Patents by Inventor Andreas Scheurle
Andreas Scheurle has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11905166Abstract: A production method for a micromechanical component for a sensor or microphone device. The method includes: patterning a plurality of first trenches through a substrate surface of a monocrystalline substrate made of at least one semiconductor material using anisotropic etching, covering the lateral walls of the plurality of first trenches with a passivation layer, while bottom areas of the plurality of first trenches are kept free or are freed of the passivation layer, etching at least one first cavity, into which the plurality of first trenches opens, into the monocrystalline substrate using an isotropic etching method, in which an etching medium of the isotropic etching method is conducted through the plurality of first trenches, and by covering the plurality of first trenches by epitaxially growing a monocrystalline sealing layer on the substrate surface of the monocrystalline substrate made of the at least one identical semiconductor material as the monocrystalline substrate.Type: GrantFiled: September 3, 2021Date of Patent: February 20, 2024Assignee: ROBERT BOSCH GMBHInventors: Heribert Weber, Peter Schmollngruber, Thomas Friedrich, Andreas Scheurle, Joachim Fritz, Sophielouise Mach
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Publication number: 20230375424Abstract: A sensor device. The sensor device includes a housing component with a gas-tight internal volume, at least one electrode structure arranged in the internal volume in an adjustable and/or bendable manner, at least one counter electrode fixedly disposed on and/or in the housing component, and an electronic device configured to apply an electrical excitation voltage signal between the electrode structure and the counter electrode such that the at least one electrode structure is set in an oscillating motion relative to the housing component. The electronic device is configured to detect and/or determine the internal pressure in the internal volume and/or a change in the internal pressure while taking into consideration at least one sensor signal, which is dependent on an electric voltage or capacitance between the electrode structure and the counter electrode.Type: ApplicationFiled: November 15, 2021Publication date: November 23, 2023Inventors: Heribert Weber, Andreas Scheurle, Peter Schmollngruber, Thomas Friedrich
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Publication number: 20230357001Abstract: A production method for a micromechanical component for a sensor device or microphone device. The method includes: forming a supporting structure composed of a first sacrificial material on a substrate surface of a substrate with a first sacrificial material layer, a plurality of etching holes structured through the first sacrificial material layer, and a plurality of supporting posts projecting into the substrate; etching into the substrate surface at least one cavity spanned by the supporting structure; forming a diaphragm composed of at least one semiconductor material on or over the first sacrificial material layer of the supporting structure; depositing a layer stack comprising at least one sacrificial layer and at least one counter electrode; and exposing the diaphragm by at least partially removing at least the supporting structure and the at least one sacrificial layer.Type: ApplicationFiled: September 30, 2021Publication date: November 9, 2023Inventors: Heribert Weber, Andreas Scheurle, Hans Artmann, Peter Schmollngruber, Thomas Friedrich, Uwe Schiller
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Publication number: 20230339745Abstract: A method for manufacturing a micromechanical sensor. The method includes: applying a first oxide sacrificial layer onto a substrate; removing material of the substrate through openings in the first oxide sacrificial layer; closing the openings in the first oxide sacrificial layer by applying a second oxide sacrificial layer; forming a sensing area on a carrier structure, the sensing area and the carrier structure being formed on the oxide sacrificial layers and the sensing area and/or the carrier structure being connected to the substrate via at least one attachment area, which forms a flexible structure; and at least partially removing the oxide sacrificial layers between the carrier structure and the substrate with the aid of an etching process.Type: ApplicationFiled: March 22, 2021Publication date: October 26, 2023Inventors: Heribert Weber, Andreas Scheurle, Christoph Hermes, Peter Schmollngruber, Thomas Friedrich
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Publication number: 20230304881Abstract: A micromechanical component. The micromechanical component includes: a membrane; the membrane includes at least one reinforcement structure of a geometrically defined shape, which reinforces the membrane in a defined manner, in the region of at least one anchor structure and/or in the region of at least one connecting structure.Type: ApplicationFiled: October 6, 2021Publication date: September 28, 2023Inventors: Heribert Weber, Andreas Scheurle, Joachim Fritz, Peter Schmollngruber, Sophielouise Mach, Thomas Friedrich
