Abstract: A method of assembling a wavelength division multiplexing (WDM) cassette for a fiber optic network is disclosed and includes attaching a first plurality of wavelength filters to a first cassette workpiece, attaching a second plurality of wavelength filters to a second cassette workpiece, organizing the optical fibers extending from the wavelength filters, adjusting a length of the optical fibers extending from wavelength filters, and forming an optical connection between the optical fibers from the wavelength filters via a mass fusion splice. The first cassette workpiece and the second cassette workpiece are separate from each during at least one of the attaching, organizing, adjusting, and forming steps. The optical fibers may have predetermined lengths for being arranged in a helix configuration and folded to produce an organized fiber stack that fits within the confines of the cassette. A WDM cassette having an organized arrangement of optical fibers is also disclosed.

Abstract: A method of assembling a wavelength division multiplexing (WDM) cassette for a fiber optic network is disclosed and includes attaching a first plurality of wavelength filters to a first cassette workpiece, attaching a second plurality of wavelength filters to a second cassette workpiece, organizing the optical fibers extending from the wavelength filters, adjusting a length of the optical fibers extending from wavelength filters, and forming an optical connection between the optical fibers from the wavelength filters via a mass fusion splice. The first cassette workpiece and the second cassette workpiece are separate from each during at least one of the attaching, organizing, adjusting, and forming steps. The optical fibers may have predetermined lengths for being arranged in a helix configuration and folded to produce an organized fiber stack that fits within the confines of the cassette. A WDM cassette having an organized arrangement of optical fibers is also disclosed.

Abstract: A system for laser welding a fiber to a substrate is provided. The system comprises a fiber having a first end, a substrate defining a surface, a coating, a laser configured to emit photonic energy, one or more processors, and memory. The memory includes computer readable code configured to, when executed, cause the processor(s) to perform various tasks. The tasks include positioning the fiber relative to the substrate so that the first end of the fiber is positioned proximate to the surface of the substrate with the coating positioned between the fiber and the substrate. The tasks also include positioning the laser relative to the fiber or the substrate. The tasks also include causing the laser to emit photonic energy through the fiber or through the substrate. Emission of the photonic energy through the fiber or through the substrate causes the fiber to be laser welded to the substrate.

Abstract: A redundant wavelength division multiplexing (WDM) device including a first common port which includes a collimator configured to transmit a first optical beam. The first beam includes a first plurality of optical signals. A second common port includes a collimator configured to transmit a second optical beam that includes a second plurality of optical signals. The second common port is spaced apart from the first common port and a plurality of filters define an optical path for each of the first optical beam and the second optical beam. Each filter is oriented to interact with each of the first optical beam and the second optical beam. A method of processing light includes transmitting one of the first optical signals of a first wavelength through a first filter and transmitting one of the second optical signals of the first wavelength through the first filter.

Abstract: Network access devices and methods for increasing availability in an optical network. The network access device includes a first common port configured to receive a primary optical beam, a second common port configured to receive a secondary optical beam, a wavelength division multiplexing device, and an optical coupling device. When operating in a normal state, the optical coupling device provides at least a portion of the primary optical beam to the wavelength division multiplexing device. In response to a problem being detected in the primary distribution cable, the optical coupling device provides at least a portion of the secondary optical beam to the wavelength division multiplexing device. Problems in the primary distribution cable may be detected by a sensing device in the network access device based on a loss of signal at the first common port.

Abstract: Field-configurable optical devices and methods are disclosed. In one example, a field-configurable optical device includes a housing defining an enclosure, a splitter disposed within the enclosure and having one or more splitter inputs and a plurality of splitter outputs, and a plurality of couplers within the enclosure. The field-configurable optical device includes a plurality of sets of split-ratio selection ports located at an exterior of the housing. The plurality of sets of split-ratio selection ports and the plurality of couplers are configured such that the power split ratio of the field-configurable optical device is established by connecting an input optical fiber to the coupler input port of a selected set of split-ratio selection ports, and connecting a pass-through optical fiber to the coupler pass-through port of the selected set of split-ratio selection ports.

