Patents by Inventor Andreas Scheurle

Andreas Scheurle has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11418885
    Abstract: A micromechanical component for a sensor device or microphone device. The component includes a diaphragm support structure with a diaphragm, a cavity formed in the diaphragm support structure and adjoined by a diaphragm inner side, and a separating trench structured through the surface of the diaphragm support structure and extends to the cavity and completely frames the diaphragm, and that is sealed off media-tight and/or air-tight using at least one separating trench closure material. An etching channel is formed in the diaphragm support structure, separately from the separating trench, and extends from its first etching channel end section to its second etching channel end section. The first etching channel end section opens into the cavity, and the second etching channel end section is sealed off media-tight and/or air-tight using at least one etching channel closure structure formed on an outer partial surface of the surface of the diaphragm support structure.
    Type: Grant
    Filed: January 12, 2021
    Date of Patent: August 16, 2022
    Assignee: Robert Bosch GmbH
    Inventors: Heribert Weber, Andreas Scheurle, Christoph Hermes, Peter Schmollngruber, Thomas Friedrich
  • Patent number: 11407635
    Abstract: A bonding pad layer system is deposited on a semiconductor chip as a base, for example, a micromechanical semiconductor chip, in which at least one self-supporting dielectric membrane made up of dielectric layers, a platinum conductor track and a heater made of platinum is integrated. In the process, the deposition of a tantalum layer takes place first, upon that the deposition of a first platinum layer, upon that the deposition of a tantalum nitride layer, upon that the deposition of a second platinum layer and upon that the deposition of a gold layer, at least one bonding pad for connecting with a bonding wire being formed in the gold layer. The bonding pad is situated in the area of the contact hole on the semiconductor chip, in which a platinum conductor track leading to the heater is connected using a ring contact and/or is connected outside this area.
    Type: Grant
    Filed: June 14, 2018
    Date of Patent: August 9, 2022
    Assignee: Robert Bosch GmbH
    Inventors: Andreas Scheurle, Bernd Klein, Heinz Nedelmann, Heribert Weber, Isolde Simon, Martin Lapisa, Melissa Delheusy, Michael Knauss, Raschid Baraki, Vitaliy Kondrashov
  • Publication number: 20220081285
    Abstract: A production method for a micromechanical component for a sensor or microphone device. The method includes: patterning a plurality of first trenches through a substrate surface of a monocrystalline substrate made of at least one semiconductor material using anisotropic etching, covering the lateral walls of the plurality of first trenches with a passivation layer, while bottom areas of the plurality of first trenches are kept free or are freed of the passivation layer, etching at least one first cavity, into which the plurality of first trenches opens, into the monocrystalline substrate using an isotropic etching method, in which an etching medium of the isotropic etching method is conducted through the plurality of first trenches, and by covering the plurality of first trenches by epitaxially growing a monocrystalline sealing layer on the substrate surface of the monocrystalline substrate made of the at least one identical semiconductor material as the monocrystalline substrate.
    Type: Application
    Filed: September 3, 2021
    Publication date: March 17, 2022
    Inventors: Heribert Weber, Peter Schmollngruber, Thomas Friedrich, Andreas Scheurle, Joachim Fritz, Sophielouise Mach
  • Publication number: 20210354978
    Abstract: A micromechanical component for a sensor or microphone device, including a substrate, a frame structure, which is situated on the substrate surface and/or at least one intermediate layer, and a diaphragm, which spans an inner volume, which is at least partially framed by the frame structure. The micromechanical component includes a bending beam structure, which is situated in the inner volume and includes at least one anchoring area, which is attached to the frame structure, to the substrate surface and/or to the at least one intermediate layer, and at least one self-supporting area, which is connected via at least one coupling structure to the diaphragm inner side of the diaphragm in such a way that the at least one self-supporting area is bendable by way of a warping of the diaphragm.