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Publication number: 20230242393Abstract: A micromechanical component for a sensor or microphone device. An electrode surface of a first electrode structure is aligned with a second electrode structure. A substructure of the first electrode structure is entirely made of at least one electrically conductive material. The electrode surface and an opposite surface of the first electrode structure are outer surfaces of the substructure. A stop structure protruding from the electrode surface towards the second electrode structure is formed on the first electrode structure. The first electrode structure includes an insulating region which extends from the electrode surface to the opposite surface of the first electrode structure. The stop structure is formed either as a projection of the at least one insulating region protruding from the electrode surface towards the second electrode structure or is bordered by the at least one insulating region.Type: ApplicationFiled: August 18, 2021Publication date: August 3, 2023Inventors: Heribert Weber, Andreas Scheurle, Peter Schmollngruber, Thomas Friedrich
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Publication number: 20220396477Abstract: A micromechanical component for a sensor device or microphone device. The micromechanical component includes a diaphragm with a diaphragm inner side to which an electrode structure is directly or indirectly connected; and a cavity that is formed at least in a volume that is exposed by at least one removed area of at least one sacrificial layer. At least one residual area made of at least one electrically insulating sacrificial layer material of the at least one sacrificial layer is also present at the micromechanical component, and including at least one insulation area made of at least one electrically insulating material that is not the same as the electrically insulating sacrificial layer material. The electrode structure is electrically insulated from the diaphragm, and/or the at least one residual area of the at least one sacrificial layer is delimited from the cavity, using the at least one insulation area.Type: ApplicationFiled: January 12, 2021Publication date: December 15, 2022Inventors: Heribert Weber, Andreas Scheurle, Christoph Hermes, Peter Schmollngruber, Thomas Friedrich
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Patent number: 11418885Abstract: A micromechanical component for a sensor device or microphone device. The component includes a diaphragm support structure with a diaphragm, a cavity formed in the diaphragm support structure and adjoined by a diaphragm inner side, and a separating trench structured through the surface of the diaphragm support structure and extends to the cavity and completely frames the diaphragm, and that is sealed off media-tight and/or air-tight using at least one separating trench closure material. An etching channel is formed in the diaphragm support structure, separately from the separating trench, and extends from its first etching channel end section to its second etching channel end section. The first etching channel end section opens into the cavity, and the second etching channel end section is sealed off media-tight and/or air-tight using at least one etching channel closure structure formed on an outer partial surface of the surface of the diaphragm support structure.Type: GrantFiled: January 12, 2021Date of Patent: August 16, 2022Assignee: Robert Bosch GmbHInventors: Heribert Weber, Andreas Scheurle, Christoph Hermes, Peter Schmollngruber, Thomas Friedrich
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Patent number: 11407635Abstract: A bonding pad layer system is deposited on a semiconductor chip as a base, for example, a micromechanical semiconductor chip, in which at least one self-supporting dielectric membrane made up of dielectric layers, a platinum conductor track and a heater made of platinum is integrated. In the process, the deposition of a tantalum layer takes place first, upon that the deposition of a first platinum layer, upon that the deposition of a tantalum nitride layer, upon that the deposition of a second platinum layer and upon that the deposition of a gold layer, at least one bonding pad for connecting with a bonding wire being formed in the gold layer. The bonding pad is situated in the area of the contact hole on the semiconductor chip, in which a platinum conductor track leading to the heater is connected using a ring contact and/or is connected outside this area.Type: GrantFiled: June 14, 2018Date of Patent: August 9, 2022Assignee: Robert Bosch GmbHInventors: Andreas Scheurle, Bernd Klein, Heinz Nedelmann, Heribert Weber, Isolde Simon, Martin Lapisa, Melissa Delheusy, Michael Knauss, Raschid Baraki, Vitaliy Kondrashov