Abstract: A cable manager is provided including a base, a cable hub configured to rotate relative to the base, and a directional resistance element configured to allow rotation of the cable hub in a first direction and resist rotation of the cable hub in a second direction, that is opposite the first direction. The cable hub includes a cable slot configured to receive at least one cable, such that when the cable hub is rotated the at least one cable is wound about a periphery of the cable hub.

Abstract: A redundant wavelength division multiplexing (WDM) device including a first common port which includes a collimator configured to transmit a first optical beam. The first beam includes a first plurality of optical signals. A second common port includes a collimator configured to transmit a second optical beam that includes a second plurality of optical signals. The second common port is spaced apart from the first common port and a plurality of filters define an optical path for each of the first optical beam and the second optical beam. Each filter is oriented to interact with each of the first optical beam and the second optical beam. A method of processing light includes transmitting one of the first optical signals of a first wavelength through a first filter and transmitting one of the second optical signals of the first wavelength through the first filter.

Abstract: A method of assembling a wavelength division multiplexing (WDM) cassette for a fiber optic network is disclosed and includes attaching a first plurality of wavelength filters to a first cassette workpiece, attaching a second plurality of wavelength filters to a second cassette workpiece, organizing the optical fibers extending from the wavelength filters, adjusting a length of the optical fibers extending from wavelength filters, and forming an optical connection between the optical fibers from the wavelength filters via a mass fusion splice. The first cassette workpiece and the second cassette workpiece are separate from each during at least one of the attaching, organizing, adjusting, and forming steps. The optical fibers may have predetermined lengths for being arranged in a helix configuration and folded to produce an organized fiber stack that fits within the confines of the cassette. A WDM cassette having an organized arrangement of optical fibers is also disclosed.

Abstract: A wavelength division multiplexing (WDM) device comprises: a substrate; a common port coupled to the substrate and configured for communication of a combined optical signal that includes different signal channels; and filters coupled to the substrate. The common port and the filters define an optical path for the combined optical signal. Each filter is configured to pass one of the signal channels and to reflect any remainder of the signal channels. The filters have a staggered arrangement to facilitate automated assembly. Methods of such automated assembly are also disclosed.

Abstract: An integrated electrical and optoelectronic package comprises an optical subassembly for the conversion of data between an optical and electrical format, an electronic chip including an integrated electric circuit for processing the data in the electrical format and an interposer. The interposer is configured as a supporting substrate to support the optical subassembly and the electronic chip. An optical connector may be coupled to the package. The optical subassembly comprises an optical adaptor used as an interface between a ferrule of the optical connector and an optoelectronic chip of the optical subassembly. Optical fibers of the optical cable are aligned to optical waveguides of the optoelectronic chip by at least one alignment pin of the optical adaptor.

Abstract: A photonic adaptor has a first face side to couple the photonic adaptor to an optical connector and a second face side to couple the photonic adaptor to an optoelectronic substrate. The photonic adaptor comprises a plurality of optical fibers being arranged between the first face side and the second face side of the photonic adaptor. The photonic adaptor comprises at least one alignment pin projecting out of at least the first face side of the photonic adaptor. The at least one alignment pin is configured to be inserted in the optical connector to align optical fibers of an optical cable to the optical fibers of the photonic adaptor.

Abstract: Detachable optical connectors including a connector support for optical chips and methods of their fabrication are disclosed. In one embodiment, an optical assembly includes an optical chip including a surface, an edge extending from the surface, and at least one chip waveguide proximate the surface and terminating at the edge. The optical assembly further includes a waveguide support having a chip coupling surface, and at least one waveguide disposed within the waveguide support and terminating at the chip coupling surface, wherein the chip coupling surface is coupled to the edge of the optical chip such that the at least one waveguide within the waveguide support is optically coupled to the at least one chip waveguide of the optical chip. The optical assembly further includes a connector support having a first portion coupled to the optical chip, and a second portion coupled to the waveguide support.

Abstract: An integrated electrical and optoelectronic package comprises an optical subassembly for the conversion of data between an optical and electrical format, an electronic chip including an integrated electric circuit for processing the data in the electrical format and an interposer. The interposer is configured as a supporting substrate to support the optical subassembly and the electronic chip. An optical connector may be coupled to the package. The optical subassembly comprises an optical adaptor used as an interface between a ferrule of the optical connector and an optoelectronic chip of the optical subassembly. Optical fibers of the optical cable are aligned to optical waveguides of the optoelectronic chip by at least one alignment pin of the optical adaptor.

