Patents by Inventor Andre Hanke

Andre Hanke has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8536683
    Abstract: Structures of a system on a chip are disclosed. In one embodiment, the system on a chip (SoC) includes an RF component disposed on a first part of a substrate, a semiconductor component disposed on a second part of the substrate, the semiconductor component and the RF component sharing a common boundary, and a conductive cage disposed enclosing the RF component. The conductive cage shields the semiconductor component from electromagnetic radiation originating from the RF circuit.
    Type: Grant
    Filed: March 1, 2011
    Date of Patent: September 17, 2013
    Assignee: Infineon Technologies AG
    Inventors: Hans-Joachim Barth, Andre Hanke, Snezana Jenei, Oliver Nagy, Jiro Morinaga, Bernd Adler, Heinrich Koerner
  • Patent number: 8374279
    Abstract: A modulation device includes a signal input for receiving a data stream to be modulated and a first and a second signal output. At least one first complex component is derived from the data stream in a coding device. A first and a second high-frequency signal are output via the signal outputs. The first and second high-frequency signals are derived from the at least one first complex component and are distinguished by the fact that the second high-frequency signal has a phase shift of substantially 90° with respect to the first high-frequency signal.
    Type: Grant
    Filed: February 21, 2007
    Date of Patent: February 12, 2013
    Assignee: Intel Mobile Communications GmbH
    Inventors: Bernd Adler, André Hanke
  • Publication number: 20120195239
    Abstract: A signal generator for a transmitter or a receiver for transmitting or receiving RF-signals according to a given communication protocol includes an oscillator and a mismatch compensator. The oscillator is configured to provide a signal generator output signal having a signal generator output frequency and comprises a fine tuning circuit for providing a fine adjustment of the signal generator output frequency based on a fine tuning signal and a coarse tuning circuit for providing a course adjustment of the signal generator output frequency based on a coarse tuning signal.
    Type: Application
    Filed: February 2, 2011
    Publication date: August 2, 2012
    Applicant: Infineon Technologies AG
    Inventors: Alexander Belitzer, Andre Hanke, Boris Kapfelsperger, Volker Thomas, Elmar Wagner
  • Patent number: 8085834
    Abstract: A communication device partition for multiple device data standards to be received on one baseband integrated circuit is described. At least two interfaces are partitioned according to the data rate speed of various types of data standards and coupled to a multimode software define radio (SDR) modem. A digital baseband processor is coupled to the multimode SDR modem and receives the various types of application data compliant with various data standards.
    Type: Grant
    Filed: April 30, 2008
    Date of Patent: December 27, 2011
    Assignee: Infineon Technologies AG
    Inventors: Andre Hanke, Bernd Adler
  • Publication number: 20110201175
    Abstract: Structures of a system on a chip are disclosed. In one embodiment, the system on a chip (SoC) includes an RF component disposed on a first part of a substrate, a semiconductor component disposed on a second part of the substrate, the semiconductor component and the RF component sharing a common boundary, and a conductive cage disposed enclosing the RF component. The conductive cage shields the semiconductor component from electromagnetic radiation originating from the RF circuit.
    Type: Application
    Filed: March 1, 2011
    Publication date: August 18, 2011
    Inventors: Hans-Joachim Barth, Andre Hanke, Snezana Jenei, Oliver Nagy, Jiro Morinaga, Bernd Adler, Heinrich Koerner
  • Patent number: 7973358
    Abstract: One or more embodiments relate to a semiconductor device, comprising: a substrate; and a radio frequency coupler including a first coupling element and a second coupling element spacedly disposed from the first coupling element, the first coupling element including at least one through-substrate via disposed in the substrate, the second coupling element including at least one through-substrate via disposed in the substrate.
    Type: Grant
    Filed: August 7, 2008
    Date of Patent: July 5, 2011
    Assignee: Infineon Technologies AG
    Inventors: Andre Hanke, Oliver Nagy
  • Patent number: 7948064
    Abstract: Structures of a system on a chip are disclosed. In one embodiment, the system on a chip (SoC) includes an RF component disposed on a first part of a substrate, a semiconductor component disposed on a second part of the substrate, the semiconductor component and the RF component sharing a common boundary, and a conductive cage disposed enclosing the RF component. The conductive cage shields the semiconductor component from electromagnetic radiation originating from the RF circuit.
