Abstract: A method for producing structured glass articles is provided by removing glass material from a glass element. The method includes the step of etching the glass element to remove the glass material from using an etching medium. The etching medium has a basic aqueous etching solution with a pH of more than 12 and a complexing agent. The complexing agent complexes a leached constituent of the glass element.

Abstract: A method for filamentation of a dielectric workpiece has a workpiece with a thickness between 0.5 and 20 mm is provided. The workpiece has boundary surfaces delimiting the workpiece. The thickness of the workpiece varies spatially and/or at least one of the boundary surfaces delimiting the workpiece has at least one curvature with a radius of curvature between 0.1 ?m and 10 m. The dielectric workpiece can have a specially formed edge.

Abstract: A method for separating a substrate of a brittle-hard material is provided. The method includes the steps of introducing defects into the substrate at a spacing from one another along a separation line using at least one pulsed laser beam; selecting an average spacing between neighboring defects and a number of laser pulses for generating a respective defect such that a breaking stress (?B) for separating the substrate along the separation line is smaller than a first reference stress (?R1) of the substrate and such that an edge strength ?K of the separation edge obtained after separation is greater than a second reference stress (?R2) of the substrate; and separating the substrate after introducing the defects by applying a stress along the separation line.

Abstract: A method for processing glass elements is provided. The method includes introducing a perforation line for parting a glass element introduced into the glass element during or after a hot processing process at an elevated temperature of at least 100° C. Spaced-apart filamentary flaws are introduced into the glass element along the predetermined course of the perforation line by a pulsed laser beam of an ultrashort pulse laser, and, during or after the introduction of the filamentary flaws, the glass element is cooled down so as to produce a temperature gradient, which induces a mechanical stress at the filamentary flaws, whereby the breaking force required for parting the glass element along the perforation line is reduced.

Abstract: A substrate sub-element has at least one body. The body has at least one material from the group consisting of: glass, glass ceramic, and silicon. The body also has at least one side face. The side face has a height-modulated surface over at least a portion thereof, a surface roughness over at least a portion thereof, and a variation of the surface due to the surface roughness between 1 and 5 orders of magnitude less than a variation of the surface due to the height modulation.

Abstract: A substrate body has a first major surface and a distinguished surface. The distinguished surface has at least one first curved progression in at least a portion thereof. The first curved progression lies in a cross-sectional plane defined by a normal vector to the distinguished surface and a normal vector to the first major surface. The first curved progression is defined by a parabolic function, a quartic function, a logarithmic function, or a polynomial function. The substrate body has a thickness of 500 ?m or less.

Abstract: A method for the separative processing of brittle-hard materials is provided. The method includes irradiating a surface of a workpiece made of brittle-hard material with a laser beam having a wavelength sufficient so that light of the laser beam is absorbed at the surface and so that the workpiece is heated to create a first temperature gradient in a direction from the surface to an interior of the workpiece; guiding the laser beam over the surface along an irradiated region; forming a second temperature gradient along the surface between the irradiated region and a non-irradiated region adjacent the irradiated region, the first and second temperature gradients interacting in such a way that, on account of thermomechanical stresses, the workpiece is separated below the surface with a portion of the workpiece being severed in the form of a chip.

Abstract: A method is provided for preparing a water-insoluble lignosulfonate polymer from a first solution containing lignosulfonate precursors, which involves a) separating the lignosulfonate precursors from the first solution and providing a second solution with at least 5 wt % of lignosulfonate precursors obtained from the first solution, wherein the separating comprises filtering out components with a predefined particle diameter and separating low-molecular weight components including salts and low-molecular organic compounds, b) adding a radical-forming enzyme and gas to the second solution, wherein the gas comprises oxygen, and c) polymerizing the lignosulfonate precursors of the resultant solution of b). Other related aspects are described and claimed.

Abstract: The present disclosure relates to a method for preparing and/or performing the separation of a substrate element into at least two substrate sub-elements along a separation face and a substrate sub-element which is manufactured and/or can be manufactured in particular by use of the method according to the disclosure.

Abstract: A method for preparing and/or carrying out the structuring of a predetermined or predeterminable distinguished surface of a substrate body having a substrate material includes exposing the substrate material in at least one curved effective area to an electromagnetic field which in each of the at least one curved effective area causes a non-linear interaction between the electromagnetic field and the substrate material, and thus at least partially influencing the substrate material arranged in the curved effective area. After the structuring of the distinguished surface the distinguished surface has at least in certain areas at least one first curved progression which is at least partially determined and/or influenced by the curved shape of the at least one curved effective area. The nonlinear interaction causes at least one nonlinear absorption of the electromagnetic field in the substrate material.

Abstract: A component includes a glass or glass ceramic having a thickness and a plurality of predamages. Each predamage of the plurality of predamages has a longitudinal axis and passes continuously through the thickness of the glass or the glass ceramic. The component also includes a material compaction of the glass or glass ceramic that is at least 1% relative to an actual material density in a radius of 3 ?m about the longitudinal axis of each predamage so that the glass or the glass ceramic has a relative weight loss per predamage that is less than 10%.