    Type: Application
    Filed: May 10, 2021
    Publication date: November 18, 2021
    Inventors: Heribert Weber, Andreas Scheurle, Joachim Fritz, Peter Schmollngruber, Sophielouise Mach, Thomas Friedrich
  • Publication number: 20210219058
    Abstract: A micromechanical component for a sensor device or microphone device. The component includes a diaphragm support structure with a diaphragm, a cavity formed in the diaphragm support structure and adjoined by a diaphragm inner side, and a separating trench structured through the surface of the diaphragm support structure and extends to the cavity and completely frames the diaphragm, and that is sealed off media-tight and/or air-tight using at least one separating trench closure material. An etching channel is formed in the diaphragm support structure, separately from the separating trench, and extends from its first etching channel end section to its second etching channel end section. The first etching channel end section opens into the cavity, and the second etching channel end section is sealed off media-tight and/or air-tight using at least one etching channel closure structure formed on an outer partial surface of the surface of the diaphragm support structure.
    Type: Application
    Filed: January 12, 2021
    Publication date: July 15, 2021
    Inventors: Heribert Weber, Andreas Scheurle, Christoph Hermes, Peter Schmollngruber, Thomas Friedrich
  • Publication number: 20200140261
    Abstract: A bonding pad layer system is deposited on a semiconductor chip as a base, for example, a micromechanical semiconductor chip, in which at least one self-supporting dielectric membrane made up of dielectric layers, a platinum conductor track and a heater made of platinum is integrated. In the process, the deposition of a tantalum layer takes place first, upon that the deposition of a first platinum layer, upon that the deposition of a tantalum nitride layer, upon that the deposition of a second platinum layer and upon that the deposition of a gold layer, at least one bonding pad for connecting with a bonding wire being formed in the gold layer. The bonding pad is situated in the area of the contact hole on the semiconductor chip, in which a platinum conductor track leading to the heater is connected using a ring contact and/or is connected outside this area.
    Type: Application
    Filed: June 14, 2018
    Publication date: May 7, 2020
    Applicants: Robert Bosch GmbH, Robert Bosch GmbH
    Inventors: Andreas Scheurle, Bernd Klein, Heinz Nedelmann, Heribert Weber, Isolde Simon, Martin Lapisa, Melissa Delheusy, Michael Knauss, Raschid Baraki, Vitaliy Kondrashov
  • Patent number: 10336610
    Abstract: A method for producing a micromechanical component is provided, In a preparatory step, a substrate device of the micromechanical component and/or a cap device of the micromechanical component is patterned. In a first sub-step, a first pressure and/or a first chemical composition being adjusted, and the substrate device and the cap device being connected to each other so that a first cavern is formed, sealed from an environment of the micromechanical component, the first pressure prevailing in the first cavity and/or the first chemical composition being enclosed. In a second sub-step, a second pressure and/or a second chemical composition being adjusted, and the substrate device and the cap device being connected to each other so that a second cavity is formed, sealed from the environment of the micromechanical component and from the first cavity, the second pressure prevailing in the second cavity and/or the second chemical composition being enclosed.
    Type: Grant
    Filed: October 23, 2017
    Date of Patent: July 2, 2019
    Assignee: ROBERT BOSCH GMBH
    Inventors: Heiko Stahl, Andreas Scheurle, Hendrik Specht, Marlene Winker, Ralf Hausner, Volker Schmitz
  • Patent number: 10018650
    Abstract: A rocker device for a micromechanical Z sensor includes: two trough-shaped rocker arms mountable around a torsion pivot, the rocker device being configured asymmetrically with respect to the torsion pivot; and for each rocker arm, a strike region having at least one first strike element is provided, the strike region on each rocker arm being configured in definedly elevated fashion relative to a sensing region of the rocker device.