    Type: Grant
    Filed: September 30, 2008
    Date of Patent: May 24, 2011
    Assignee: Infineon Technologies AG
    Inventors: Hans-Joachim Barth, Andre Hanke, Snezana Jenei, Oliver Nagy, Jiro Morinaga, Bernd Adler, Heinrich Koerner
  • Publication number: 20110007842
    Abstract: A transmission arrangement for modulating useful signals onto a carrier frequency signal has a frequency generator for generating the carrier frequency signal, a first modulation path for modulating a first useful signal onto the carrier frequency signal, and a second modulation path for modulating a second useful signal onto the carrier frequency signal. The first modulation path has a digital modulator for providing an amplitude signal and a Cartesian signal pair from the first useful signal and a Cartesian modulator for modulating the Cartesian signal pair onto the carrier frequency signal in order to provide an intermediate signal. The first modulation path is configured in such a manner that the amplitude signal is modulated onto the intermediate signal in order to provide an output signal.
    Type: Application
    Filed: July 6, 2010
    Publication date: January 13, 2011
    Inventors: Bernd ADLER, Andre Hanke
  • Publication number: 20100078779
    Abstract: Structures of a system on a chip are disclosed. In one embodiment, the system on a chip (SoC) includes an RF component disposed on a first part of a substrate, a semiconductor component disposed on a second part of the substrate, the semiconductor component and the RF component sharing a common boundary, and a conductive cage disposed enclosing the RF component. The conductive cage shields the semiconductor component from electromagnetic radiation originating from the RF circuit.
    Type: Application
    Filed: September 30, 2008
    Publication date: April 1, 2010
    Inventors: Hans-Joachim Barth, Andre Hanke, Snezana Jenei, Oliver Nagy, Jiro Morinaga, Bernd Adler, Heinrich Koerner
  • Publication number: 20100032800
    Abstract: One or more embodiments relate to a semiconductor device, comprising: a substrate; and a plurality of first conductive vias, the first conductive vias electrically coupled together, each of the first conductive vias passing through the substrate; and a plurality of second conductive vias, the second conductive vias electrically coupled together, each of the second conductive vias passing through the substrate, the second conductive vias spacedly disposed from the first conductive vias.
    Type: Application
    Filed: August 7, 2008
    Publication date: February 11, 2010
    Applicant: Infineon Technologies AG
    Inventors: Andre HANKE, Oliver NAGY
  • Publication number: 20100033273
    Abstract: One or more embodiments relate to a semiconductor device, comprising: a substrate; and a radio frequency coupler including a first coupling element and a second coupling element spacedly disposed from the first coupling element, the first coupling element including at least one through-substrate via disposed in the substrate, the second coupling element including at least one through-substrate via disposed in the substrate.
    Type: Application
    Filed: August 7, 2008
    Publication date: February 11, 2010
    Applicant: INFINEON TECHNOLOGIES AG
    Inventors: Andre HANKE, Oliver NAGY
  • Publication number: 20090274202
    Abstract: A communication device partition for multiple device data standards to be received on one baseband integrated circuit is described. At least two interfaces are partitioned according to the data rate speed of various types of data standards and coupled to a multimode SDR modem. A digital baseband processor is coupled to the multimode SDR modem and receives the various types of application data compliant with various data standards.
    Type: Application
    Filed: April 30, 2008
    Publication date: November 5, 2009
    Applicant: Infineon Technologies AG
    Inventors: Andre Hanke, Bernd Adler
  • Publication number: 20090153229
    Abstract: An AC voltage signal is transmitted between a semiconductor substrate and a further semiconductor substrate arranged on the first semiconductor substrate by means of an electromagnetic field through one of the two semiconductor substrates by virtue of each semiconductor substrate having a circuit element that serves for transmission. Both circuit elements are directly electrically decoupled.
    Type: Application
    Filed: December 14, 2007
    Publication date: June 18, 2009
    Inventors: Andre Hanke, Helmuth Hermann, Michael Dunkel
  • Publication number: 20090083977
    Abstract: A method for filling either blind or through via holes in a semiconductor substrate involves the use of dielectric or conductive polymer paste, and a drying and a curing process of the polymer paste.
