Patents by Inventor Andreas Bibl

Andreas Bibl has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Micro device stabilization post
    Patent number: 10424493
    Abstract: A method and structure for stabilizing an array of micro devices is disclosed. The array of micro devices is formed on an array of stabilization posts formed from a thermoset material. Each micro device includes a bottom surface that is wider than a corresponding stabilization post directly underneath the bottom surface.
    Type: Grant
    Filed: February 28, 2017
    Date of Patent: September 24, 2019
    Assignee: Apple Inc.
    Inventors: Hsin-Hua Hu, Andreas Bibl, John A. Higginson
  • Light emitting diode display with redundancy scheme
    Patent number: 10411210
    Abstract: A display panel and method of manufacture are described. In an embodiment, a display substrate includes a pixel area and a non-pixel area. An array of subpixels and corresponding array of bottom electrodes are in the pixel area. An array of micro LED devices are bonded to the array of bottom electrodes. One or more top electrode layers are formed in electrical contact with the array of micro LED devices. In one embodiment a redundant pair of micro LED devices are bonded to the array of bottom electrodes. In one embodiment, the array of micro LED devices are imaged to detect irregularities.
    Type: Grant
    Filed: November 30, 2017
    Date of Patent: September 10, 2019
    Assignee: Apple Inc.
    Inventors: Andreas Bibl, Kapil V. Sakariya, Charles R. Griggs, James Michael Perkins
  • DISPLAY AND MICRO DEVICE ARRAY FOR TRANSFER TO A DISPLAY SUBSTRATE
    Publication number: 20190259907
    Abstract: A micro light emitting diode (LED) and a method of forming an array of micro LEDs for transfer to a receiving substrate are described. The micro LED structure may include a micro p-n diode and a metallization layer, with the metallization layer between the micro p-n diode and a bonding layer. A conformal dielectric barrier layer may span sidewalls of the micro p-n diode. The micro LED structure and micro LED array may be picked up and transferred to a receiving substrate.
    Type: Application
    Filed: April 30, 2019
    Publication date: August 22, 2019
    Inventors: Andreas Bibl, John A. Higginson, Hung-Fai Stephen Law, Hsin-Hua Hu
  • METHOD FOR INTEGRATING A LIGHT EMITTING DEVICE
    Publication number: 20190259739
    Abstract: Light emitting devices and methods of integrating micro LED devices into light emitting device are described. In an embodiment a light emitting device includes a reflective bank structure within a bank layer, and a conductive line atop the bank layer and elevated above the reflective bank structure. A micro LED device is within the reflective bank structure and a passivation layer is over the bank layer and laterally around the micro LED device within the reflective bank structure. A portion of the micro LED device and a conductive line atop the bank layer protrude above a top surface of the passivation layer.
    Type: Application
    Filed: February 25, 2019
    Publication date: August 22, 2019
    Inventors: Andreas Bibl, Charles R. Griggs
  • Smart pixel lighting and display microcontroller
    Patent number: 10380952
    Abstract: A light emitting assembly is described. In one embodiment, one or more light emitting diode (LED) devices and one or more microcontrollers are bonded to a same side of a substrate, with the one or more microcontrollers to switch and drive the one or more LED devices.
    Type: Grant
    Filed: February 28, 2018
    Date of Patent: August 13, 2019
    Assignee: Apple Inc.
    Inventors: Kapil V. Sakariya, Andreas Bibl, Kelly McGroddy
  • LIGHT EMITTING STRUCTURE TO AID LED LIGHT EXTRACTION
    Publication number: 20190237444
    Abstract: Display panels and methods of manufacture are described for down converting a peak emission wavelength of a pump LED within a subpixel with a quantum dot layer. In some embodiments, pump LEDs with a peak emission wavelength below 500 nm, such as between 340 nm and 420 nm are used. QD layers in accordance with embodiments can be integrated into a variety of display panel structures including a wavelength conversion cover arrangement, QD patch arrangement, or QD layers patterned on the display substrate.
    Type: Application
    Filed: April 4, 2019
    Publication date: August 1, 2019
    Inventors: Jonathan S. Steckel, Jean-Jacques P. Drolet, Roland Van Gelder, Kelly C. McGroddy, Ion Bita, James Michael Perkins, Andreas Bibl, Sajjad A. Khan, James E. Pedder, Elmar Gehlen
  • Quantum dot integration schemes
    Patent number: 10297581
    Abstract: Display panels and methods of manufacture are described for down converting a peak emission wavelength of a pump LED within a subpixel with a quantum dot layer. In some embodiments, pump LEDs with a peak emission wavelength below 500 nm, such as between 340 nm and 420 nm are used. QD layers in accordance with embodiments can be integrated into a variety of display panel structures including a wavelength conversion cover arrangement, QD patch arrangement, or QD layers patterned on the display substrate.
