Abstract: In embodiments, a package assembly may include an application-specific integrated circuit (ASIC) and a microelectromechanical system (MEMS) having an active side and an inactive side. In embodiments, the MEMS may be coupled directly to the ASIC by way of one or more interconnects. The MEMS, ASIC, and one or more interconnects may define or form a cavity such that the active portion of the MEMS is within the cavity. In some embodiments, the package assembly may include a plurality of MEMS coupled directly to the ASIC by way of a plurality of one or more interconnects. Other embodiments may be described and/or claimed.

Abstract: Apparatus and methods are provided for wireless communications between integrated circuits or integrated circuit dies of an electronic system. In an example, an apparatus can include a first integrated circuit die including a plurality of integrated circuit devices, a second integrated circuit die including a second plurality of integrated circuit devices, and a conductor device configured to wirelessly receive a signal from the first integrated circuit die, to conduct the signal from a first end of an electrical conductor of the conductor device to a second end of the electrical conductor, and to wirelessly transmit the signal to the second integrated circuit die from the second end of the electrical conductor.

Abstract: In embodiments, a package assembly may include an application-specific integrated circuit (ASIC) and a microelectromechanical system (MEMS) having an active side and an inactive side. In embodiments, the MEMS may be coupled directly to the ASIC by way of one or more interconnects. The MEMS, ASIC, and one or more interconnects may define or form a cavity such that the active portion of the MEMS is within the cavity. In some embodiments, the package assembly may include a plurality of MEMS coupled directly to the ASIC by way of a plurality of one or more interconnects. Other embodiments may be described and/or claimed.

Abstract: Stress buffer layers for integrated microelectromechanical systems (MEMS) are described. For example, a semiconductor package includes a substrate having first and second surfaces, the second surface having an array of external conductive contacts. A microelectromechanical system (MEMS) component is disposed above the first surface of the substrate. A buffer layer is disposed above the MEMS component, the buffer layer having a first Young's modulus. A mold compound is disposed above the buffer layer, the mold compound having a second Young's modulus higher than the first Young's modulus.

Abstract: In embodiments, a package assembly may include an application-specific integrated circuit (ASIC) and a microelectromechanical system (MEMS) having an active side and an inactive side. In embodiments, the MEMS may be coupled directly to the ASIC by way of one or more interconnects. The MEMS, ASIC, and one or more interconnects may define or form a cavity such that the active portion of the MEMS is within the cavity. In some embodiments, the package assembly may include a plurality of MEMS coupled directly to the ASIC by way of a plurality of one or more interconnects. Other embodiments may be described and/or claimed.

Abstract: Stress buffer layers for integrated microelectromechanical systems (MEMS) are described. For example, a semiconductor package includes a substrate having first and second surfaces, the second surface having an array of external conductive contacts. A microelectromechanical system (MEMS) component is disposed above the first surface of the substrate. A buffer layer is disposed above the MEMS component, the buffer layer having a first Young's modulus. A mold compound is disposed above the buffer layer, the mold compound having a second Young's modulus higher than the first Young's modulus.

Abstract: Stress buffer layers for integrated microelectromechanical systems (MEMS) are described. For example, a semiconductor package includes a substrate having first and second surfaces, the second surface having an array of external conductive contacts. A microelectromechanical system (MEMS) component is disposed above the first surface of the substrate. A buffer layer is disposed above the MEMS component, the buffer layer having a first Young's modulus. A mold compound is disposed above the buffer layer, the mold compound having a second Young's modulus higher than the first Young's modulus.

Abstract: Stress buffer layers for integrated microelectromechanical systems (MEMS) are described. For example, a semiconductor package includes a substrate having first and second surfaces, the second surface having an array of external conductive contacts. A microelectromechanical system (MEMS) component is disposed above the first surface of the substrate. A buffer layer is disposed above the MEMS component, the buffer layer having a first Young's modulus. A mold compound is disposed above the buffer layer, the mold compound having a second Young's modulus higher than the first Young's modulus.

Abstract: A chip arrangement may include: a mold compound; and a microelectromechanical systems device at least partially embedded in the mold compound.