    Type: Grant
    Filed: February 4, 2015
    Date of Patent: July 10, 2018
    Assignee: ROBERT BOSCH GMBH
    Inventors: Andreas Scheurle, Guenther-Nino-Carlo Ullrich, Markus Heitz, Andrea Orto
  • Patent number: 9970957
    Abstract: A rocker device for a micromechanical Z-sensor, including two rocker arms which are mounted around a torsion spring and which are asymmetric relative to the torsion spring; the rocker arms having first perforations; at least one of the rocker arms having at least one opening, a diameter of the first perforations being configured in a defined manner to be smaller than a diameter of the opening; and a cavity for connecting the first perforations to the at least one opening being formed in at least one of the rocker arms.
    Type: Grant
    Filed: October 28, 2015
    Date of Patent: May 15, 2018
    Assignee: ROBERT BOSCH GMBH
    Inventors: Andreas Scheurle, Guenther-Nino-Carlo Ulrich
  • Publication number: 20180111828
    Abstract: A method for producing a micromechanical component is provided, In a preparatory step, a substrate device of the micromechanical component and/or a cap device of the micromechanical component is patterned. In a first sub-step, a first pressure and/or a first chemical composition being adjusted, and the substrate device and the cap device being connected to each other so that a first cavern is formed, sealed from an environment of the micromechanical component, the first pressure prevailing in the first cavity and/or the first chemical composition being enclosed. In a second sub-step, a second pressure and/or a second chemical composition being adjusted, and the substrate device and the cap device being connected to each other so that a second cavity is formed, sealed from the environment of the micromechanical component and from the first cavity, the second pressure prevailing in the second cavity and/or the second chemical composition being enclosed.
    Type: Application
    Filed: October 23, 2017
    Publication date: April 26, 2018
    Inventors: Heiko Stahl, Andreas Scheurle, Hendrik Specht, Marlene Winker, Ralf Hausner, Volker Schmitz
  • Publication number: 20160139172
    Abstract: A rocker device for a micromechanical Z-sensor, including two rocker arms which are mounted around a torsion spring and which are asymmetric relative to the torsion spring; the rocker arms having first perforations; at least one of the rocker arms having at least one opening, a diameter of the first perforations being configured in a defined manner to be smaller than a diameter of the opening; and a cavity for connecting the first perforations to the at least one opening being formed in at least one of the rocker arms.
    Type: Application
    Filed: October 28, 2015
    Publication date: May 19, 2016
    Inventors: Andreas SCHEURLE, Guenther-Nino-Carlo Ulrich
  • Patent number: 9309107
    Abstract: A micromechanical system is described having a substrate; a first micromechanical functional area, which is situated above the substrate; a second micromechanical functional area, which is situated above the first micromechanical functional area and is connected via a first weblike anchoring structure to the first micromechanical functional area; a third micromechanical functional area, which is situated above the second micromechanical functional area, and which has a first subarea and a second subarea; the first subarea being connected via a second weblike anchoring structure to the second micromechanical functional area; and the second subarea being mounted floating over the substrate by the first subarea. The invention also provides a method for manufacturing such a micromechanical system.
    Type: Grant
    Filed: March 29, 2012
    Date of Patent: April 12, 2016
    Assignee: ROBERT BOSCH GMBH
    Inventors: Jochen Reinmuth, Andreas Scheurle, Christian Bierhoff
  • Publication number: 20150233966
    Abstract: A rocker device for a micromechanical Z sensor includes: two trough-shaped rocker arms mountable around a torsion pivot, the rocker device being configured asymmetrically with respect to the torsion pivot; and for each rocker arm, a strike region having at least one first strike element is provided, the strike region on each rocker arm being configured in definedly elevated fashion relative to a sensing region of the rocker device.
