Patents by Inventor Andreas Bibl

Andreas Bibl has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11107208
    Abstract: An optical verification method and mass transfer system described. In an embodiments, a mass transfer sequence may be accompanied by optical imaging and inspection to detect pick and place errors. The optical imaging and inspection techniques may be performed in-situ.
    Type: Grant
    Filed: September 24, 2019
    Date of Patent: August 31, 2021
    Inventors: Patrick J. Czarnota, Paul Argus Parks, Nile A. Light, Stephen P. Bathurst, John H. Higginson, Stephen R. Deming, Robert B. Martin, Tsan Y. Chan, Andreas Bibl
  • Publication number: 20210265330
    Abstract: A display module and system applications including a display module are described. The display module may include a display substrate including a front surface, a back surface, and a display area on the front surface. A plurality of interconnects extend through the display substrate from the front surface to the back surface. An array of light emitting diodes (LEDs) are in the display area and electrically connected with the plurality of interconnects, and one or more driver circuits are on the back surface of the display substrate. Exemplary system applications include wearable, rollable, and foldable displays.
    Type: Application
    Filed: February 19, 2021
    Publication date: August 26, 2021
    Inventors: Andreas Bibl, Kapil V. Sakariya, Vikram Pavate
  • Patent number: 11101405
    Abstract: Methods and structures for forming arrays of LED devices are disclosed. The LED devices in accordance with embodiments of the invention may include an internally confined current injection area to reduce non-radiative recombination due to edge effects. Several manners for confining current may include etch removal of a current distribution layer, etch removal of a current distribution layer and active layer followed by mesa re-growth, isolation by ion implant or diffusion, quantum well intermixing, and oxide isolation.
    Type: Grant
    Filed: February 6, 2020
    Date of Patent: August 24, 2021
    Assignee: Apple Inc.
    Inventors: Kelly McGroddy, Hsin-Hua Hu, Andreas Bibl, Clayton Ka Tsun Chan, Daniel Arthur Haeger
  • Publication number: 20210257572
    Abstract: A display panel and method of manufacture are described. In an embodiment, a display substrate includes a pixel area and a non-pixel area. An array of subpixels and corresponding array of bottom electrodes are in the pixel area. An array of micro LED devices are bonded to the array of bottom electrodes. One or more top electrode layers are formed in electrical contact with the array of micro LED devices. In one embodiment a redundant pair of micro LED devices are bonded to the array of bottom electrodes. In one embodiment, the array of micro LED devices are imaged to detect irregularities.
    Type: Application
    Filed: February 26, 2021
    Publication date: August 19, 2021
    Inventors: Andreas Bibl, Kapil V. Sakariya, Charles R. Griggs, James Michael Perkins
  • Patent number: 11011390
    Abstract: A method and structure for stabilizing an array of micro devices is disclosed. The array of micro devices is formed on an array of stabilization posts formed from a thermoset material. Each micro device includes a bottom surface that is wider than a corresponding stabilization post directly underneath the bottom surface.
    Type: Grant
    Filed: August 20, 2019
    Date of Patent: May 18, 2021
    Assignee: Apple Inc.
    Inventors: Hsin-Hua Hu, Andreas Bibl, John A. Higginson
  • Patent number: 11004836
    Abstract: Light emitting devices and methods of integrating micro LED devices into light emitting device are described. In an embodiment a light emitting device includes a reflective bank structure within a bank layer, and a conductive line atop the bank layer and elevated above the reflective bank structure. A micro LED device is within the reflective bank structure and a passivation layer is over the bank layer and laterally around the micro LED device within the reflective bank structure. A portion of the micro LED device and a conductive line atop the bank layer protrude above a top surface of the passivation layer.
    Type: Grant
    Filed: January 21, 2020
    Date of Patent: May 11, 2021
    Assignee: Apple Inc.
    Inventors: Andreas Bibl, Charles R. Griggs
  • Patent number: 10964900
    Abstract: A display panel and method of manufacture are described. In an embodiment, a display substrate includes a pixel area and a non-pixel area. An array of subpixels and corresponding array of bottom electrodes are in the pixel area. An array of micro LED devices are bonded to the array of bottom electrodes. One or more top electrode layers are formed in electrical contact with the array of micro LED devices. In one embodiment a redundant pair of micro LED devices are bonded to the array of bottom electrodes. In one embodiment, the array of micro LED devices are imaged to detect irregularities.