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Publication number: 20220081285Abstract: A production method for a micromechanical component for a sensor or microphone device. The method includes: patterning a plurality of first trenches through a substrate surface of a monocrystalline substrate made of at least one semiconductor material using anisotropic etching, covering the lateral walls of the plurality of first trenches with a passivation layer, while bottom areas of the plurality of first trenches are kept free or are freed of the passivation layer, etching at least one first cavity, into which the plurality of first trenches opens, into the monocrystalline substrate using an isotropic etching method, in which an etching medium of the isotropic etching method is conducted through the plurality of first trenches, and by covering the plurality of first trenches by epitaxially growing a monocrystalline sealing layer on the substrate surface of the monocrystalline substrate made of the at least one identical semiconductor material as the monocrystalline substrate.Type: ApplicationFiled: September 3, 2021Publication date: March 17, 2022Inventors: Heribert Weber, Peter Schmollngruber, Thomas Friedrich, Andreas Scheurle, Joachim Fritz, Sophielouise Mach
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Publication number: 20210354978Abstract: A micromechanical component for a sensor or microphone device, including a substrate, a frame structure, which is situated on the substrate surface and/or at least one intermediate layer, and a diaphragm, which spans an inner volume, which is at least partially framed by the frame structure. The micromechanical component includes a bending beam structure, which is situated in the inner volume and includes at least one anchoring area, which is attached to the frame structure, to the substrate surface and/or to the at least one intermediate layer, and at least one self-supporting area, which is connected via at least one coupling structure to the diaphragm inner side of the diaphragm in such a way that the at least one self-supporting area is bendable by way of a warping of the diaphragm.Type: ApplicationFiled: May 10, 2021Publication date: November 18, 2021Inventors: Heribert Weber, Andreas Scheurle, Joachim Fritz, Peter Schmollngruber, Sophielouise Mach, Thomas Friedrich
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Publication number: 20210219058Abstract: A micromechanical component for a sensor device or microphone device. The component includes a diaphragm support structure with a diaphragm, a cavity formed in the diaphragm support structure and adjoined by a diaphragm inner side, and a separating trench structured through the surface of the diaphragm support structure and extends to the cavity and completely frames the diaphragm, and that is sealed off media-tight and/or air-tight using at least one separating trench closure material. An etching channel is formed in the diaphragm support structure, separately from the separating trench, and extends from its first etching channel end section to its second etching channel end section. The first etching channel end section opens into the cavity, and the second etching channel end section is sealed off media-tight and/or air-tight using at least one etching channel closure structure formed on an outer partial surface of the surface of the diaphragm support structure.Type: ApplicationFiled: January 12, 2021Publication date: July 15, 2021Inventors: Heribert Weber, Andreas Scheurle, Christoph Hermes, Peter Schmollngruber, Thomas Friedrich
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Publication number: 20200140261Abstract: A bonding pad layer system is deposited on a semiconductor chip as a base, for example, a micromechanical semiconductor chip, in which at least one self-supporting dielectric membrane made up of dielectric layers, a platinum conductor track and a heater made of platinum is integrated. In the process, the deposition of a tantalum layer takes place first, upon that the deposition of a first platinum layer, upon that the deposition of a tantalum nitride layer, upon that the deposition of a second platinum layer and upon that the deposition of a gold layer, at least one bonding pad for connecting with a bonding wire being formed in the gold layer. The bonding pad is situated in the area of the contact hole on the semiconductor chip, in which a platinum conductor track leading to the heater is connected using a ring contact and/or is connected outside this area.Type: ApplicationFiled: June 14, 2018Publication date: May 7, 2020Applicants: Robert Bosch GmbH, Robert Bosch GmbHInventors: Andreas Scheurle, Bernd Klein, Heinz Nedelmann, Heribert Weber, Isolde Simon, Martin Lapisa, Melissa Delheusy, Michael Knauss, Raschid Baraki, Vitaliy Kondrashov
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Patent number: 10336610Abstract: A method for producing a micromechanical component is provided, In a preparatory step, a substrate device of the micromechanical component and/or a cap device of the micromechanical component is patterned. In a first sub-step, a first pressure and/or a first chemical composition being adjusted, and the substrate device and the cap device being connected to each other so that a first cavern is formed, sealed from an environment of the micromechanical component, the first pressure prevailing in the first cavity and/or the first chemical composition being enclosed. In a second sub-step, a second pressure and/or a second chemical composition being adjusted, and the substrate device and the cap device being connected to each other so that a second cavity is formed, sealed from the environment of the micromechanical component and from the first cavity, the second pressure prevailing in the second cavity and/or the second chemical composition being enclosed.Type: GrantFiled: October 23, 2017Date of Patent: July 2, 2019Assignee: ROBERT BOSCH GMBHInventors: Heiko Stahl, Andreas Scheurle, Hendrik Specht, Marlene Winker, Ralf Hausner, Volker Schmitz
