Abstract: A system can receive a measurement from a sensing glove utilized to perform a task with an object. The measurement may be based on digital outputs of force sensor arrays and digital outputs of motion sensors, including a force sensor array and a motion sensor corresponding to each of a plurality of finger sections of fingers of the sensing glove. The system can generate feedback based on a comparison between the measurement and a primary measurement from a primary sensing glove utilized to perform the task with the object. The primary measurement may be based on digital outputs of force sensor arrays and digital outputs of motion sensors of the primary sensing glove that correspond to digital outputs of the sensing glove. Other aspects are also described and claimed.

Abstract: A wearable device may include an article configured to be worn by a user and a sensor array coupled with the article. The sensor array may be configured to obtain force data, among other data. A system can receive information generated by the wearable device utilized to perform a task. The information may include motion data indicating a motion of the wearable device and the force data indicating a force applied to the wearable device. The force data may be obtained from the sensor array generating digital outputs. The system can control a robotic device to perform a robotic motion based on the motion data and apply a robotic force based on the force data to repeat the task. The robotic device may include a sensor array to determine a force applied to the robotic device for controlling the robotic force. Other aspects are also described and claimed.

Abstract: A system can receive a measurement from a sensing glove utilized to perform a task with an object. The measurement may be based on digital outputs of force sensor arrays and digital outputs of motion sensors, including a force sensor array and a motion sensor corresponding to each of a plurality of finger sections of fingers of the sensing glove. The system can generate feedback based on a comparison between the measurement and a primary measurement from a primary sensing glove utilized to perform the task with the object. The primary measurement may be based on digital outputs of force sensor arrays and digital outputs of motion sensors of the primary sensing glove that correspond to digital outputs of the sensing glove. Other aspects are also described and claimed.

Abstract: Embedded sensor structures and stretchable embedded sensor films including a plurality of embedded sensor packages are described. An embedded sensor structure may include a sensor package including an integrated circuit (IC) die and sensor die bonded to a front side of the IC die, with the sensor die including a diaphragm that is deflectable toward a cavity. A planarization layer laterally surrounds the sensor package, and metal routing is formed on a top side of the sensor die and spanning over the planarization layer. Other aspects are also described and claimed.

Abstract: Sensor assemblies, sensor array transfer sequences, and methods of assembly are described. The sensors can include sensor dies as well as sensor packages including stacked sensor dies and IC dies.

Abstract: A system for a robotic finger may include a base coupled with a robotic finger having a plurality of joints and an actuation system that actuates the plurality of joints. The actuation system may include a first actuator that drives a connection coupled with a first joint of the plurality of joints. Driving the connection can cause a first rotation of the robotic finger about a first axis. The actuation system may also include a second actuator that drives a cylinder coupled with the first joint. Driving the cylinder can cause a second rotation of the robotic finger about a second axis. The cylinder can rotate freely about the first axis to enable the first rotation. Other aspects are also described and claimed.

Abstract: Embedded sensor structures and stretchable embedded sensor films including a plurality of embedded sensor packages are described. An embedded sensor structure may include a sensor package including an integrated circuit (IC) die and sensor die bonded to a front side of the IC die, with the sensor die including a diaphragm that is deflectable toward a cavity. A planarization layer laterally surrounds the sensor package, and metal routing is formed on a top side of the sensor die and spanning over the planarization layer. Other aspects are also described and claimed.

Abstract: A deformable sensor array may include a plurality of sensors and a flexible substrate. Each sensor of the plurality of sensors may include a sensor die to generate an analog signal and an converter die to perform analog-to-digital conversion (ADC) of the analog signal to generate a digital output. The flexible substrate may include electrical interconnect coupled with the plurality of sensors, and strain relief cutouts between sensors of the plurality of sensors and between the electrical interconnect, to enable deformation of the plurality of sensors. Other aspects are also described and claimed.

Abstract: A sensor array may include a plurality of sensors coupled with a flexible substrate. Each sensor may include a sensor die that generates an analog signal based on sensing, and a converter die that performs analog-to-digital conversion (ADC) of the analog signal to generate a digital output. The flexible substrate may include electrical interconnect to transmit digital outputs from sensors of the plurality of sensors. The flexible substrate may include strain relief cutouts between the sensors to enable deformation of the sensor array. Other aspects are also described and claimed.