    Type: Grant
    Filed: August 1, 2019
    Date of Patent: March 30, 2021
    Assignee: Apple Inc.
    Inventors: Andreas Bibl, Kapil V. Sakariya, Charles R. Griggs, James Michael Perkins
  • Patent number: 10957678
    Abstract: A display module and system applications including a display module are described. The display module may include a display substrate including a front surface, a back surface, and a display area on the front surface. A plurality of interconnects extend through the display substrate from the front surface to the back surface. An array of light emitting diodes (LEDs) are in the display area and electrically connected with the plurality of interconnects, and one or more driver circuits are on the back surface of the display substrate. Exemplary system applications include wearable, rollable, and foldable displays.
    Type: Grant
    Filed: November 19, 2019
    Date of Patent: March 23, 2021
    Assignee: Apple Inc.
    Inventors: Andreas Bibl, Kapil V. Sakariya, Vikram Pavate
  • Publication number: 20210050337
    Abstract: A method and structure for receiving a micro device on a receiving substrate are disclosed. A micro device such as a micro LED device is punched-through a passivation layer covering a conductive layer on the receiving substrate, and the passivation layer is hardened. In an embodiment the micro LED device is punched-through a B-staged thermoset material. In an embodiment the micro LED device is punched-through a thermoplastic material.
    Type: Application
    Filed: October 16, 2020
    Publication date: February 18, 2021
    Inventors: John A. Higginson, Andreas Bibl, Hsin-Hua Hu
  • Patent number: 10923023
    Abstract: Hybrid chiplets, display backplanes, and displays with integrated hybrid chiplets are described. In an embodiment, a hybrid chiplet includes a micro LED chiplet stacked on a micro driver chiplet that includes at least one drive transistor and a bottom side including a plurality of bottom chiplet contacts for electrical connection with a display backplane.
    Type: Grant
    Filed: December 15, 2016
    Date of Patent: February 16, 2021
    Inventors: Andreas Bibl, Xia Li, John A. Higginson, Vaibhav D. Patel, Kapil V. Sakariya, Imran Hashim, Tore Nauta, Thomas Charisoulis
  • Publication number: 20210028153
    Abstract: Reflective bank structures for light emitting devices are described. The reflective bank structure may include a substrate, an insulating layer on the substrate, and an array of bank openings in the insulating layer with each bank opening including a bottom surface and sidewalls. A reflective layer spans sidewalls of each of the bank openings in the insulating layer.
    Type: Application
    Filed: August 20, 2020
    Publication date: January 28, 2021
    Inventors: Kapil V. Sakariya, Andreas Bibl, Hsin-Hua Hu
  • Publication number: 20210020122
    Abstract: A light emitting assembly is described. In one embodiment, one or more light emitting diode (LED) devices and one or more microcontrollers are bonded to a same side of a substrate, with the one or more microcontrollers to switch and drive the one or more LED devices.
    Type: Application
    Filed: October 5, 2020
    Publication date: January 21, 2021
    Inventors: Kapil V. Sakariya, Andreas Bibl, Kelly McGroddy
  • Patent number: 10833058
    Abstract: A method and structure for receiving a micro device on a receiving substrate are disclosed. A micro device such as a micro LED device is punched-through a passivation layer covering a conductive layer on the receiving substrate, and the passivation layer is hardened. In an embodiment the micro LED device is punched-through a B-staged thermoset material. In an embodiment the micro LED device is punched-through a thermoplastic material.
    Type: Grant
    Filed: November 19, 2019
    Date of Patent: November 10, 2020
    Assignee: Apple Inc.
    Inventors: John A. Higginson, Andreas Bibl, Hsin-Hua Hu
  • Patent number: 10814496
    Abstract: Structures and methods to actively control the shape of a micro pickup array (MPA) during micro device transfer are described. In an embodiment, a strain is applied to the MPA counteractive to strain arising during micro device transfer operations. For example, strain may be applied by a piezoelectric actuator element bonded to a back side of the base substrate to control a curvature of base substrate, and by extension the MPA.