Abstract: A chip arrangement may include: a first chip including a first contact, a second contact, and a redistribution structure electrically coupling the first contact to the second contact; a second chip including a contact; and a plurality of interconnects electrically coupled to the second contact of the first chip, wherein at least one interconnect of the plurality of interconnects electrically couples the second contact of the first chip to the contact of the second chip.

Abstract: A chip arrangement may include: a first chip including a first contact, a second contact, and a redistribution structure electrically coupling the first contact to the second contact; a second chip including a contact; and a plurality of interconnects electrically coupled to the second contact of the first chip, wherein at least one interconnect of the plurality of interconnects electrically couples the second contact of the first chip to the contact of the second chip.

Abstract: A semiconductor device includes: a semiconductor chip; an extension layer extending laterally from a boundary of the semiconductor chip; a redistribution layer disposed over at least one side of the extension layer and the semiconductor chip, wherein the redistribution layer electrically couples at least one contact of the semiconductor chip to at least one contact of an interface, wherein at least a part of the interface extends laterally beyond the boundary of the semiconductor chip.

Abstract: A dual gate drain extension field effect transistor assembly comprises a first FET device having a source, a gate and a drain extension region. The first FET device's gate is electrically coupled to a constant voltage source. A second FET device has a source, a drain, and a gate, and the second FET's drain is electrically to the first FET's source.

Abstract: In a recording and/or reproducing apparatus (1) having a stationarily mounted and substantially rigid first component part (37) and having at least one pin-like second component part (51, 52) and having a third component part (53) which is movable with respect to the at least one second component part (51, 52), the at least one second component part is fixedly connected to a damping element support (80) and the damping element support (80) extends over the first component part (37) and the damping element support (80) is connected to an elastic damping element (88) which acts upon the first component part (37) under spring load.

Abstract: A MIM capacitor (52) comprising a bottom plate (26), a capacitor dielectric (30) and a top plate (46). The capacitor bottom plate (26) is formed within an insulating layer (20) for a contact via (32) layer. The capacitor top plate (46) is formed within an insulating layer (34) of a metallization layer. The MIM capacitor (52) may be fabricated without the use of additional processes and patterning masks.

Abstract: A recording and/or reproducing device. A cassette, which contains a magnetic tape and a coupling element connected to the magnetic tape, can be loaded into the device. The device includes a pull-out element which can be coupled to the coupling element so as to form a pull-out assembly. The pull-out assembly can be moved to the reel hub of a take-up reel. A radial positioning structure is provided between the reel hub and the pull-out assembly. The radial positioning structure is formed by two projecting portions, of which a first projecting portion projects from the reel hub and the second projecting portion projects from the pull-out assembly.

Abstract: A recording and/or reproducing device that includes a cassette with a magnetic tape accommodated therein and a coupling element connected to the magnetic tape that can be loaded into the device. The device also includes a pull-out element which can be coupled to the coupling element to form a pull-out assembly. The pull-out assembly can be guided to the reel hub of a take-up reel along a guiding path. The device has a first guide and the coupling element has a second guide for guiding the pull-out assembly.

Abstract: In a recording and/or reproducing apparatus (1) having a stationarily mounted and substantially rigid first component part (37) and having at least one pin-like second component part (51, 52) and having a third component part (53) which is movable with respect to the at least one second component part (51, 52) the at least one second component part is fixedly connected to a damping element support (80) and the damping element support (80) extends over the first component part (37) and the damping element support (80) is connected to an elastic damping element (88) which acts upon the first component part (37) under spring load.

Abstract: Foldable object such as information carrier, container or the like, having two wings (1, 2) which can be folded and unfolded about a swing line (3), whereby wing surfaces (4, 5) are provided which fold down between the wings during folding and fold out from between them when the wings are unfolded and the object consists mainly of a shape having projecting and recessed fold lines, so that by folding the wings (1, 2) the wing surfaces (4, 5) can be arranged between the wings and that after unfolding the wings the shape forms an essentially flat surface, the shape having two main fold lines (6, 7) whose intersection point (8) lies on the swing line (3) of the two wings and whereby starting from the each intersection point (25) of the longitudinal fold lines (23, 24) with the main fold lines (6, 7), perpendicularly to the longitudinal fold lines (23, 24), recessed fold lines (26) parallel to the transverse fold line (16) are provided, characterized in that respectively parallel to the longitudinal fold lines (23