    Type: Grant
    Filed: July 5, 2016
    Date of Patent: May 21, 2019
    Assignee: Apple Inc.
    Inventors: Jonathan S. Steckel, Jean-Jacques P. Drolet, Roland van Gelder, Kelly C. McGroddy, Ion Bita, James Michael Perkins, Andreas Bibl, Sajjad A. Khan, James E. Pedder, Elmar Gehlen
  • Micro LED display
    Patent number: 10297712
    Abstract: A micro light emitting diode (LED) and a method of forming an array of micro LEDs for transfer to a receiving substrate are described. The micro LED structure may include a micro p-n diode and a metallization layer, with the metallization layer between the micro p-n diode and a bonding layer. A conformal dielectric barrier layer may span sidewalls of the micro p-n diode. The micro LED structure and micro LED array may be picked up and transferred to a receiving substrate.
    Type: Grant
    Filed: June 23, 2014
    Date of Patent: May 21, 2019
    Assignee: Apple Inc.
    Inventors: Andreas Bibl, John A. Higginson, Hung-Fai Stephen Law, Hsin-Hua Hu
  • Wearable display having an array of LEDs on a conformable silicon substrate
    Patent number: 10290774
    Abstract: A conformable electronic device and methods for forming such devices are described. Embodiments of a conformable electronic device may include a silicon substrate having a thickness of 50 ?m or less. An array of LEDs that are electrically coupled to a controller chip may be formed on a surface of the silicon substrate. In an embodiment, a top passivation layer is formed over the array of LEDs, the one or more controller chips, and the top surface of the silicon substrate. An embodiment also includes a bottom passivation layer formed on a bottom surface of the silicon substrate.
    Type: Grant
    Filed: October 20, 2016
    Date of Patent: May 14, 2019
    Assignee: Apple Inc.
    Inventors: Hsin-Hua Hu, Andreas Bibl
  • LIGHT EMITTING STRUCTURE
    Publication number: 20190123032
    Abstract: A method and structure for receiving a micro device on a receiving substrate are disclosed. A micro device such as a micro LED device is punched-through a passivation layer covering a conductive layer on the receiving substrate, and the passivation layer is hardened. In an embodiment the micro LED device is punched-through a B-staged thermoset material. In an embodiment the micro LED device is punched-through a thermoplastic material.
    Type: Application
    Filed: December 13, 2018
    Publication date: April 25, 2019
    Inventors: John A. Higginson, Andreas Bibl, Hsin-Hua Hu
  • Method for integrating a light emitting device
    Patent number: 10256221
    Abstract: Light emitting devices and methods of integrating micro LED devices into light emitting device are described. In an embodiment a light emitting device includes a reflective bank structure within a bank layer, and a conductive line atop the bank layer and elevated above the reflective bank structure. A micro LED device is within the reflective bank structure and a passivation layer is over the bank layer and laterally around the micro LED device within the reflective bank structure. A portion of the micro LED device and a conductive line atop the bank layer protrude above a top surface of the passivation layer.
    Type: Grant
    Filed: December 21, 2017
    Date of Patent: April 9, 2019
    Assignee: Apple Inc.
    Inventors: Andreas Bibl, Charles R. Griggs
  • MICRO DEVICE TRANSFER HEAD HEATER ASSEMBLY AND METHOD OF TRANSFERRING A MICRO DEVICE
    Publication number: 20190096846
    Abstract: A method of transferring a micro device and an array of micro devices are disclosed. A carrier substrate carrying a micro device connected to a bonding layer is heated to a temperature below a liquidus temperature of the bonding layer, and a transfer head is heated to a temperature above the liquidus temperature of the bonding layer. Upon contacting the micro device with the transfer head, the heat from the transfer head transfers into the bonding layer to at least partially melt the bonding layer. A voltage applied to the transfer head creates a grip force which picks up the micro device from the carrier substrate.
    Type: Application
    Filed: August 30, 2018
    Publication date: March 28, 2019
    Inventors: Andreas Bibl, John A. Higginson, Hung-Fai Stephen Law, Hsin-Hua Hu
  • DISPLAY MODULE AND SYSTEM APPLICATIONS
    Publication number: 20190043845
    Abstract: A display module and system applications including a display module are described. The display module may include a display substrate including a front surface, a back surface, and a display area on the front surface. A plurality of interconnects extend through the display substrate from the front surface to the back surface. An array of light emitting diodes (LEDs) are in the display area and electrically connected with the plurality of interconnects, and one or more driver circuits are on the back surface of the display substrate. Exemplary system applications include wearable, rollable, and foldable displays.
    Type: Application
    Filed: September 28, 2018
    Publication date: February 7, 2019
    Inventors: Andreas Bibl, Kapil V. Sakariya, Vikram Pavate
  • Light emitting structure
    Patent number: 10192858
    Abstract: A method and structure for receiving a micro device on a receiving substrate are disclosed. A micro device such as a micro LED device is punched-through a passivation layer covering a conductive layer on the receiving substrate, and the passivation layer is hardened. In an embodiment the micro LED device is punched-through a B-staged thermoset material. In an embodiment the micro LED device is punched-through a thermoplastic material.
