Abstract: The application provides methods of forming a fiber coupling device comprising a substrate, the substrate having a substrate surface and at least one optoelectronic and/or photonic element, and further comprising at least one fiber coupling alignment structure that is optically transmissive. One method comprises a) applying a polymerizable material to the substrate surface, b) selectively polymerizing, using a method of 3D lithography, a region of the polymerizable material so as to convert the region of the polymerizable material into a polymer material, thereby forming at least one fiber coupling alignment structure, and c) cleaning the substrate and the polymer material from remaining non-polymerized polymerizable material, thereby exposing the at least one fiber coupling alignment structure of the fiber coupling device.

Abstract: The application provides methods of forming a fiber coupling device comprising a substrate, the substrate having a substrate surface and at least one optoelectronic and/or photonic element, and further comprising at least one fiber coupling alignment structure that is optically transmissive. The method comprises a) applying a polymerizable material to the substrate surface, b) selectively polymerizing, using a method of 3D lithography, a region of the polymerizable material so as to convert the region of the polymerizable material into a polymer material, thereby forming at least one fiber coupling alignment structure, and c) cleaning the substrate and the polymer material from remaining non-polymerized polymerizable material, thereby exposing the at least one fiber coupling alignment structure of the fiber coupling device.

Abstract: Optical ports providing passive alignment connectivity are disclosed. In one embodiment, an optical port includes a substrate having a surface, a photonic silicon chip, a connector body, and a plurality of spacer elements. The photonic silicon chip includes an electrical coupling surface, an upper surface and an optical coupling surface. The optical coupling surface is positioned between the electrical coupling surface and the upper surface. The photonic silicon chip further includes at least one waveguide terminating at the optical coupling surface, and a chip engagement feature disposed on the upper surface. The connector body includes a first alignment feature, a second alignment feature, a mounting surface, and a connector engagement feature at the mounting surface. The connector engagement feature mates with the chip engagement feature. The plurality of spacer elements is disposed between the electrical coupling surface of the photonic silicon chip and the surface of the substrate.

Abstract: A multi-core optical fiber (100) comprises a plurality of optical cores (1, . . . , 8) to respectively transmit light and a plurality of cleaves (110a, 100b, 110c, 110d, 110e, 110f, 110g, 110h) extending from a surface (102) of the multi-core optical fiber (100) into the multi-core optical fiber. A first cleave (110a) comprises a surface (111a) to couple light out of the optical fiber, wherein a first optical core (1) ends at the surface (111a) of the first cleave (110a). An at least one second cleave (110b, . . . , 110h) comprises a surface (111b, . . . , 111h) to couple light out of the optical fiber, wherein at least one second optical core (2, . . . , 8) ends at the surface (111b, . . . , 111h) of the at least one second cleave (110b, . . . , 110h). The first and the at least one second cleave (110a, . . . , 110h) are staggered along the longitudinal axis (101) of the multi-core optical fiber (100).

Abstract: The application provides methods of forming a fiber coupling device comprising a substrate, the substrate having a substrate surface and at least one optoelectronic and/or photonic element, and further comprising at least one fiber coupling alignment structure that is optically transmissive. One method comprises a) applying a polymerizable material to the substrate surface, b) selectively polymerizing, using a method of 3D lithography, a region of the polymerizable material so as to convert the region of the polymerizable material into a polymer material, thereby forming at least one fiber coupling alignment structure, and c) cleaning the substrate and the polymer material from remaining non-polymerized polymerizable material, thereby exposing the at least one fiber coupling alignment structure of the fiber coupling device.

Abstract: The application provides methods of forming a fiber coupling device comprising a substrate, the substrate having a substrate surface and at least one optoelectronic and/or photonic element, and further comprising at least one fiber coupling alignment structure that is optically transmissive. The method comprises a) applying a polymerizable material to the substrate surface, b) selectively polymerizing, using a method of 3D lithography, a region of the polymerizable material so as to convert the region of the polymerizable material into a polymer material, thereby forming at least one fiber coupling alignment structure, and c) cleaning the substrate and the polymer material from remaining non-polymerized polymerizable material, thereby exposing the at least one fiber coupling alignment structure of the fiber coupling device.

Abstract: Systems and methods of aligning an optical interface assembly with an integrated circuit (IC) are disclosed. The method includes emitting light from an optical transmitter, passing the emitted light through the optical interface assembly in a first direction, and reflecting the emitted light from a reflective surface disposed immediately adjacent a front end of the optical interface assembly to define reflected light that travels back through the optical interface assembly in a second direction that is substantially opposite the first direction. The reflected light is received by an optical receiver that generates in response a receiver signal. The relative position of the optical interface assembly and the IC is adjusted to achieve an aligned position based on the receiver signal. The disclosure is also directed to a test plug for aligning an optical interface assembly to the IC.

Abstract: A multi-core optical fiber (100) comprises a plurality of optical cores (1, . . . , 8) to respectively transmit light and a plurality of cleaves (110a, 100b, 110c, 110d, 110e, 110f, 110g, 110h) extending from a surface (102) of the multi-core optical fiber (100) into the multi-core optical fiber. A first cleave (110a) comprises a surface (111a) to couple light out of the optical fiber, wherein a first optical core (1) ends at the surface (111a) of the first cleave (110a). An at least one second cleave (110b, . . . , 110h) comprises a surface (111b, . . . , 111h) to couple light out of the optical fiber, wherein at least one second optical core (2, . . . , 8) ends at the surface (111b, . . . , 111h) of the at least one second cleave (110b, . . . , 110h). The first and the at least one second cleave (110a, . . . , 110h) are staggered along the longitudinal axis (101) of the multi-core optical fiber (100).