Abstract: A method provides for producing modifications in or on a transparent workpiece using a laser processing device. The laser processing device has a short pulse or ultrashort pulse laser that emits laser radiation having a wavelength in the transparency range of the workpiece and which has a beam-shaping optical unit for beam shaping for focusing the laser radiation. The transparent workpiece is composed of a material that has a plurality of phases, of which at least two phases have different dielectric constants, of which in turn the one phase is a phase embedded in the form of particles, which phase is substantially surrounded by the other phase, and wherein the product of the volume of the particles specified in cubic nanometers and the ratio of the absolute value of the difference of the two different dielectric constants to the dielectric constant of the surrounding phase is greater than 500.

Abstract: A method for processing glass is provided. The method includes the steps of providing a glass element and removing glass material from the glass element by etching with an alkaline etching medium in an organic solvent.

Abstract: A method and device for preparing a workpiece for separation are provided that include providing a workpiece that is transparent for light of a pulsed laser beam, splitting the laser beam into two partial beams using an optical system, directing both partial beams onto the workpiece, and moving the workpiece and the partial beams relative to one another. The partial beams are directed onto the workpiece incident at different angles to the normal of the irradiated surface and superimposed inside the workpiece such that the partial beams interfere with one another to form a sequence of intensity maxima inside the workpiece. The intensity at the intensity maxima is sufficiently high to modify the material of the workpiece so that a chain-like periodic pattern of material modifications is formed along a path defining a separation line.

Abstract: A method of structuring a glass element having a first side face and a second side face is provided. The method includes the steps of: producing a filament-shaped flaw in the glass element with a pulsed laser beam along a focus line; etching to remove glass in the filament-shaped flaw to form a wall extending from the first side face towards the second side face, the wall having a boundary line that is tapered at a vertex between the wall and the first side face with a taper angle with respect to a perpendicular of the first side face; and adjusting the taper angle by controlling a feature of the focus line. The feature is selected from a group consisting of a position of the focus line, a length of the focus line, an intensity distribution of the focus line, and any combinations thereof.

Abstract: A method for preparing a workpiece for separation is provided that includes providing a workpiece that is transparent for light of a pulsed laser beam, splitting the laser beam into two partial beams using an optical system, directing both partial beams onto the workpiece, and moving the workpiece and the partial beams relative to one another. The partial beams are directed onto the workpiece incident at different angles to the normal of the irradiated surface and superimposed inside the workpiece such that the partial beams interfere with one another to form a sequence of intensity maxima inside the workpiece. The intensity at the intensity maxima is sufficiently high to modify the material of the workpiece so that a chain-like periodic pattern of material modifications is formed along a path defining a separation line.

Abstract: A method includes: providing a plate-like glass element having side faces and an ultrashort pulse laser having a laser beam; directing the laser beam onto one of the side faces; concentrating the laser beam by focusing optics to form an elongated focus in the glass element; producing a filament-shaped flaw in a volume of the glass element by a radiated-in energy of the laser beam, a longitudinal direction of which runs transverse to one of the side faces, and the ultrashort pulse laser radiates in a pulse or a pulse packet having at least two successive laser pulses to produce the filament-shaped flaw; widening the filament-shaped flaw to form a channel by exposing the glass element to an etching including an etching medium which removes glass at a rate of less than 8 ?m per hour; and introducing rounded, hemispherical depressions in a wall of the channel by the etching.

Abstract: The invention relates to an encapsulated optoelectronic component having a housing and at least one optoelectronic component, which is arranged in a cavity which is formed by a main element and is covered on an upper side by a cover element, and therefore the optoelectronic component is arranged between the cover element and the main elements and the main element forms side walls which laterally enclose the cavity. A one-part plate element with at least one tongue-shaped deflecting element is arranged between the cover element and the main element in such a way that, in the cavity, the deflecting element is arranged with at least one optical surface by which electromagnetic radiation emitted or received by the optoelectronic component can be deflected. The invention also relates to at least one wafer with deflecting elements, to a composite assembly of encapsulated optoelectronic components and to a method for the production thereof.

Abstract: A method for producing ultra-thin glass sheets is provided that results in glass sheets with high edge strength. The method includes: hot forming a continuous glass ribbon with a glass thickness from molten glass; annealing the glass ribbon with an annealing rate chosen based on the glass thickness; producing a laser beam focus area that is longer than the glass thickness; introducing filamentary defects into the glass ribbon using the laser beam so that the filamentary defects extend from one face to the opposite face and are spaced apart from one another along the breaking lines to produce transverse breaking lines and longitudinal breaking lines with margins each comprising a thickened bead; separating the beads along the longitudinal breaking lines and separating glass sheets by severing along the transverse breaking lines.

Abstract: A substrate composed of hard brittle material, the substrate including: a cavity on at least one side surface of the substrate, the cavity including a side wall, the cavity further including a bottom surface having a structure having a plurality of substantially hemispherical depressions.