent defined by the at least one cooling feature and the casing, wherein the air vent is in flow communication with ambient air, and the cooling feature is configured to facilitate a flow of air from the ambient air through the air vent.

Abstract: A current carrying system for use in transporting electrical current between a plurality of electrical devices is provided. The current carrying system includes a busbar having a first axial end, a second axial end, an electrically conductive shaft extending from the first axial end to the second axial end, and at least one cooling feature defined in at least a portion of the electrically conductive shaft. The current carrying system also includes a casing that defines a busbar channel configured to receive the busbar such that the casing at least partially circumscribes the busbar. The current carrying system also includes an air vent defined by the at least one cooling feature and the casing, wherein the air vent is in flow communication with ambient air, and the cooling feature is configured to facilitate a flow of air from the ambient air through the air vent.

Abstract: Electrical equipment that includes a cabinet comprising a plurality of walls is provided. The cabinet is disposed around a plurality of electric components such as conductors. Further, the electrical equipment also includes at least one barrier. The barrier is disposed in the cabinet and spaced apart from the conductor by a spacing distance to define a channel within the cabinet for air to flow between the barrier and the conductor. The barrier is placed such that a portion of the barrier is coupled to one of the plurality of walls of the electric cabinets.

Abstract: A current carrying system for use in transporting electrical current between a plurality of electrical devices is provided. The current carrying system includes a busbar having a first axial end, a second axial end, an electrically conductive shaft extending from the first axial end to the second axial end, and at least one cooling feature defined in at least a portion of the electrically conductive shaft. The current carrying system also includes a casing that defines a busbar channel configured to receive the busbar such that the casing at least partially circumscribes the busbar. The current carrying system also includes an air vent defined by the at least one cooling feature and the casing, wherein the air vent is in flow communication with ambient air, and the cooling feature is configured to facilitate a flow of air from the ambient air through the air vent.

Abstract: Some embodiments of a method, apparatus and computer system are described for vortex generator enhanced cooling. The computer system may include a housing and an apparatus. The apparatus may include one or more vortex generators coupled to a heat spreader and positioned in close proximity to an electronic component, and a flow of air to provide for an exchange of thermal energy, where the flow of air is provided by a configuration of the housing, and where the one or more vortex generators may promote turbulence to enhance the exchange of thermal energy of the electronic component. In some embodiments, an air mover may be used to increase the flow of air in the housing. Other embodiments are described.

Abstract: A mechanism is described for chimney-based cooling of computer components. A method of embodiments of the invention includes determining heat-emitting components of a computing device. The method further includes coupling a chimney to one or more of the heat-emitting components such that chimney effect of the chimney is used to guide air associated with a component in and out of the chimney.

Abstract: A mechanism is described for chimney-based cooling of computer components. A method of embodiments of the invention includes determining heat-emitting components of a computing device. The method further includes coupling a chimney to one or more of the heat-emitting components such that chimney effect of the chimney is used to guide air associated with a component in and out of the chimney.

Abstract: Some embodiments of a method, apparatus and computer system are described for inverted vortex generator enhanced cooling. In various embodiments an apparatus may comprise a first surface comprising at least one heated component, a second surface in proximity to the first surface, the second surface comprising a non-heated surface, and one or more inverted vortex generators attached to the non-heated surface, a portion of the one or more inverted vortex generators in proximity to and configured to dissipate heat from the at least one heated component. Other embodiments are described.

Abstract: Embodiments disclosed herein include EMI shielding to cool a computing device with one or more vents. In some embodiments, a louvered vent formed in the EMI shield of a computing device creates an air curtain between the EMI shield and a heat-generating component to cool the component, the EMI shield and the external wall. Other embodiments are described.

Abstract: Apparatus and methods of cooling a computing device using active air vents. Embodiments include active air vents capable of dynamically changing the pattern of inlet airflow into the housing of the computing device and selectively directing airflow to cool heat-generating components on need basis. Embodiments include active vents coupled to an actuation mechanism to preferentially open and close the active air vents so that inlet airflow into the housing can be regulated based on the cooling requirement of heat-generating components in the housing. Embodiments also include a control module to determine the cooling requirement of the components of the device.

Abstract: Apparatuses, systems, and methods for a heat spreader plate and pulsating heat pipes to transfer heat sourced from one or more electronic components are described herein. Other embodiments may also be described and claimed.

Abstract: Some embodiments of a method, apparatus and computer system are described for inverted vortex generator enhanced cooling. In various embodiments an apparatus may comprise a first surface comprising at least one heated component, a second surface in proximity to the first surface, the second surface comprising a non-heated surface, and one or more inverted vortex generators attached to the non-heated surface, a portion of the one or more inverted vortex generators in proximity to and configured to dissipate heat from the at least one heated component. Other embodiments are described.

Abstract: Some embodiments of a method, apparatus and computer system are described for vortex generator enhanced cooling. The computer system may include a housing and an apparatus. The apparatus may include one or more vortex generators coupled to a heat spreader and positioned in close proximity to an electronic component, and a flow of air to provide for an exchange of thermal energy, where the flow of air is provided by a configuration of the housing, and where the one or more vortex generators may promote turbulence to enhance the exchange of thermal energy of the electronic component. In some embodiments, an air mover may be used to increase the flow of air in the housing. Other embodiments are described.

Abstract: Embodiments of thermal cooling devices and systems including dies and thermal attaches having surface features are described in this application. The thermal attach may have a surface feature, such as a pattern, to limit movement of a thermal interface material, such as thermal grease, from between the die and the thermal attachment. The restriction of movement of the thermal interface material may improve the thermal performance of cooling systems for electronic devices over many cycles as opposed to known cooling systems. Other embodiments are described.

Abstract: Some embodiments of a method, apparatus and computer system are described for cooling a lid with an air mover. A computer system may include a frame and a display with a heat spreader and one or more air movers. In some embodiments, the one or more air movers may include a piezoelectric fan, a synthetic jet, a centrifugal fan, a coaxial fan, an axial fan, or a propeller fan. Moreover, in some embodiments, the air movers may be integrated into or formed as part of the heat spreader's structure. Other embodiments are described.

Abstract: A winged piezo-fan to dissipate the heat generated by the devices in an electronic system is disclosed. The winged piezo-fan may comprise a piezo-ceramic element and two blades. The blades may be coupled to the piezo-ceramic element, which may change its physical dimension in response to receiving an alternating voltage signal. The blades coupled to the piezo-ceramic element may move upwards and downwards in a direction that is perpendicular to the axis drawn along the length dimension of the blades in response to the changes in the physical dimension of the piezo-ceramic element. The movement of the blades may cause a flapping movement, which may create turbulence in the surrounding air. The turbulence so created may create eddies, which may dissipate the heat generated by the devices positioned close to the winged piezo-fan.

Abstract: Embodiments disclosed herein include EMI shielding to cool a computing device with one or more vents. In some embodiments, a louvered vent formed in the EMI shield of a computing device creates an air curtain between the EMI shield and a heat-generating component to cool the component, the EMI shield and the external wall. Other embodiments are described.

Abstract: Embodiments of the present invention include an apparatus, method and system for a thermal management arrangement in a standardized peripheral device.