    Type: Application
    Filed: September 28, 2007
    Publication date: April 2, 2009
    Inventors: Andre Hanke, Helmuth Hermann, Michael Dunkel
  • Publication number: 20090060011
    Abstract: In one embodiment, a circuit can selectively adjust a current for driving a load. The circuit includes a sensor configured to measure a magnetic field associated with the current and provide a sensor voltage representative thereof. A control circuit is configured to selectively adjust the current as a function of the sensor voltage and a time-varying voltage threshold. Other methods and systems are also disclosed.
    Type: Application
    Filed: August 27, 2007
    Publication date: March 5, 2009
    Inventors: Andre Hanke, Bernd Adler
  • Patent number: 7433667
    Abstract: A signal conditioning circuit contains an oscillator which is connected to the inputs of two mixers. The output of one mixer is coupled, so as to form a feedback path, to a frequency divider circuit whose first output is coupled to the second input of the first mixer. A second signal output of the frequency divider circuit carries a signal with a phase shift of 90 degrees with respect to the signal at the first signal output of the frequency divider circuit. The second signal is supplied to a second input of the second mixer. Feedback results in undesirable signal components in the in-phase and quadrature components being suppressed. At the same time, the in-phase and quadrature components have a fixed phase relationship with respect to one another. The signal conditioning circuit allows desired non-integer division ratios to be achieved.
    Type: Grant
    Filed: September 23, 2004
    Date of Patent: October 7, 2008
    Assignee: Infineon Technologies AG
    Inventors: Dietolf Seippel, André Hanke, Duyen Pham-Stäbner
  • Patent number: 7430265
    Abstract: The invention specifies a circuit arrangement with a phase locked loop (1), which can be used as a mobile radio transmitter, in particular. The reference frequency for the PLL (1), which is provided by means of the source (3), is multiplied by a multiplier (10) and is down-converted to an intermediate-frequency level in a down-conversion mixer (9) using the output signal from the PLL, and is evaluated such that a modulator (13) connected to the input of the oscillator (6) can be trimmed. The inventive principle is used to advantage in two-point modulators and allows inexpensive, integratable mobile radio transmitters with good noise characteristics.
    Type: Grant
    Filed: December 21, 2004
    Date of Patent: September 30, 2008
    Assignee: Infineon Technologies AG
    Inventors: Thomas Convent, Markus Hammes, André Hanke, Giuseppe Li Puma, Walter Mevissen
  • Patent number: 7336717
    Abstract: A radio receiver with a low intermediate frequency has a first mixer stage that can be fed with a modulated input signal and at whose output a complex intermediate frequency signal can be derived. Connected downstream of the first mixer stage is a limiting amplifier at whose output the intermediate frequency signal is present in a discrete-value and continuous-time fashion. A sampling device, for sampling the intermediate frequency signal, and a digital demodulator unit are connected to the output of this limiter. The demodulated input signal can be derived at the output of this digital demodulator unit. The present radio receiver requires a low chip area in conjunction with low power consumption, but offers a high sensitivity and accuracy based on the digitally implemented demodulation.
    Type: Grant
    Filed: March 10, 2003
    Date of Patent: February 26, 2008
    Assignee: Infineon Technologies AG
    Inventors: Markus Hammes, Stefan Heinen, Stefan Van Waasen, Andre Hanke, Sönke Mehrgardt, Elmar Wagner
  • Publication number: 20080029884
    Abstract: Multichip devices and methods of making the same. In one embodiment, a chip stack is sandwiched between first and second redistribution substrates. The chip stack is electrically connected to contact structures of the first redistribution substrate and the second redistribution substrate.
    Type: Application
    Filed: August 3, 2006
    Publication date: February 7, 2008
    Inventors: Juergen Grafe, Kimyung Yoon, Peter Poechmueller, Andre Hanke
  • Patent number: 7317768
    Abstract: The invention relates to a demodulator and also a demodulation method and enables a reliable demodulation even when the intermediate frequency range overlaps the range of the data frequencies of the signal. For this purpose, a rapidly oscillating output signal is generated from the in-phase signal and also the quadrature signal, the sign of which output signal varies in a manner dependent on the product of the signs of the in-phase signal and of the quadrature signal. Either an XOR gate or a multiplier stage may be used in order to generate an output signal of this type.
    Type: Grant
    Filed: June 7, 2002
    Date of Patent: January 8, 2008
    Assignee: Infineon Technologies AG
    Inventors: Christian Grewing, Markus Hammes, André Hanke, Stefan Van Waasen