Abstract: Disclosed are optical plugs and optical connectors having one or more integral alignment features used for making optical connections. In one embodiment, an optical connector comprising an optical body and at least one magnetic attachment. The optical body comprises a front side with a first surface, an optical section comprising at least one optical channel, and a datum section disposed on a second surface of the front side and comprising one or more integral alignment features. The optical body also comprises a circuit mounting portion disposed at a rear side of the optical body. The datum section may be arranged on opposite sides of the optical section. Further, the one or more integral alignment feature may be arranged at a top and a bottom of the datum section for alignment in a first direction. The first surface may also be recessed from the second surface.

Abstract: Systems and methods of aligning an optical interface assembly with an integrated circuit (IC) are disclosed. The method includes emitting light from an optical transmitter, passing the emitted light through the optical interface assembly in a first direction, and reflecting the emitted light from a reflective surface disposed immediately adjacent a front end of the optical interface assembly to define reflected light that travels back through the optical interface assembly in a second direction that is substantially opposite the first direction. The reflected light is received by an optical receiver that generates in response a receiver signal. The relative position of the optical interface assembly and the IC is adjusted to achieve an aligned position based on the receiver signal. The disclosure is also directed to a test plug for aligning an optical interface assembly to the IC.

Abstract: An embodiment of the invention relates to an optical component (10, 300) for processing optical signals comprising a rhombic prism (20) having a first surface (SF1), a second surface (SF2) that is parallel to the first surface (SF1), a third surface (SF3) that is angled relative to the first and second surfaces (SF1, SF2) and connects the first and second surfaces (SF1, SF2), and a fourth surface (SF4) that is parallel to the third surface (SF3) and connects the first and second surfaces (SF1, SF2), wherein the third surface (SF3) is covered by a polarization dependent layer (PDL) capable of transmitting radiation having a first polarization and capable of reflecting radiation having a second polarization, said first and second polarizations being perpendicular to each other.

Abstract: An embodiment of the invention relates to a system comprising an optical device (10) and an evaluation device (20) for characterizing the optical device. The optical device comprising a 90° optical hybrid unit (30) having a first and second optical input (30E1, 30E2) and at least two optical outputs (30A1-30A4) wherein optical output signals (So1-So4) leaving the optical outputs have optical phase differences between each other of 90° or multiple thereof; a first photodetector (P1) connected to a first optical output (30A1) and a second photodetector (P2) connected to a second optical output (30A2), wherein the first optical output emits a first optical output signal (So1) and the second optical output emits a second optical output signal (So2), said second optical output signal having an optical phase difference of 180° relative to the first optical output signal; and a first transimpedance amplifier (Tr1) connected to the first and second photodetectors (P1, P2).

Abstract: An arrangement including an electrical conductor track carrier and a component applied on the conductor track carrier. The component is a fiber-optoelectronic component and has: a housing, at least one electro-optical or optoelectronic component, at least one fiber-optic interface connected to the electro-optical or optoelectronic component, and at least one electrical interface for connecting the component on the conductor track carrier. The electrical interface has at least one bent electrical soldering connection element which is attached by one end to a base connection section of the housing base and extends from there laterally toward the outside so that the other end of the soldering connection element projects laterally and is soldered laterally outside the outer housing contour on the conductor track carrier. The soldering connection element is bent away from the base connection section so that the base connection section is at a distance from the conductor track carrier.

Abstract: An embodiment of the invention relates to an optical device (10) comprising a coupler (20) having coupler inputs (I1, I2) and coupler outputs (O1-O4), and a connection network (30), wherein said connection network comprises connecting waveguides (41-44) which connect said coupler outputs with outputs of the connection network (O1?-O4?), and wherein at least one connecting waveguide of the connection network crosses at least one other connecting waveguide of the connection network. At least one connecting waveguide (42-44), which crosses other connecting waveguides less often than the connecting waveguide (41) with the maximum number of crossings with other connecting waveguides, is attenuated by an optical attenuation element (81-84, 91-94).

Abstract: An embodiment of the invention relates to a system comprising an optical device (10) and an evaluation device (20) for characterizing the optical device. The optical device comprising a 90° optical hybrid unit (30) having a first and second optical input (30E1, 30E2) and at least two optical outputs (30A1-30A4) wherein optical output signals (So1-So4) leaving the optical outputs have optical phase differences between each other of 90° or multiple thereof; a first photodetector (P1) connected to a first optical output (30A1) and a second photodetector (P2) connected to a second optical output (30A2), wherein the first optical output emits a first optical output signal (So1) and the second optical output emits a second optical output signal (So2), said second optical output signal having an optical phase difference of 180° relative to the first optical output signal; and a first transimpedance amplifier (Tr1) connected to the first and second photodetectors (P1, P2).

Abstract: Arrangement comprising an electrical conductor track carrier and an optoelectronic component, and a method for producing such an arrangement The invention relates, inter alia, to an arrangement (10) comprising an electrical conductor track carrier (20) and a component (30) applied on the conductor track carrier.