Abstract: A photonic adaptor has a first face side to couple the photonic adaptor to an optical connector and a second face side to couple the photonic adaptor to an optoelectronic substrate. The photonic adaptor comprises a plurality of optical fibers being arranged between the first face side and the second face side of the photonic adaptor. The photonic adaptor comprises at least one alignment pin projecting out of at least the first face side of the photonic adaptor. The at least one alignment pin is configured to be inserted in the optical connector to align optical fibers of an optical cable to the optical fibers of the photonic adaptor.

Abstract: Optical ports providing passive alignment connectivity are disclosed. In one embodiment, an optical port includes a substrate having a surface, a photonic silicon chip, a connector body, and a plurality of spacer elements. The photonic silicon chip includes an electrical coupling surface, an upper surface and an optical coupling surface. The optical coupling surface is positioned between the electrical coupling surface and the upper surface. The photonic silicon chip further includes at least one waveguide terminating at the optical coupling surface, and a chip engagement feature disposed on the upper surface. The connector body includes a first alignment feature, a second alignment feature, a mounting surface, and a connector engagement feature at the mounting surface. The connector engagement feature mates with the chip engagement feature. The plurality of spacer elements is disposed between the electrical coupling surface of the photonic silicon chip and the surface of the substrate.

Abstract: Optical ports providing passive alignment connectivity are disclosed. In one embodiment, an optical port includes a substrate having a surface, a photonic silicon chip, a connector body, and a plurality of spacer elements. The photonic silicon chip includes an electrical coupling surface, an upper surface and an optical coupling surface. The optical coupling surface is positioned between the electrical coupling surface and the upper surface. The photonic silicon chip further includes at least one waveguide terminating at the optical coupling surface, and a chip engagement feature disposed on the upper surface. The connector body includes a first alignment feature, a second alignment feature, a mounting surface, and a connector engagement feature at the mounting surface. The connector engagement feature mates with the chip engagement feature. The plurality of spacer elements is disposed between the electrical coupling surface of the photonic silicon chip and the surface of the substrate.

Abstract: The laser module system for use with an optical telecommunications apparatus has a laser module having first and second ferrules, a first harness with first optical waveguides that optically connect the first ferrule to the second ferrule, a laser assembly that generates laser light beams having different wavelengths, and a second harness with second optical waveguides that optically connect the laser assembly to the second ferrule. A third harness with third optical waveguides resides within the apparatus. An O-E adapter also resides within the apparatus. The O-E adapter receives the second and third ferrules and places the first and second optical waveguides of the first and second harnesses in optical communication with the third optical waveguides of the third harness. The laser module can be plugged into and unplugged from the receptacle.

Abstract: Detachable optical connectors including a connector support for optical chips and methods of their fabrication are disclosed. In one embodiment, an optical assembly includes an optical chip including a surface, an edge extending from the surface, and at least one chip waveguide proximate the surface and terminating at the edge. The optical assembly further includes a waveguide support having a chip coupling surface, and at least one waveguide disposed within the waveguide support and terminating at the chip coupling surface, wherein the chip coupling surface is coupled to the edge of the optical chip such that the at least one waveguide within the waveguide support is optically coupled to the at least one chip waveguide of the optical chip. The optical assembly further includes a connector support having a first portion coupled to the optical chip, and a second portion coupled to the waveguide support.

Abstract: Optical ports providing passive alignment connectivity are disclosed. In one embodiment, an optical port includes a substrate having a surface, a photonic silicon chip, a connector body, and a plurality of spacer elements. The photonic silicon chip includes an electrical coupling surface, an upper surface and an optical coupling surface. The optical coupling surface is positioned between the electrical coupling surface and the upper surface. The photonic silicon chip further includes at least one waveguide terminating at the optical coupling surface, and a chip engagement feature disposed on the upper surface. The connector body includes a first alignment feature, a second alignment feature, a mounting surface, and a connector engagement feature at the mounting surface. The connector engagement feature mates with the chip engagement feature. The plurality of spacer elements is disposed between the electrical coupling surface of the photonic silicon chip and the surface of the substrate.