    Type: Application
    Filed: February 4, 2015
    Publication date: August 20, 2015
    Inventors: Andreas Scheurle, Guenther-Nino-Carlo Ullrich, Markus Heitz, Andrea ORTO
  • Patent number: 8928099
    Abstract: A method for manufacturing a micromechanical component is described in which a trench etching process and a sacrificial layer etching process are carried out to form a mass situated movably on a substrate. The movable mass has electrically isolated and mechanically coupled subsections of a functional layer. A micromechanical component having a mass situated movably on a substrate is also described.
    Type: Grant
    Filed: February 1, 2013
    Date of Patent: January 6, 2015
    Assignee: Robert Bosch GmbH
    Inventors: Johannes Classen, Jochen Reinmuth, Andreas Scheurle
  • Publication number: 20130200473
    Abstract: A method for manufacturing a micromechanical component is described in which a trench etching process and a sacrificial layer etching process are carried out to form a mass situated movably on a substrate. The movable mass has electrically isolated and mechanically coupled subsections of a functional layer. A micromechanical component having a mass situated movably on a substrate is also described.
    Type: Application
    Filed: February 1, 2013
    Publication date: August 8, 2013
    Applicant: Robert Bosch GmbH
    Inventors: Johannes CLASSEN, Jochen Reinmuth, Andreas Scheurle
  • Patent number: 8329555
    Abstract: A method for producing a capping wafer for a sensor having at least one cap includes: production of a contacting via extending through the wafer, and, temporally subsequent thereto, filling of the contacting via with an electrically conductive material.
    Type: Grant
    Filed: October 20, 2008
    Date of Patent: December 11, 2012
    Assignee: Robert Bosch GmbH
    Inventors: Frank Reichenbach, Franz Laermer, Silvia Kronmueller, Andreas Scheurle
  • Publication number: 20120251799
    Abstract: A micromechanical system is described having a substrate; a first micromechanical functional area, which is situated above the substrate; a second micromechanical functional area, which is situated above the first micromechanical functional area and is connected via a first weblike anchoring structure to the first micromechanical functional area; a third micromechanical functional area, which is situated above the second micromechanical functional area, and which has a first subarea and a second subarea; the first subarea being connected via a second weblike anchoring structure to the second micromechanical functional area; and the second subarea being mounted floating over the substrate by the first subarea. The invention also provides a method for manufacturing such a micromechanical system.
    Type: Application
    Filed: March 29, 2012
    Publication date: October 4, 2012
    Inventors: Jochen REINMUTH, Andreas SCHEURLE, Christian BIERHOFF
  • Publication number: 20110012248
    Abstract: A method for producing a capping wafer for a sensor having at least one cap includes: production of a contacting via extending through the wafer, and, temporally subsequent thereto, filling of the contacting via with an electrically conductive material.
    Type: Application
    Filed: October 20, 2008
    Publication date: January 20, 2011
    Inventors: Frank Reichenbach, Franz Laermer, Silvia Kronmueller, Andreas Scheurle
  • Publication number: 20100297781
    Abstract: A method for manufacturing MEMS structures having at least one functional layer of silicon that contains structures that are exposed by removing a sacrificial layer, at least one sacrificial layer and at least one functional layer being deposited such that they grow in a monocrystalline manner, and the sacrificial layer is made up of a silicon-germanium mixed layer.
    Type: Application
    Filed: May 23, 2007
    Publication date: November 25, 2010
    Applicant: ROBERT BOSCH GMBH
    Inventor: Andreas Scheurle
  • Publication number: 20080093690
    Abstract: A micromechanical component and a method for manufacturing such a component, the component having a micromechanical structure and an integrated circuit, the micromechanical structure being monolithically integrated into the circuit, the circuit being provided in a circuit area of the substrate, and the micromechanical structure being provided in a sensor area of the substrate, the material of the substrate being provided in the area of a sacrificial layer as well as in the area of a function layer without a transition.
    Type: Application
    Filed: October 10, 2007
    Publication date: April 24, 2008
    Inventors: Frank Reichenbach, Franz Laermer, Kersten Kehr, Axel Franke, Andreas Scheurle