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Patent number: 10018650Abstract: A rocker device for a micromechanical Z sensor includes: two trough-shaped rocker arms mountable around a torsion pivot, the rocker device being configured asymmetrically with respect to the torsion pivot; and for each rocker arm, a strike region having at least one first strike element is provided, the strike region on each rocker arm being configured in definedly elevated fashion relative to a sensing region of the rocker device.Type: GrantFiled: February 4, 2015Date of Patent: July 10, 2018Assignee: ROBERT BOSCH GMBHInventors: Andreas Scheurle, Guenther-Nino-Carlo Ullrich, Markus Heitz, Andrea Orto
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Patent number: 9970957Abstract: A rocker device for a micromechanical Z-sensor, including two rocker arms which are mounted around a torsion spring and which are asymmetric relative to the torsion spring; the rocker arms having first perforations; at least one of the rocker arms having at least one opening, a diameter of the first perforations being configured in a defined manner to be smaller than a diameter of the opening; and a cavity for connecting the first perforations to the at least one opening being formed in at least one of the rocker arms.Type: GrantFiled: October 28, 2015Date of Patent: May 15, 2018Assignee: ROBERT BOSCH GMBHInventors: Andreas Scheurle, Guenther-Nino-Carlo Ulrich
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Publication number: 20180111828Abstract: A method for producing a micromechanical component is provided, In a preparatory step, a substrate device of the micromechanical component and/or a cap device of the micromechanical component is patterned. In a first sub-step, a first pressure and/or a first chemical composition being adjusted, and the substrate device and the cap device being connected to each other so that a first cavern is formed, sealed from an environment of the micromechanical component, the first pressure prevailing in the first cavity and/or the first chemical composition being enclosed. In a second sub-step, a second pressure and/or a second chemical composition being adjusted, and the substrate device and the cap device being connected to each other so that a second cavity is formed, sealed from the environment of the micromechanical component and from the first cavity, the second pressure prevailing in the second cavity and/or the second chemical composition being enclosed.Type: ApplicationFiled: October 23, 2017Publication date: April 26, 2018Inventors: Heiko Stahl, Andreas Scheurle, Hendrik Specht, Marlene Winker, Ralf Hausner, Volker Schmitz
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Publication number: 20160139172Abstract: A rocker device for a micromechanical Z-sensor, including two rocker arms which are mounted around a torsion spring and which are asymmetric relative to the torsion spring; the rocker arms having first perforations; at least one of the rocker arms having at least one opening, a diameter of the first perforations being configured in a defined manner to be smaller than a diameter of the opening; and a cavity for connecting the first perforations to the at least one opening being formed in at least one of the rocker arms.Type: ApplicationFiled: October 28, 2015Publication date: May 19, 2016Inventors: Andreas SCHEURLE, Guenther-Nino-Carlo Ulrich
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Patent number: 9309107Abstract: A micromechanical system is described having a substrate; a first micromechanical functional area, which is situated above the substrate; a second micromechanical functional area, which is situated above the first micromechanical functional area and is connected via a first weblike anchoring structure to the first micromechanical functional area; a third micromechanical functional area, which is situated above the second micromechanical functional area, and which has a first subarea and a second subarea; the first subarea being connected via a second weblike anchoring structure to the second micromechanical functional area; and the second subarea being mounted floating over the substrate by the first subarea. The invention also provides a method for manufacturing such a micromechanical system.Type: GrantFiled: March 29, 2012Date of Patent: April 12, 2016Assignee: ROBERT BOSCH GMBHInventors: Jochen Reinmuth, Andreas Scheurle, Christian Bierhoff
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Publication number: 20150233966Abstract: A rocker device for a micromechanical Z sensor includes: two trough-shaped rocker arms mountable around a torsion pivot, the rocker device being configured asymmetrically with respect to the torsion pivot; and for each rocker arm, a strike region having at least one first strike element is provided, the strike region on each rocker arm being configured in definedly elevated fashion relative to a sensing region of the rocker device.Type: ApplicationFiled: February 4, 2015Publication date: August 20, 2015Inventors: Andreas Scheurle, Guenther-Nino-Carlo Ullrich, Markus Heitz, Andrea ORTO