    Type: Grant
    Filed: December 12, 2017
    Date of Patent: October 27, 2020
    Inventors: Andreas Bibl, Paul A. Parks, Stephen P. Bathurst, Jon A. Williams, John A. Higginson, Shenshen Zhao
  • Publication number: 20200316940
    Abstract: A fluid ejector includes a fluid ejection module having a substrate and a layer separate from the substrate. The substrate includes a plurality of fluid ejection elements arranged in a matrix, each fluid ejection element configured to cause a fluid to be ejected from a nozzle. The layer separate from the substrate includes a plurality of electrical connections, each electrical connection adjacent to a corresponding fluid ejection element.
    Type: Application
    Filed: May 4, 2020
    Publication date: October 8, 2020
    Inventors: Andreas Bibl, Kevin von Essen, Paul A. Hoisington
  • Patent number: 10796648
    Abstract: A light emitting assembly is described. In one embodiment, one or more light emitting diode (LED) devices and one or more microcontrollers are bonded to a same side of a substrate, with the one or more microcontrollers to switch and drive the one or more LED devices.
    Type: Grant
    Filed: July 15, 2019
    Date of Patent: October 6, 2020
    Assignee: Apple Inc.
    Inventors: Kapil V. Sakariya, Andreas Bibl, Kelly McGroddy
  • Publication number: 20200312824
    Abstract: Display panels and methods of manufacture are described for down converting a peak emission wavelength of a pump LED within a subpixel with a quantum dot layer. In some embodiments, pump LEDs with a peak emission wavelength below 500 nm, such as between 340 nm and 420 nm are used. QD layers in accordance with embodiments can be integrated into a variety of display panel structures including a wavelength conversion cover arrangement, QD patch arrangement, or QD layers patterned on the display substrate.
    Type: Application
    Filed: April 28, 2020
    Publication date: October 1, 2020
    Inventors: Jonathan S. Steckel, Jean-Jacques P. Drolet, Roland Van Gelder, Kelly C. McGroddy, Ion Bita, James Michael Perkins, Andreas Bibl, Sajjad A. Khan, James E. Pedder, Elmar Gehlen
  • Patent number: 10784236
    Abstract: Reflective bank structures for light emitting devices are described. The reflective bank structure may include a substrate, an insulating layer on the substrate, and an array of bank openings in the insulating layer with each bank opening including a bottom surface and sidewalls. A reflective layer spans sidewalls of each of the bank openings in the insulating layer.
    Type: Grant
    Filed: July 6, 2018
    Date of Patent: September 22, 2020
    Assignee: Apple Inc.
    Inventors: Kapil V. Sakariya, Andreas Bibl, Hsin-Hua Hu
  • Publication number: 20200251614
    Abstract: Methods and structures for forming arrays of LED devices are disclosed. The LED devices in accordance with embodiments of the invention may include an internally confined current injection area to reduce non-radiative recombination due to edge effects. Several manners for confining current may include etch removal of a current distribution layer, etch removal of a current distribution layer and active layer followed by mesa re-growth, isolation by ion implant or diffusion, quantum well intermixing, and oxide isolation.
    Type: Application
    Filed: February 6, 2020
    Publication date: August 6, 2020
    Inventors: Kelly McGroddy, Hsin-Hua Hu, Andreas Bibl, Clayton Ka Tsun Chan, Daniel Arthur Haeger
  • Patent number: 10734269
    Abstract: Metal-to-metal adhesion joints are described as a manner to hold down micro devices to a carrier substrate within the context of a micro device transfer manufacturing process. In accordance with embodiments, the metal-to-metal adhesion joints must be broken in order to pick up the micro devices from a carrier substrate, resulting in micro devices with nubs protruding from bottom contacts of the micro devices. Once integrated, the micro devices are bonded to a receiving substrate, the nubs may be embedded in a metallic joint, or alternatively be diffused within the metallic joint as interstitial metallic material that is embedded within the metallic joint.
    Type: Grant
    Filed: March 7, 2018
    Date of Patent: August 4, 2020
    Inventors: Dariusz Golda, James M. Perkins, Andreas Bibl, Sumant Sood, Hyeun-Su Kim