Abstract: A sensing system may include a sensor array comprised of a plurality of sensors coupled with a flexible circuit. Each sensor may include a sensing element and an analog-to-digital converter die coupled with the sensing element. The sensing element may include a sensor area coupled with a sensor die to generate an analog output based on sensing, and the analog-to-digital converter die may include circuitry to perform analog-to-digital conversion of the analog output to generate a digital output. The sensing system may further include a controller connected to the sensor array. The controller can cause a sensor of the sensor array to transmit a digital output that indicates sensing by the sensor in response to receiving a digital input. Other aspects are also described and claimed.

Abstract: Reflective bank structures for light emitting devices are described. The reflective bank structure may include a substrate, an insulating layer on the substrate, and an array of bank openings in the insulating layer with each bank opening including a bottom surface and sidewalls. A reflective layer spans sidewalls of each of the bank openings in the insulating layer.

Abstract: A wearable device may include an article configured to be worn by a user and a sensor array coupled with the article. The sensor array may be configured to obtain force data, among other data. A system can receive information generated by the wearable device utilized to perform a task. The information may include motion data indicating a motion of the wearable device and the force data indicating a force applied to the wearable device. The force data may be obtained from the sensor array generating digital outputs. The system can control a robotic device to perform a robotic motion based on the motion data and apply a robotic force based on the force data to repeat the task. The robotic device may include a sensor array to determine a force applied to the robotic device for controlling the robotic force. Other aspects are also described and claimed.

Abstract: A micro light emitting diode (LED) and a method of forming an array of micro LEDs for transfer to a receiving substrate are described. The micro LED structure may include a micro p-n diode and a metallization layer, with the metallization layer between the micro p-n diode and a bonding layer. A conformal dielectric barrier layer may span sidewalls of the micro p-n diode. The micro LED structure and micro LED array may be picked up and transferred to a receiving substrate.

Abstract: A display module and system applications including a display module are described. The display module may include a display substrate including a front surface, a back surface, and a display area on the front surface. A plurality of interconnects extend through the display substrate from the front surface to the back surface. An array of light emitting diodes (LEDs) are in the display area and electrically connected with the plurality of interconnects, and one or more driver circuits are on the back surface of the display substrate. Exemplary system applications include wearable, rollable, and foldable displays.

Abstract: A light emitting assembly is described. In one embodiment, one or more light emitting diode (LED) devices and one or more microcontrollers are bonded to a same side of a substrate, with the one or more microcontrollers to switch and drive the one or more LED devices.

Abstract: A micro device transfer tool and methods of operation in which the micro device transfer tool includes an articulating transfer head assembly capable of six degrees of motion. A miniatured camera assembly may be secured near the point of contact for the articulating transfer head assembly to aid in system alignment. In an embodiment, an encoder system is included for alignment of a micro pick up array and target substrate using complementary concentric grating patterns. In an embodiment a miniaturized position sensor design is included for sensing position of various system components during alignment or pick and place processes.

Abstract: A wearable device may include an article configured to be worn by a user and a sensor array coupled with the article. The sensor array may be configured to obtain force data, among other data. A system can receive information generated by the wearable device utilized to perform a task. The information may include motion data indicating a motion of the wearable device and the force data indicating a force applied to the wearable device. The force data may be obtained from the sensor array generating digital outputs. The system can control a robotic device to perform a robotic motion based on the motion data and apply a robotic force based on the force data to repeat the task. The robotic device may include a sensor array to determine a force applied to the robotic device for controlling the robotic force. Other aspects are also described and claimed.

Abstract: Light emitting devices and methods of integrating micro LED devices into light emitting device are described. In an embodiment a light emitting device includes a reflective bank structure within a bank layer, and a conductive line atop the bank layer and elevated above the reflective bank structure. A micro LED device is within the reflective bank structure and a passivation layer is over the bank layer and laterally around the micro LED device within the reflective bank structure. A portion of the micro LED device and a conductive line atop the bank layer protrude above a top surface of the passivation layer.

Abstract: A display module and system applications including a display module are described. The display module may include a display substrate including a front surface, a back surface, and a display area on the front surface. A plurality of interconnects extend through the display substrate from the front surface to the back surface. An array of light emitting diodes (LEDs) are in the display area and electrically connected with the plurality of interconnects, and one or more driver circuits are on the back surface of the display substrate. Exemplary system applications include wearable, rollable, and foldable displays.

Abstract: A method and structure for receiving a micro device on a receiving substrate are disclosed. A micro device such as a micro LED device is punched-through a passivation layer covering a conductive layer on the receiving substrate, and the passivation layer is hardened. In an embodiment the micro LED device is punched-through a B-staged thermoset material. In an embodiment the micro LED device is punched-through a thermoplastic material.