Patents by Inventor Andreas Scheurle

Andreas Scheurle has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9309107
    Abstract: A micromechanical system is described having a substrate; a first micromechanical functional area, which is situated above the substrate; a second micromechanical functional area, which is situated above the first micromechanical functional area and is connected via a first weblike anchoring structure to the first micromechanical functional area; a third micromechanical functional area, which is situated above the second micromechanical functional area, and which has a first subarea and a second subarea; the first subarea being connected via a second weblike anchoring structure to the second micromechanical functional area; and the second subarea being mounted floating over the substrate by the first subarea. The invention also provides a method for manufacturing such a micromechanical system.
    Type: Grant
    Filed: March 29, 2012
    Date of Patent: April 12, 2016
    Assignee: ROBERT BOSCH GMBH
    Inventors: Jochen Reinmuth, Andreas Scheurle, Christian Bierhoff
  • Publication number: 20150233966
    Abstract: A rocker device for a micromechanical Z sensor includes: two trough-shaped rocker arms mountable around a torsion pivot, the rocker device being configured asymmetrically with respect to the torsion pivot; and for each rocker arm, a strike region having at least one first strike element is provided, the strike region on each rocker arm being configured in definedly elevated fashion relative to a sensing region of the rocker device.
    Type: Application
    Filed: February 4, 2015
    Publication date: August 20, 2015
    Inventors: Andreas Scheurle, Guenther-Nino-Carlo Ullrich, Markus Heitz, Andrea ORTO
  • Patent number: 8928099
    Abstract: A method for manufacturing a micromechanical component is described in which a trench etching process and a sacrificial layer etching process are carried out to form a mass situated movably on a substrate. The movable mass has electrically isolated and mechanically coupled subsections of a functional layer. A micromechanical component having a mass situated movably on a substrate is also described.
    Type: Grant
    Filed: February 1, 2013
    Date of Patent: January 6, 2015
    Assignee: Robert Bosch GmbH
    Inventors: Johannes Classen, Jochen Reinmuth, Andreas Scheurle
  • Publication number: 20130200473
    Abstract: A method for manufacturing a micromechanical component is described in which a trench etching process and a sacrificial layer etching process are carried out to form a mass situated movably on a substrate. The movable mass has electrically isolated and mechanically coupled subsections of a functional layer. A micromechanical component having a mass situated movably on a substrate is also described.
    Type: Application
    Filed: February 1, 2013
    Publication date: August 8, 2013
    Applicant: Robert Bosch GmbH
    Inventors: Johannes CLASSEN, Jochen Reinmuth, Andreas Scheurle
  • Patent number: 8329555
    Abstract: A method for producing a capping wafer for a sensor having at least one cap includes: production of a contacting via extending through the wafer, and, temporally subsequent thereto, filling of the contacting via with an electrically conductive material.
    Type: Grant
    Filed: October 20, 2008
    Date of Patent: December 11, 2012
    Assignee: Robert Bosch GmbH
    Inventors: Frank Reichenbach, Franz Laermer, Silvia Kronmueller, Andreas Scheurle
  • Publication number: 20110012248
    Abstract: A method for producing a capping wafer for a sensor having at least one cap includes: production of a contacting via extending through the wafer, and, temporally subsequent thereto, filling of the contacting via with an electrically conductive material.
    Type: Application
    Filed: October 20, 2008
    Publication date: January 20, 2011
    Inventors: Frank Reichenbach, Franz Laermer, Silvia Kronmueller, Andreas Scheurle
  • Publication number: 20100297781
    Abstract: A method for manufacturing MEMS structures having at least one functional layer of silicon that contains structures that are exposed by removing a sacrificial layer, at least one sacrificial layer and at least one functional layer being deposited such that they grow in a monocrystalline manner, and the sacrificial layer is made up of a silicon-germanium mixed layer.
    Type: Application
    Filed: May 23, 2007
    Publication date: November 25, 2010
    Applicant: ROBERT BOSCH GMBH
    Inventor: Andreas Scheurle
  • Publication number: 20080093690
    Abstract: A micromechanical component and a method for manufacturing such a component, the component having a micromechanical structure and an integrated circuit, the micromechanical structure being monolithically integrated into the circuit, the circuit being provided in a circuit area of the substrate, and the micromechanical structure being provided in a sensor area of the substrate, the material of the substrate being provided in the area of a sacrificial layer as well as in the area of a function layer without a transition.
    Type: Application
    Filed: October 10, 2007
    Publication date: April 24, 2008
    Inventors: Frank Reichenbach, Franz Laermer, Kersten Kehr, Axel Franke, Andreas Scheurle