Abstract: Removing heat generated by an operating IC chip from both the chip and the electronics package containing the chip is essential for proper system operation and to increase the life of the electronics package. Using an air permeable lid with the electronic package increases the heat transfer away from the IC chip and electronics package, thereby cooling the chip and the package.

Abstract: According to some embodiments, an enhanced heat exchanger may be provided. The enhanced heat exchanger may comprise, for example, a heat transfer portion to receive heat from a heat source and to transfer heat from the heat source, and a remote heat sink adjacent to the heat transfer portion to remove heat from the heat transfer portion. In some embodiments, the remote heat sink may comprise a solid metal portion that extends away from the heat transfer portion, and a porous medium coupled to the solid metal portion. According to some embodiments, the porous medium may extend away from the solid metal portion such that a thermal boundary layer exists in substantially the entire porous medium.

Abstract: Adjacent integrated circuit chips in processor-based systems may be covered with a metal foil cover. The cover may make air flow over the chips more aerodynamic, improving thermal heat transfer and cooling. This may improve performance and reduce power consumption, all without significantly increasing the size of the components.

Abstract: Embodiments of the present invention include an apparatus, method and system for a thermal management arrangement in a standardized peripheral device.

Abstract: Embodiments of the present invention include an apparatus, method, and system for an electronic assembly with a thermal management device including a porous medium.

Abstract: According to some embodiments, an enhanced heat exchanger may be used to dissipate heat.

Abstract: Removing heat generated by an operating IC chip from both the chip and the electronics package containing the chip is essential for proper system operation and to increase the life of the electronics package. Using an air permeable lid with the electronic package increases the heat transfer away from the IC chip and electronics package, thereby cooling the chip and the package.