    Type: Grant
    Filed: March 5, 2018
    Date of Patent: January 29, 2019
    Assignee: Apple Inc.
    Inventors: John A. Higginson, Andreas Bibl, Hsin-Hua Hu
  • Mass transfer tool manipulator assembly with remote center of compliance
    Patent number: 10183396
    Abstract: Systems and methods for transferring a micro device or an array of micro devices to or from a substrate are disclosed. In an embodiment, a remote center robot allows on-the-fly alignment between a micro pick up array and a target substrate. The remote center robot may include a plurality of symmetric linkages that move independently and share a remote rotational center. In an embodiment, the remote rotational center may be positioned at a surface of the micro pick up array to prevent damage to the array of micro devices during transfer.
    Type: Grant
    Filed: November 29, 2016
    Date of Patent: January 22, 2019
    Assignee: Apple Inc.
    Inventors: Paul Argus Parks, Nile Alexander Light, Stephen P. Bathurst, John A. Higginson, Andreas Bibl
  • Mass transfer tool
    Patent number: 10183401
    Abstract: Systems and methods for transferring a micro device from a carrier substrate are disclosed. In an embodiment, a mass transfer tool includes an articulating transfer head assembly, a carrier substrate holder, and an actuator assembly to adjust a spatial relationship between the articulating transfer head assembly and the carrier substrate holder. The articulating transfer head assembly may include an electrostatic voltage source connection and a substrate supporting an array of electrostatic transfer heads.
    Type: Grant
    Filed: September 30, 2016
    Date of Patent: January 22, 2019
    Assignee: Apple Inc.
    Inventors: John A. Higginson, Andreas Bibl, David Albertalli
  • LIGHT EMITTING DEVICE REFLECTIVE BANK STRUCTURE
    Publication number: 20180374831
    Abstract: Reflective bank structures for light emitting devices are described. The reflective bank structure may include a substrate, an insulating layer on the substrate, and an array of bank openings in the insulating layer with each bank opening including a bottom surface and sidewalls. A reflective layer spans sidewalls of each of the bank openings in the insulating layer.
    Type: Application
    Filed: July 6, 2018
    Publication date: December 27, 2018
    Inventors: Kapil V. Sakariya, Andreas Bibl, Hsin-Hua Hu
  • Display module and system applications
    Patent number: 10147711
    Abstract: A display module and system applications including a display module are described. The display module may include a display substrate including a front surface, a back surface, and a display area on the front surface. A plurality of interconnects extend through the display substrate from the front surface to the back surface. An array of light emitting diodes (LEDs) are in the display area and electrically connected with the plurality of interconnects, and one or more driver circuits are on the back surface of the display substrate. Exemplary system applications include wearable, rollable, and foldable displays.
    Type: Grant
    Filed: February 28, 2018
    Date of Patent: December 4, 2018
    Assignee: Apple Inc.
    Inventors: Andreas Bibl, Kapil V. Sakariya, Vikram Pavate
  • Micro device transfer head heater assembly and method of transferring a micro device
    Patent number: 10121864
    Abstract: A method of transferring a micro device and an array of micro devices are disclosed. A carrier substrate carrying a micro device connected to a bonding layer is heated to a temperature below a liquidus temperature of the bonding layer, and a transfer head is heated to a temperature above the liquidus temperature of the bonding layer. Upon contacting the micro device with the transfer head, the heat from the transfer head transfers into the bonding layer to at least partially melt the bonding layer. A voltage applied to the transfer head creates a grip force which picks up the micro device from the carrier substrate.
    Type: Grant
    Filed: September 30, 2016
    Date of Patent: November 6, 2018
    Assignee: Apple Inc.
    Inventors: Andreas Bibl, John A. Higginson, Hung-Fai Stephen Law, Hsin-Hua Hu
  • PIEZOELECTRIC TRANSDUCERS USING MICRO-DOME ARRAYS
    Publication number: 20180297080
    Abstract: An ultrasonic piezoelectric transducer device includes a transducer array consisting of an array of vibrating elements, and a base to which the array of vibrating elements in the transducer array are attached. The base include integrated electrical interconnects for carrying driving signals and sensed signals between the vibrating elements and an external control circuit. The base can be an ASIC wafer that includes integrated circuitry for controlling the driving and processing the sensed signals. The interconnects and control circuits in the base fit substantially within an area below the array of multiple vibrating elements.
    Type: Application
    Filed: June 20, 2018
    Publication date: October 18, 2018
    Applicant: FUJIFILM Dimatix, Inc.
    Inventors: Andreas Bibl, Hung-fai Stephen Law, Kevin von Essen, Mats G. Ottosson